ZHCSLA7C December   2019  – September 2023 AM6526 , AM6528 , AM6546 , AM6548

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
      2. 5.3.2  CAL
        1. 5.3.2.1 MAIN Domain
      3. 5.3.3  CPSW2G
        1. 5.3.3.1 MCU Domain
      4. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
        2. 5.3.4.2 DDRSS Mapping
      5. 5.3.5  DMTIMER
        1. 5.3.5.1 MAIN Domain
        2. 5.3.5.2 MCU Domain
      6. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
      7. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
      8. 5.3.8  EHRPWM
        1. 5.3.8.1 MAIN Domain
      9. 5.3.9  EQEP
        1. 5.3.9.1 MAIN Domain
      10. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
        2. 5.3.10.2 WKUP Domain
      11. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
      12. 5.3.12 HyperBus
        1. 5.3.12.1 MCU Domain
      13. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
        2. 5.3.13.2 MCU Domain
        3. 5.3.13.3 WKUP Domain
      14. 5.3.14 MCAN
        1. 5.3.14.1 MCU Domain
      15. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
      16. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
        2. 5.3.16.2 MCU Domain
      17. 5.3.17 MMCSD
        1. 5.3.17.1 MAIN Domain
      18. 5.3.18 CPTS
        1. 5.3.18.1 MCU Domain
        2. 5.3.18.2 MAIN Domain
      19. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
      20. 5.3.20 OSPI
        1. 5.3.20.1 MCU Domain
      21. 5.3.21 PRU_ICSSG
        1. 5.3.21.1 MAIN Domain
      22. 5.3.22 SERDES
        1. 5.3.22.1 MAIN Domain
      23. 5.3.23 UART
        1. 5.3.23.1 MAIN Domain
        2. 5.3.23.2 MCU Domain
        3. 5.3.23.3 WKUP Domain
      24. 5.3.24 USB
        1. 5.3.24.1 MAIN Domain
      25. 5.3.25 Emulation and Debug
        1. 5.3.25.1 MAIN Domain
      26. 5.3.26 System and Miscellaneous
        1. 5.3.26.1 Boot Mode Configuration
          1. 5.3.26.1.1 MAIN Domain
          2. 5.3.26.1.2 MCU Domain
        2. 5.3.26.2 Clock
          1. 5.3.26.2.1 MAIN Domain
          2. 5.3.26.2.2 WKUP Domain
        3. 5.3.26.3 System
          1. 5.3.26.3.1 MAIN Domain
          2. 5.3.26.3.2 WKUP Domain
        4. 5.3.26.4 Miscellaneous
          1. 5.3.26.4.1 WKUP Domain
        5. 5.3.26.5 EFUSE
          1. 5.3.26.5.1 MAIN Domain
          2. 5.3.26.5.2 MCU Domain
      27. 5.3.27 Power Supply
    4. 5.4 Pin Multiplexing
    5. 5.5 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Power-On Hours (POH)
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
      1. 6.5.1 Voltage and Core Clock Specifications
    6. 6.6 Electrical Characteristics
      1. 6.6.1 I2C OPEN DRAIN DC Electrical Characteristics
      2. 6.6.2 Analog OSC Buffers DC Electrical Characteristics
      3. 6.6.3 Analog ADC DC Electrical Characteristics
      4. 6.6.4 DPHY CSI2 Buffers DC Electrical Characteristics
      5. 6.6.5 OLDI LVDS Buffers DC Electrical Characteristics
        1. 6.6.5.1 LVCMOS Buffers DC Electrical Characteristics
      6. 6.6.6 USBHS Buffers DC Electrical Characteristics
