ZHCSIF3D June   2018  – June 2021 AMC1302

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specification
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Sizing
        2. 8.2.2.2 Input Filter Design
        3. 8.2.2.3 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (October 2019) to Revision D (June 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式 Go
  • Changed CIO from ~1 pF to ~1.5 pFGo
  • Changed VOS from –100 µV / ±10 µV / 100 µV to –50 µV / ±2.5 µV / 50 µV (min / typ / max )Go
  • Changed EG from –0.3% / ±0.05% / 0.3%  to –0.2% / ±0.04% / 0.2% (min / typ / max) Go
  • Changed TCEG from –50 ppm/℃ / ±15 ppm/℃ / 50 ppm/℃ to –35 ppm/℃ / ±3 ppm/℃ / 35 ppm/℃ (min / typ / max) Go
  • Changed VFailsafe from –2.6 V / –2.5 V (typ / max) to –2.63 V / –2.57 V / –2.53 V (min / typ / max)Go
  • Changed CMTI from 55 kV/µs / 80 kV/µs to 100 kV/µs / 150 kV/µs (min / typ) Go
  • Changed VDD1POR from 1.75 V / 2.15 V / 2.7 V to 2.4 V / 2.6 V / 2.8 V (min / typ / max)Go
  • Changed Rise, Fall, and Delay Time Waveforms imageGo

Changes from Revision B (November 2018) to Revision C (October 2019)

  • 将安全相关认证 特性项目符号中的 VDE 认证从“DIN V VDE V 0884-11 (VDE V 0884-11)”更改为 DIN VDE V 0884-11 Go