SCAS841D February   2007  – December 2016 CDCLVD110A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: LVDS
    7. 6.7 Jitter Characteristics
    8. 6.8 Control Register Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Information
      2. 8.4.2 LVDS Receiver Input Termination
      3. 8.4.3 Input Termination
      4. 8.4.4 LVDS Output Termination
      5. 8.4.5 Control Inputs Termination
    5. 8.5 Programming
      1. 8.5.1 Specification of Control Register
        1. 8.5.1.1 Programmable Mode (EN = 1)
        2. 8.5.1.2 Standard Mode (EN = 0)
    6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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4 Revision History

Changes from C Revision (October 2008) to D Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Added Thermal Information tableGo
  • Added Thermal Considerations sectionGo

Changes from B Revision (October 2008) to C Revision

  • Added PowerPAD information to the Pinout PackageGo
  • Added PowerPAD information to the PIN FUNCTIONS tableGo

Changes from A Revision (January 2008) to B Revision

  • Changed Feature From: Available in 32-Pin LQFP Package To: Available in 32-Pin LQFP and QFN PackageGo
  • Added ApplicationsGo

Changes from * Revision (February 2007) to A Revision

  • Changed Pinout Package title From: TQFP PACKAGE and QFN PACKAGE To: LQFP PACKAGE and QFN PACKAGEGo