      7. 6.6.7 SERDES Buffers DC Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Sequencing
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 VDDA_1P8_SERDES0 Supply Slew Rate Requirement
        3. 6.9.2.3 Power-Up Sequencing
        4. 6.9.2.4 Power-Down Sequencing
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Electrical Data/Timing
        2. 6.9.3.2 Safety Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input Clocks / Oscillators
          1. 6.9.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
          2. 6.9.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
          4. 6.9.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 Auxiliary OSC1 Not Used
          6. 6.9.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
          7. 6.9.4.1.7 WKUP_LFOSC0 LVCMOS Digital Clock Source
          8. 6.9.4.1.8 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Recommended Clock and Control Signal Transition Behavior
        5. 6.9.4.5 Module and Peripheral Clock Frequencies
      5. 6.9.5 Peripherals
        1. 6.9.5.1  VIN
        2. 6.9.5.2  CPSW2G
          1. 6.9.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.9.5.2.2 CPSW2G RMII Timings
            1. 6.9.5.2.2.1 Timing Requirements for RMII[x]_REFCLK - RMII Mode
            2. 6.9.5.2.2.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode
            3. 6.9.5.2.2.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode
          3. 6.9.5.2.3 CPSW2G RGMII Timings
            1. 6.9.5.2.3.1 Timing Requirements for RGMII[x]_RCLK - RGMII Mode
            2. 6.9.5.2.3.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode
            3. 6.9.5.2.3.3 Switching Characteristics for RGMII[x]_TCLK - RGMII Mode
            4. 6.9.5.2.3.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL - RGMII Mode
        3. 6.9.5.3  CSI2
        4. 6.9.5.4  DDRSS
        5. 6.9.5.5  DSS
        6. 6.9.5.6  eCAP
          1. 6.9.5.6.1 eCAP Timing Requirements
          2. 6.9.5.6.2 eCAP Switching Characteristics
        7. 6.9.5.7  ePWM
          1. 6.9.5.7.1 ePWM Timing Requirements
          2. 6.9.5.7.2 ePWM Switching Characteristics
        8. 6.9.5.8  eQEP
          1. 6.9.5.8.1 eQEP Timing Requirements
          2. 6.9.5.8.2 eQEP Switching Characteristics
        9. 6.9.5.9  GPIO
          1. 6.9.5.9.1 GPIO Timing Requirements
          2. 6.9.5.9.2 GPIO Switching Characteristics
        10. 6.9.5.10 GPMC
          1. 6.9.5.10.1 GPMC and NOR Flash—Synchronous Mode
            1. 6.9.5.10.1.1 GPMC and NOR Flash Timing Requirements—Synchronous Mode
            2. 6.9.5.10.1.2 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
          2. 6.9.5.10.2 GPMC and NOR Flash—Asynchronous Mode
            1. 6.9.5.10.2.1 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
            2. 6.9.5.10.2.2 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
          3. 6.9.5.10.3 GPMC and NAND Flash—Asynchronous Mode
            1. 6.9.5.10.3.1 GPMC and NAND Flash Timing Requirements—Asynchronous Mode
            2. 6.9.5.10.3.2 GPMC and NAND Flash Switching Characteristics—Asynchronous Mode
