ZHCSEW3C
April 2016 – February 2022
CSD17382F4
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Specifications
5.1
Electrical Characteristics
5.2
Thermal Information
5.3
Typical MOSFET Characteristics
6
Device and Documentation Support
6.1
支持资源
6.2
Receiving Notification of Documentation Updates
6.3
Trademarks
6.4
Electrostatic Discharge Caution
6.5
术语表
7
Mechanical, Packaging, and Orderable Information
7.1
Mechanical Dimensions
7.2
Recommended Minimum PCB Layout
7.3
Recommended Stencil Pattern
7.4
CSD17382F4 Embossed Carrier Tape Dimensions
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
YJC|3
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsew3c_oa
5
Specifications