ZHCSE66D
May 2015 – May 2017
DLP7000UV
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
修订历史记录
5
说明 (续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Storage Conditions
7.3
ESD Ratings
7.4
Recommended Operating Conditions
7.5
Thermal Information
7.6
Electrical Characteristics
7.7
LVDS Timing Requirements
7.8
LVDS Waveform Requirements
7.9
Serial Control Bus Timing Requirements
7.10
Systems Mounting Interface Loads
7.11
Micromirror Array Physical Characteristics
7.12
Micromirror Array Optical Characteristics
7.13
Window Characteristics
7.14
Chipset Component Usage Specification
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
8.3.2
DLPA200 DMD Micromirror Driver
8.3.3
DLPR410 - PROM for DLP Discovery 4100 Chipset
8.3.4
DLP7000 - DLP 0.7 XGA 2xLVDS UV Type-A DMD
8.3.4.1
DLP7000UV Chipset Interfaces
8.3.4.1.1
DLPC410 Interface Description
8.3.4.1.1.1
DLPC410 IO
8.3.4.1.1.2
Initialization
8.3.4.1.1.3
DMD Device Detection
8.3.4.1.1.4
Power Down
8.3.4.2
DLPC410 to DMD Interface
8.3.4.2.1
DLPC410 to DMD IO Description
8.3.4.2.2
Data Flow
8.3.4.3
DLPC410 to DLPA200 Interface
8.3.4.3.1
DLPA200 Operation
8.3.4.3.2
DLPC410 to DLPA200 IO Description
8.3.4.4
DLPA200 to DLP7000UV Interface Overview
8.3.5
Measurement Conditions
8.4
Device Functional Modes
8.4.1
DMD Operation
8.4.1.1
Single Block Mode
8.4.1.2
Dual Block Mode
8.4.1.3
Quad Block Mode
8.4.1.4
Global Mode
8.5
Window Characteristics and Optics
8.5.1
Optical Interface and System Image Quality
8.5.2
Numerical Aperture and Stray Light Control
8.5.3
Pupil Match
8.5.4
Illumination Overfill
8.6
Micromirror Array Temperature Calculation
8.6.1
Package Thermal Resistance
8.6.2
Case Temperature
8.6.3
Micromirror Array Temperature Calculation
8.7
Micromirror Landed-On/Landed-Off Duty Cycle
8.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
8.7.2
Landed Duty Cycle and Useful Life of the DMD
8.7.3
Landed Duty Cycle and Operational DMD Temperature
8.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
9
Application and Implementation
9.1
Application Information
9.1.1
DMD Reflectivity Characteristics
9.1.2
Design Considerations Influencing DMD Reflectivity
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
10.1
Power-Up Sequence (Handled by the DLPC410)
11
Layout
11.1
Layout Guidelines
11.1.1
Impedance Requirements
11.1.2
PCB Signal Routing
11.1.3
Fiducials
11.1.4
PCB Layout Guidelines
11.1.4.1
DMD Interface
11.1.4.1.1
Trace Length Matching
11.1.4.2
DLP7000UV Decoupling
11.1.4.2.1
Decoupling Capacitors
11.1.4.3
VCC and VCC2
11.1.4.4
DMD Layout
11.1.4.5
DLPA200
11.2
Layout Example
12
器件和文档支持
12.1
器件支持
12.1.1
器件命名规则
12.1.1.1
器件标记
12.2
文档支持
12.2.1
相关文档
12.3
相关链接
12.4
社区资源
12.5
商标
12.6
静电放电警告
12.7
Glossary
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
FLP|203
MCLC005B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcse66d_oa