ZHCSKG2B September   2016  – October 2019 DS280BR820

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics – Serial Management Bus Interface
    7. 6.7 Timing Requirements – Serial Management Bus Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Data Path Operation
      2. 7.3.2 AC-Coupled Receiver Inputs
      3. 7.3.3 Signal Detect
      4. 7.3.4 2-Stage CTLE
      5. 7.3.5 Driver DC Gain Control
      6. 7.3.6 FIR Filter (Limiting Mode)
      7. 7.3.7 Configurable SMBus Address
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Slave Mode Configuration
      2. 7.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 7.5 Programming
      1. 7.5.1 Transfer of Data with the SMBus Interface
    6. 7.6 Register Maps
      1. 7.6.1 Register Types: Global, Shared, and Channel
      2. 7.6.2 Global Registers: Channel Selection and ID Information
        1. Table 2. Global Register Map
      3. 7.6.3 Shared Registers
        1. Table 3. Shared Register Map
      4. 7.6.4 Channel Registers
        1. Table 4. Channel Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Backplane and Mid-Plane Reach Extension
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Front-Port Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Pattern Generator Characteristics
        2. 8.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 8.2.3.3 Equalizing High Pre-Channel Loss
        4. 8.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
        5. 8.2.3.5 Output in FIR Limiting Mode with 16T Pattern
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Stripline Example
      2. 10.2.2 Microstrip Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.2.2 Microstrip Example

The following example layout demonstrates how all signals can be escaped from the BGA array using microstrip routing on a generic 8+ layer stackup. This example layout assumes the following:

  • Normal trace width: 0.27 mm (10.5 mil)
  • Neck-down trace width: 0.18 mm (7 mil)
  • Trace edge-to-edge spacing: 0.51 mm (20 mil)
  • VIA finished hole size (diameter): 0.203 mm (8 mil)
  • VIA-to-VIA spacing: 0.8 mm (31.5 mil)
  • No VIA-in-pad used

Note that many other escape routing options exist using different trace width and spacing combinations. The optimum trace width and spacing will depend on the PCB material, PCB routing density, and other factors. Stripline escape routing is also possible and may be preferable in some application scenarios such as backplane applications.

DS280BR820 Mstrip_top.gifFigure 35. Microstrip Example, Top Layer
DS280BR820 Mstrip_sig2.gifFigure 37. Microstrip Example, Internal Signal Layer 2
DS280BR820 Mstrip_sig1.gifFigure 36. Microstrip Example, Internal Signal Layer 1
DS280BR820 Mstrip_bot.gifFigure 38. Microstrip Example, Bottom Layer