ZHCSKT7D
February 2020 – February 2024
AWR2243
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
功能方框图
5
Device Comparison
5.1
Related Products
6
Terminal Configuration and Functions
6.1
Pin Diagram
6.2
Signal Descriptions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Power-On Hours (POH)
7.4
Recommended Operating Conditions
7.5
Power Supply Specifications
7.6
Power Consumption Summary
7.7
RF Specification
7.8
Thermal Resistance Characteristics for FCBGA Package [ABL0161]
7.9
Timing and Switching Characteristics
7.9.1
Power Supply Sequencing and Reset Timing
7.9.2
Synchronized Frame Triggering
7.9.3
Input Clocks and Oscillators
7.9.3.1
Clock Specifications
7.9.4
Multibuffered / Standard Serial Peripheral Interface (MibSPI)
7.9.4.1
Peripheral Description
7.9.4.1.1
SPI Timing Conditions
7.9.4.1.2
SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
7.9.4.1.3
SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
7.9.4.2
Typical Interface Protocol Diagram (Peripheral Mode)
7.9.5
Inter-Integrated Circuit Interface (I2C)
7.9.5.1
I2C Timing Requirements
7.9.6
LVDS Interface Configuration
7.9.6.1
LVDS Interface Timings
7.9.7
General-Purpose Input/Output
7.9.7.1
Switching Characteristics for Output Timing versus Load Capacitance (CL)
7.9.8
Camera Serial Interface (CSI)
7.9.8.1
CSI Switching Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Subsystems
8.3.1
RF and Analog Subsystem
8.3.1.1
Clock Subsystem
8.3.1.2
Transmit Subsystem
8.3.1.3
Receive Subsystem
8.3.2
Host Interface
8.4
Other Subsystems
8.4.1
ADC Data Format Over CSI2 Interface
8.4.2
ADC Channels (Service) for User Application
8.4.2.1
GPADC Parameters
9
Monitoring and Diagnostic Mechanisms
10
Applications, Implementation, and Layout
10.1
Application Information
10.2
Short-, Medium-, and Long-Range Radar
10.3
Imaging Radar using Cascade Configuration
10.4
Reference Schematic
11
Device and Documentation Support
11.1
Device Nomenclature
11.2
Tools and Software
11.3
Documentation Support
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
Export Control Notice
11.8
术语表
12
Revision History
13
Mechanical, Packaging, and Orderable Information
13.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
ABL|161
MPBGAL4B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcskt7d_oa
zhcskt7d_pm
11.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。