ZHCSAD4A October   2012  – December 2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Power Up
        1. 8.3.1.1 Power-On-Reset (POR)
        2. 8.3.1.2 Power Up from Battery without DC Source
          1. 8.3.1.2.1 BATFET Turn Off
          2. 8.3.1.2.2 Shipping Mode
        3. 8.3.1.3 Power Up from DC Source
          1. 8.3.1.3.1 REGN LDO
          2. 8.3.1.3.2 Input Source Qualification
          3. 8.3.1.3.3 Input Current Limit Detection
          4. 8.3.1.3.4 D+/D- Detection Sets Input Current Limit
          5. 8.3.1.3.5 HIZ State wth 100mA USB Host
          6. 8.3.1.3.6 Force Input Current Limit Detection
        4. 8.3.1.4 Converter Power-Up
        5. 8.3.1.5 Boost Mode Operation from Battery
      2. 8.3.2 Power Path Management
        1. 8.3.2.1 Narrow VDC Architecture
        2. 8.3.2.2 Dynamic Power Management
        3. 8.3.2.3 Supplement Mode
      3. 8.3.3 Battery Charging Management
        1. 8.3.3.1 Autonomous Charging Cycle
        2. 8.3.3.2 Battery Charging Profile
        3. 8.3.3.3 Thermistor Cold/Hot Temperature Window
        4. 8.3.3.4 Charging Termination
          1. 8.3.3.4.1 Termination when REG02[0] = 1
          2. 8.3.3.4.2 Termination when REG05[6] = 1
        5. 8.3.3.5 Charging Safety Timer
        6. 8.3.3.6 USB Timer when Charging from USB100mA Source
      4. 8.3.4 Status Outputs (STAT and INT)
        1. 8.3.4.1 Charging Status Indicator (STAT)
        2. 8.3.4.2 Interrupt to Host (INT)
      5. 8.3.5 Protections
        1. 8.3.5.1 Input Current Limit on ILIM
        2. 8.3.5.2 Thermal Regulation and Thermal Shutdown
        3. 8.3.5.3 Voltage and Current Monitoring in Buck Mode
          1. 8.3.5.3.1 Input Over-Voltage (ACOV)
          2. 8.3.5.3.2 System Over-Voltage Protection (SYSOVP)
        4. 8.3.5.4 Current Monitoring in Boost Mode
        5. 8.3.5.5 Battery Protection
          1. 8.3.5.5.1 Battery Over-Current Protection (BATOVP)
          2. 8.3.5.5.2 Charging During Battery Short Protection
          3. 8.3.5.5.3 System Over-Current Protection
      6. 8.3.6 Serial Interface
        1. 8.3.6.1 Data Validity
        2. 8.3.6.2 START and STOP Conditions
        3. 8.3.6.3 Byte Format
        4. 8.3.6.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.3.6.5 Slave Address and Data Direction Bit
          1. 8.3.6.5.1 Single Read and Write
          2. 8.3.6.5.2 Multi-Read and Multi-Write
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
        1. 8.4.1.1 Plug in USB100mA Source with Good Battery
        2. 8.4.1.2 USB Timer when Charging from USB 100-mA Source
    5. 8.5 Register Map
      1. 8.5.1 I2C Registers
        1. 8.5.1.1  Input Source Control Register REG00 (reset = 00110000, or 30)
        2. 8.5.1.2  Power-On Configuration Register REG01 (reset = 00011011, or 1B)
        3. 8.5.1.3  Charge Current Control Register REG02 (reset = 01100000, or 60)
        4. 8.5.1.4  Pre-Charge/Termination Current Control Register REG03 (reset = 00010001, or 11)
        5. 8.5.1.5  Charge Voltage Control Register REG04 (reset = 10110010, or B2)
        6. 8.5.1.6  Charge Termination/Timer Control Register REG05 (reset = 10011010, or 9A)
        7. 8.5.1.7  Thermal Regulation Control Register REG06 (reset = 00000011, or 03)
        8. 8.5.1.8  Misc Operation Control Register REG07 (reset = 01001011, or 4B)
        9. 8.5.1.9  System Status Register REG08
        10. 8.5.1.10 Fault Register REG09
        11. 8.5.1.11 Vender / Part / Revision Status Register REG0A (reset = 00100011, or 23)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 文档支持

12.1.1 相关文档

《bq24195/L EVM (PWR021) 用户指南》（文献编号：SLUUA18）

《四方扁平无引线逻辑器件封装应用报告》(SCBA017)

《QFN/SON PCB 连接应用报告》(SLUA271)

12.2 相关链接

以下表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，并且可以快速访问样片或购买链接。

Table 19. 相关链接

器件 产品文件夹 样片与购买 技术文档 工具与软件 支持与社区
bq24195 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
bq24195L 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

12.3 商标

All trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.5 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。