        11. 6.9.5.11 HyperBus
          1. 6.9.5.11.1 Timing Requirements for HyperBus Initialization
          2. 6.9.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.9.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.9.5.12 I2C
        13. 6.9.5.13 MCAN
        14. 6.9.5.14 MCASP
          1. 6.9.5.14.1 MCASP Timing Requirements and Switching Characteristics
        15. 6.9.5.15 MCSPI
          1. 6.9.5.15.1 SPI—Master Mode
          2. 6.9.5.15.2 SPI—Slave Mode
        16. 6.9.5.16 MMCSD
          1. 6.9.5.16.1 MMCSDi — eMMC/SD/SDIO Card Interface
            1. 6.9.5.16.1.1 Default Speed, 3.3V Legacy SDR Mode
            2. 6.9.5.16.1.2 High Speed, 3.3V High Speed SDR Mode
            3. 6.9.5.16.1.3 UHS-I SDR12, 1.8-V Legacy SDR Mode
            4. 6.9.5.16.1.4 UHS-I SDR25 Mode
            5. 6.9.5.16.1.5 UHS-I DDR50 Mode
            6. 6.9.5.16.1.6 UHS-I SDR50 Mode
            7. 6.9.5.16.1.7 UHS-I SDR104 / HS200 Mode
        17. 6.9.5.17 CPTS
          1. 6.9.5.17.1 CPTS Timing Requirements
          2. 6.9.5.17.2 CPTS Switching Characteristics
        18. 6.9.5.18 OSPI
          1. 6.9.5.18.1 OSPI with Data Training
            1. 6.9.5.18.1.1 OSPI Switching Characteristics - Data Training
          2. 6.9.5.18.2 OSPI without Data Training
            1. 6.9.5.18.2.1 OSPI Timing Requirements - SDR Mode
            2. 6.9.5.18.2.2 OSPI Switching Characteristics - SDR Mode
            3. 6.9.5.18.2.3 OSPI Timing Requirements - DDR Mode
            4. 6.9.5.18.2.4 OSPI Switching Characteristics - DDR Mode
        19. 6.9.5.19 OLDI
          1. 6.9.5.19.1 OLDI Switching Characteristics
        20. 6.9.5.20 PCIE
        21. 6.9.5.21 PRU_ICSSG
          1. 6.9.5.21.1 Programmable Real-Time Unit (PRU_ICSSG PRU)
            1. 6.9.5.21.1.1 PRU_ICSSG PRU Direct Input/Output Mode Electrical Data and Timing
              1. 6.9.5.21.1.1.1 PRU_ICSSG PRU Switching Characteristics - Direct Output Mode
            2. 6.9.5.21.1.2 PRU_ICSSG PRU Parallel Capture Mode Electrical Data and Timing
              1. 6.9.5.21.1.2.1 PRU_ICSSG PRU Timing Requirements - Parallel Capture Mode
            3. 6.9.5.21.1.3 PRU_ICSSG PRU Shift Mode Electrical Data and Timing
              1. 6.9.5.21.1.3.1 PRU_ICSSG PRU Timing Requirements - Shift In Mode
              2. 6.9.5.21.1.3.2 PRU_ICSSG PRU Switching Characteristics - Shift Out Mode
            4. 6.9.5.21.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Modes Electrical Data and Timing
              1. 6.9.5.21.1.4.1 PRU_ICSSG PRU Timing Requirements - Sigma Delta Mode
              2. 6.9.5.21.1.4.2 PRU_ICSSG PRU Timing Requirements - Peripheral Interface Mode
              3. 6.9.5.21.1.4.3 PRU_ICSSG PRU Switching Characteristics - Peripheral Interface Mode
          2. 6.9.5.21.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.9.5.21.2.1 PRU_ICSSG PWM Electrical Data and Timing
              1. 6.9.5.21.2.1.1 PRU_ICSSG PWM Switching Characteristics
          3. 6.9.5.21.3 PRU_ICSSG Industrial Ethernet Peripheral (PRU_ICSSG IEP)
