ZHCSRE5A
December 2022 – February 2024
DLP4621-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Storage Conditions
5.3
ESD Ratings
5.4
Recommended Operating Conditions
5.4.1
Illumination Overfill Diagram
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Timing Requirements
Electrical and Timing Diagrams
5.8
Switching Characteristics
5.8.1
LPSDR and Test Load Circuit Diagrams
5.9
System Mounting Interface Loads
System Interface Loads Diagram
5.10
Micromirror Array Physical Characteristics
5.10.1
Micromirror Array Physical Characteristics Diagram
5.11
Micromirror Array Optical Characteristics
5.12
Window Characteristics
5.13
Chipset Component Usage Specification
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
SubLVDS Data Interface
6.3.2
Low Speed Interface for Control
6.3.3
DMD Voltage Supplies
6.3.4
Asynchronous Reset
6.3.5
Temperature Sensing Diode
6.3.5.1
Temperature Sense Diode Theory
6.4
System Optical Considerations
6.4.1
Numerical Aperture and Stray Light Control
6.4.2
Pupil Match
6.4.3
Illumination Overfill
6.5
DMD Image Performance Specification
6.6
Micromirror Array Temperature Calculation
6.6.1
Monitoring Array Temperature Using the Temperature Sense Diode
6.7
Micromirror Landed-On/Landed-Off Duty Cycle
6.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Application Overview
7.2.2
Input Image Resolution
7.2.3
Reference Design
7.2.4
Application Mission Profile Consideration
7.3
Power Supply Recommendations
7.3.1
Power Supply Power-Up Procedure
7.3.2
Power Supply Power-Down Procedure
7.3.3
Power Supply Sequencing Requirements
7.4
Layout Guidelines
7.5
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Device Nomenclature
8.1.2
Device Markings
8.2
第三方产品免责声明
8.3
接收文档更新通知
8.4
支持资源
8.5
Trademarks
8.6
静电放电警告
8.7
DMD Handling
8.8
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQX|120
MCLG047B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsre5a_oa
zhcsre5a_pm
8.8
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。