ZHCSFW7C december   2016  – september 2020 CC2640R2F

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
    5. 7.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package
    6. 7.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package
    7. 7.7 Pin Diagram – RSM Package
    8. 7.8 Signal Descriptions – RSM Package
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Continuous Time Comparator
    22. 8.22 Low-Power Clocked Comparator
    23. 8.23 Programmable Current Source
    24. 8.24 Synchronous Serial Interface (SSI)
    25. 8.25 DC Characteristics
    26. 8.26 Thermal Resistance Characteristics
    27. 8.27 Timing Requirements
    28. 8.28 Switching Characteristics
    29. 8.29 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Sensor Controller
    6. 9.6  Memory
    7. 9.7  Debug
    8. 9.8  Power Management
    9. 9.9  Clock Systems
    10. 9.10 General Peripherals and Modules
    11. 9.11 Voltage Supply Domains
    12. 9.12 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
    3. 10.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 10.3.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  Texas Instruments Low-Power RF Website
    5. 11.5  Low-Power RF eNewsletter
    6. 11.6  支持资源
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RGZ|48
  • RHB|32
  • YFV|34
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Application Information

Very few external components are required for the operation of the CC2640R2F device. This section provides some general information about the various configuration options when using the CC2640R2F in an application, and then shows two examples of application circuits with schematics and layout. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.

Figure 10-1 shows the various RF front-end configuration options. The RF front end can be used in differential- or single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.

GUID-23937A1E-69C7-4E5D-9392-E35D476662EF-low.gifFigure 10-1 CC2640R2F Application Circuit

Figure 10-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 11.3).

GUID-6821440D-0153-44B6-8273-852329F4EC58-low.gifFigure 10-2 Supply Voltage Configurations