            1. 6.9.5.21.3.1 PRU_ICSSG IEP Electrical Data and Timing
              1. 6.9.5.21.3.1.1 PRU_ICSSG IEP Timing Requirements - Input Validated with SYNCx
              2. 6.9.5.21.3.1.2 PRU_ICSSG IEP Timing Requirements - Digital IOs
              3. 6.9.5.21.3.1.3 PRU_ICSSG IEP Timing Requirements - LATCHx_IN
          4. 6.9.5.21.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
            1. 6.9.5.21.4.1 PRU_ICSSG UART Electrical Data and Timing
              1. 6.9.5.21.4.1.1 PRU_ICSSG UART Timing Requirements
              2. 6.9.5.21.4.1.2 PRU_ICSSG UART Switching Characteristics
          5. 6.9.5.21.5 PRU_ICSSG Enhanced Capture Peripheral (PRU-ICSS ECAP)
            1. 6.9.5.21.5.1 PRU_ICSSG ECAP Electrical Data and Timing
              1. 6.9.5.21.5.1.1 PRU_ICSSG ECAP Timing Requirements
              2. 6.9.5.21.5.1.2 PRU_ICSSG ECAP Switching Characteristics
          6. 6.9.5.21.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.9.5.21.6.1 PRU_ICSSG MDIO Electrical Data and Timing
              1. 6.9.5.21.6.1.1 PRU_ICSSG MDIO Timing Requirements
              2. 6.9.5.21.6.1.2 PRU_ICSSG MDIO Switching Characteristics - MDIO_CLK
              3. 6.9.5.21.6.1.3 PRU_ICSSG MDIO Switching Characteristics – MDIO_DATA
            2. 6.9.5.21.6.2 PRU_ICSSG RGMII Electrical Data and Timing
              1. 6.9.5.21.6.2.1 PRU_ICSSG RGMII Timing Requirements - RGMII_RXC
              2. 6.9.5.21.6.2.2 PRU_ICSSG RGMII Timing Requirements - RGMII_RD[3:0] and RGMII_RX_CTL
              3. 6.9.5.21.6.2.3 PRU_ICSSG RGMII Switching Characteristics - RGMII_TXC
              4. 6.9.5.21.6.2.4 PRU_ICSSG RGMII Switching Characteristics - RGMII_TD[3:0] and RGMII_TX_CTL
            3. 6.9.5.21.6.3 PRU_ICSSG MII_RT Electrical Data and Timing
              1. 6.9.5.21.6.3.1 PRU_ICSSG MII_RT Timing Requirements – MII_RX_CLK
              2. 6.9.5.21.6.3.2 PRU_ICSSG MII_RT Timing Requirements – MII_RXD[3:0], MII_RX_DV, and MII_RX_ER
              3. 6.9.5.21.6.3.3 PRU_ICSSG MII_RT Switching Characteristics – MII_TX_CLK
              4. 6.9.5.21.6.3.4 PRU_ICSSG MII_RT Switching Characteristics – MII_TXD[3:0] and MII_TXEN
        22. 6.9.5.22 Timers
          1. 6.9.5.22.1 Timing Requirements for Timers
          2. 6.9.5.22.2 Switching Characteristics for Timers
        23. 6.9.5.23 UART
          1. 6.9.5.23.1 Timing Requirements for UART
          2. 6.9.5.23.2 Switching Characteristics Over Recommended Operating Conditions for UART
        24. 6.9.5.24 USB
        25. 6.9.5.25 Emulation and Debug
          1. 6.9.5.25.1 Debug Trace
          2. 6.9.5.25.2 JTAG
            1. 6.9.5.25.2.1 JTAG Electrical Data and Timing
              1. 6.9.5.25.2.1.1 JTAG Timing Requirements
              2. 6.9.5.25.2.1.2 JTAG Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53
      2. 7.2.2 Arm Cortex-R5F
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 PRU_ICSSG
        1. 7.3.1.1 PRU_ICSSG PRU and RTU_PRU Cores
        2. 7.3.1.2 PRU_ICSSG Broadside Accelerators Overview
        3. 7.3.1.3 PRU_ICSSG UART Module
