ZHCSBL1B September   2013  – October 2014 DRV8816

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bridge Control
      2. 8.3.2 Charge Pump
      3. 8.3.3 VPROPI
      4. 8.3.4 Protection Circuits
        1. 8.3.4.1 VBB UVLO
        2. 8.3.4.2 VCP UVLO (CPUV)
        3. 8.3.4.3 OCP
        4. 8.3.4.4 OTW
        5. 8.3.4.5 OTS
    4. 8.4 Device Functional Modes
      1. 8.4.1 SENSE
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Motor Voltage
        2. 9.2.2.2 Power Dissipation
        3. 9.2.2.3 Motor Current Trip Point
        4. 9.2.2.4 Sense Resistor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supervisor
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground
    2. 11.2 Layout Example
    3. 11.3 Thermal Protection
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

The printed circuit board (PCB) should use a heavy ground plane. For optimum electrical and thermal performance, the DRV8816 must be soldered directly onto the board. On the underside of the DRV8816 is a thermal pad, which provides a path for enhanced thermal dissipation. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of the PCB.

The load supply pin, VBB, should be decoupled with an electrolytic capacitor (typically 100 μF) in parallel with a ceramic capacitor placed as close as possible to the device. The ceramic capacitors between VCP and VBB, connected to VREG, and between CP1 and CP2 should be as close to the pins of the device as possible, in order to minimize lead inductance.

Equation 4. eq_lrs063.gif

where

  • PTOT is the total power dissipation.
  • RDS(ON) is the resistance of the HS plus LS FETS.
  • IOUT(RMS) is the RMS output current being applied to each winding.

The voltage rating for bulk capacitors should be higher than the operating voltage, to provide margin for cases when the motor transfers energy to the supply.

IOUT(RMS) is equal to approximately 0.7× the full-scale output current setting.

The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking.

Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases.

11.1.1 Ground

A ground power plane should be located as close to DRV8816 as possible. The copper ground plane directly under the thermal pad makes a good location. This pad can then be connected to ground for this purpose.

11.2 Layout Example

layout.gif

11.3 Thermal Protection

If the die temperature exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.