ZHCSSQ9G
october 1980 – august 2023
AM26LS32AC
,
AM26LS32AM
,
AM26LS33AM
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
6.7
Dissipation Ratings
6.8
Typical Characteristics
7
Parameter Measurement Information
17
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
23
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
接收文档更新通知
10.2
支持资源
10.3
Trademarks
10.4
静电放电警告
10.5
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
N|16
MPDI002C
D|16
MPDS178G
散热焊盘机械数据 (封装 | 引脚)
D|16
QFND167D
订购信息
zhcssq9g_oa
zhcssq9g_pm
10.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。