        4. 7.3.1.4 PRU_ICSSG ECAP Module
        5. 7.3.1.5 PRU_ICSSG PWM Module
        6. 7.3.1.6 PRU_ICSSG MII_G_RT Module
        7. 7.3.1.7 PRU_ICSSG MII MDIO Module
        8. 7.3.1.8 PRU_ICSSG IEP
      2. 7.3.2 GPU
    4. 7.4 Other Subsystems
      1. 7.4.1 DMSC
      2. 7.4.2 MSMC
      3. 7.4.3 NAVSS
        1. 7.4.3.1 NAVSS0
        2. 7.4.3.2 MCU_NAVSS0
      4. 7.4.4 PDMA Controller
      5. 7.4.5 Peripherals
        1. 7.4.5.1  ADC
        2. 7.4.5.2  CAL
        3. 7.4.5.3  CPSW2G
        4. 7.4.5.4  DCC
        5. 7.4.5.5  DDRSS
        6. 7.4.5.6  DSS
        7. 7.4.5.7  ЕCAP
        8. 7.4.5.8  EPWM
        9. 7.4.5.9  ELM
        10. 7.4.5.10 ESM
        11. 7.4.5.11 EQEP
        12. 7.4.5.12 GPIO
        13. 7.4.5.13 GPMC
        14. 7.4.5.14 HyperBus
        15. 7.4.5.15 I2C
        16. 7.4.5.16 MCAN
        17. 7.4.5.17 MCASP
        18. 7.4.5.18 MCRC
        19. 7.4.5.19 MCSPI
        20. 7.4.5.20 MMCSD
        21. 7.4.5.21 OSPI
        22. 7.4.5.22 PCIE
        23. 7.4.5.23 SerDes
        24. 7.4.5.24 RTI
        25. 7.4.5.25 Timers
        26. 7.4.5.26 UART
        27. 7.4.5.27 USB
    5. 7.5 Identification
      1. 7.5.1 Revision Identification
      2. 7.5.2 Die Identification
      3. 7.5.3 JTAG Identification
      4. 7.5.4 ROM Code Identification
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for AM65x/DRA80xM Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (Only Available in Octal Flash Devices)
      3. 8.2.3 USB Design Guidelines
      4. 8.2.4 High Speed Differential Signal Routing Guidance
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 MMC Design Guidelines
      7. 8.2.7 Integrated Power Management Features
      8. 8.2.8 External Capacitors
        1. 8.2.8.1 LVCMOS External Capacitor Connections
      9. 8.2.9 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ACD|784
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

AM654x 和 AM652xSitara™ 处理器是 Arm® 应用处理器，旨在满足现代工业 4.0 嵌入式产品的复杂处理需求。

AM654x 和 AM652x 器件将四个或两个 Arm®Cortex®-A53 内核与双 Arm®Cortex®-R5F MCU 子系统（包括旨在帮助客户实现其最终产品功能安全目标的特性）和三个千兆位工业通信子系统 (PRU_ICSSG) 组合在一起，从而为功能安全应用实现支持 SoC 且具有工业连接和处理能力的高性能工业控制。AM65xx 目前正在按照 IEC 61508 标准要求，接受 TÜV SÜD 的认证评估。

AM654x 中的四个 Arm®Cortex®-A53 内核分布在两个具有共享 L2 存储器的双核集群中，以创建两个处理通道。AM652x 中的两个 Arm®Cortex®-A53 内核可通过单个双核集群和两个单核集群选项提供。片上存储器、外设和互联中包含广泛的 ECC，可确保可靠性。整个 SoC 中包括旨在帮助客户设计可实现他们的功能安全目标的特性（正在等待 TÜV SÜD 评估结果）。除了 DMSC 管理的粒度防火墙之外，某些 AM654x 和 AM652x 器件上还提供了加密加速和安全启动功能。

Arm®Cortex®-A53 RISC CPU 及 Arm® Neon™ 扩展可实现可编程性，而双 Arm®Cortex®-R5F MCU 子系统可作为两个内核用于一般用途或用于锁步模式，以帮助满足功能安全应用的需求。PRU_ICSSG 子系统可用于提供最多六个工业以太网端口，如 Profinet IRT、TSN、Ethernet/IP 或 EtherCAT® 等，或者用于标准千兆位以太网连接。

TI 提供了一整套针对 Arm® 内核的软件和开发工具，其中包括 Processor SDK Linux、Linux-RT、RTOS 和 Android 以及 C 语言编译器和一个可查看源代码执行情况的调试界面。我们将会提供相关功能安全和安保文档，以帮助客户开发功能安全或安保相关的系统。

封装信息
器件型号封装(1)封装尺寸(2)
AM6548ACD（FCBGA，784）23.0mm × 23.0mm
AM6528ACD（FCBGA，784）23.0mm × 23.0mm
AM6546ACD（FCBGA，784）23.0mm × 23.0mm
AM6526ACD（FCBGA，784）23.0mm × 23.0mm
(1) 如需更多信息，请参阅节 11机械、封装和可订购信息。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。