ZHCSPB2J November   1998  – November 2021 CD54HC138 , CD54HC238 , CD54HCT138 , CD54HCT238 , CD74HC138 , CD74HC238 , CD74HCT138 , CD74HCT238

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
    1.     5
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics (2)
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC CD74HC(T)138, CD74HC(T)238 UNIT
N

(PDIP)

 D

(SOIC)

 NS

(SOP)

 PW

(TSSOP)
16 Pins 16 Pins 16 Pins 16 Pins
RθJA Junction-to-ambient thermal resistance(1) 67 73 64 108 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.