ZHCSAN0C November   2012  – January 2015 CSD16556Q5B

PRODUCTION DATA.  

  1. 1特性
  2. 2应用范围
  3. 3说明
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 商标
    2. 6.2 静电放电警告
    3. 6.3 术语表
  7. 7机械、封装和可订购信息
    1. 7.1 Q5B 封装尺寸
    2. 7.2 建议 PCB 布局
    3. 7.3 建议模板布局
    4. 7.4 Q5B 卷带信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DNK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Specifications

5.1 Electrical Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC CHARACTERISTICS
BVDSS Drain-to-Source Voltage VGS = 0 V, IDS = 250 μA 25 V
IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 24 V 1 μA
IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 20 V 100 nA
VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, IDS = 250 μA 1.2 1.4 1.7 V
RDS(on) Drain-to-Source On-Resistance VGS = 4.5 V, IDS = 30 A 1.2 1.5 mΩ
VGS = 10 V, IDS = 30 A 0.9 1.07 mΩ
gƒs Transconductance VDS = 15 V, IDS = 30 A 191 S
DYNAMIC CHARACTERISTICS
Ciss Input Capacitance VGS = 0 V, VDS = 15 V,
ƒ = 1MHz		 4750 6180 pF
Coss Output Capacitance 2270 2950 pF
Crss Reverse Transfer Capacitance 220 280 pF
RG Series Gate Resistance 0.7 1.4 Ω
Qg Gate Charge Total (4.5 V) VDS = 15 V, IDS = 30 A 36 47 nC
Qgd Gate Charge Gate-to-Drain 12 nC
Qgs Gate Charge Gate-to-Source 11 nC
Qg(th) Gate Charge at Vth 7 nC
Qoss Output Charge VDS = 15 V, VGS = 0 V 45 nC
td(on) Turn On Delay Time VDS = 15 V, VGS = 4.5 V,
IDS = 30 A,RG = 2 Ω		 17 ns
tr Rise Time 34 ns
td(off) Turn Off Delay Time 25 ns
tƒ Fall Time 13 ns
DIODE CHARACTERISTICS
VSD Diode Forward Voltage ISD = 30 A, VGS = 0 V 0.8 1 V
Qrr Reverse Recovery Charge VDD= 15 V, IF = 30 A, di/dt = 300 A/μs 84 nC
trr Reverse Recovery Time 41 ns

5.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Junction-to-Case Thermal Resistance(1) 1.3 °C/W
RθJA Junction-to-Ambient Thermal Resistance(1)(2) 50
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inches × 1.5-inches
(3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
CSD16556Q5B M0137-01_LPS198.gif
 Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of
2-oz. (0.071-mm thick) Cu.
CSD16556Q5B M0137-02_LPS198.gif
 Max RθJA = 125°C/W when mounted on a minimum pad area of 2-oz.
(0.071-mm thick) Cu.

5.3 Typical MOSFET Characteristics

(TA = 25°C unless otherwise stated)
CSD16556Q5B graph01_SLPS392B.png
Figure 1. Transient Thermal Impedance
CSD16556Q5B graph02_SLPS431.png
Figure 2. Saturation Characteristics
CSD16556Q5B graph04_SLPS431.png
Figure 4. Gate Charge
CSD16556Q5B graph06_SLPS431.png
Figure 6. Threshold Voltage vs Temperature
CSD16556Q5B graph08_SLPS431.png
Figure 8. Normalized On-State Resistance vs Temperature
CSD16556Q5B graph10_SLPS432C.png
Figure 10. Maximum Safe Operating Area (SOA)
CSD16556Q5B graph12_SLPS431.png
Figure 12. Maximum Drain Current vs Temperature
CSD16556Q5B graph03_SLPS431.png
Figure 3. Transfer Characteristics
CSD16556Q5B graph05_SLPS431.png
Figure 5. Capacitance
CSD16556Q5B graph07_SLPS431.png
Figure 7. On-State Resistance vs Gate-to-Source Voltage
CSD16556Q5B graph09_SLPS431.png
Figure 9. Typical Diode Forward Voltage
CSD16556Q5B graph11_SLPS431.png
Figure 11. Single Pulse Unclamped Inductive Switching