ZHCSCR3C October   2012  – August 2014 DS125BR111

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics — Serial Management Bus Interface
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Functional Datapath Blocks
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBus Mode
      3. 8.4.3 Signal Conditioning Settings
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 Transfer Of Data Via The SMBus
      2. 8.6.2 SMBus Transactions
      3. 8.6.3 Writing a Register
      4. 8.6.4 Reading a Register
      5. 8.6.5 SMBus Register Information
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Signal Integrity
      2. 9.1.2 RX-Detect in SAS/SATA Applications
      3. 9.1.3 PCIe Applications
        1. 9.1.3.1 RXDET When Using SMBus Modes
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from B Revision (July 2014) to C Revision

  • Changed 已将数据表流程和版面布局更改为符合全新的 TI 标准。 添加了以下章节:应用和实施;电源相关建议;布局;器件和文档支持;机械、封装和订购信息Go

Changes from A Revision (January 2014) to B Revision

  • Changed 特性Go

Changes from * Revision (April 2013) to A Revision

  • Changed 已将国标数据表格式改为 TI 格式Go