SLASF44 may   2023 AFE78201 , AFE88201

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: Power Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2  Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3  Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm-Based Interrupts
        2. 7.3.3.2 Alarm Action Configuration Register
        3. 7.3.3.3 Alarm Voltage Generator
        4. 7.3.3.4 Temperature Sensor Alarm Function
        5. 7.3.3.5 Internal Reference Alarm Function
        6. 7.3.3.6 ADC Alarm Function
        7. 7.3.3.7 Fault Detection
      4. 7.3.4  IRQ
      5. 7.3.5  Internal Reference
      6. 7.3.6  Integrated Precision Oscillator
      7. 7.3.7  Precision Oscillator Diagnostics
      8. 7.3.8  One-Time Programmable (OTP) Memory
      9. 7.3.9  GPIO
      10. 7.3.10 Timer
      11. 7.3.11 Unique Chip Identifier (ID)
      12. 7.3.12 Scratch Pad Register
    4. 7.4 Device Functional Modes
      1. 7.4.1 Register Built-In Self-Test (RBIST)
      2. 7.4.2 DAC Power-Down Mode
      3. 7.4.3 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
      2. 7.5.2 GPIO Programming
      3. 7.5.3 Serial Peripheral Interface (SPI)
        1. 7.5.3.1 SPI Frame Definition
        2. 7.5.3.2 SPI Read and Write
        3. 7.5.3.3 Frame Error Checking
        4. 7.5.3.4 Synchronization
      4. 7.5.4 UART Interface
        1. 7.5.4.1 UART Break Mode (UBM)
      5. 7.5.5 Status Bits
      6. 7.5.6 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx8201 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Analog Output Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 XTR305
            1. 8.2.1.2.1.1 Current-Output Mode
            2. 8.2.1.2.1.2 Voltage Output Mode
            3. 8.2.1.2.1.3 Diagnostic Features
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

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7.3.3.2 Alarm Action Configuration Register

The AFEx8201 provides an alarm action configuration register: ALARM_ACT, Table 7-25. Writing to this register selects the device action that automatically occurs for a specific alarm condition. The ALARM_ACT register determines how the main DAC responds to an alarm event from either an ADC conversion on the self-diagnostics channels (AIN0, AIN1, and TEMP), or from a CRC, WDT, VREF, TEMP_HI, or TEMP_LO fault. Only these faults cause a response by the DAC. Any other alarm status events trigger the ALARM pin. There are four options for alarm action. In case different settings are selected for different alarm conditions, the following low-to-high priority is considered when taking action:

  • 0. → No action
  • 1. → DAC CLEAR state
  • 2. → VOUT alarm voltage
  • 3. → VOUT Hi-Z

If option 1 is selected when the alarm event occurs, then the DAC is forced to the clear code. This operation is done by controlling the input code to the DAC.

If option 2 is selected when the alarm event occurs, then VOUT is forced to the alarm voltage. The alarm voltage is controlled by either pin or register bit. If SPECIAL_CFG.AIN1_ENB = 0, then the AIN1 pin controls alarm polarity. Also, register bit SPECIAL_CFG.ALMV_POL can be used. If either of these signals = 1, then the alarm voltage is high; otherwise, the alarm voltage is low. The SPECIAL_CFG register is only reset with POR, so the user setting remains intact through hardware or software resets.

If option 3 is selected when the alarm event occurs, then the VOUT buffer is put into Hi-Z. If multiple events occur, then the highest setting takes precedence. Option 3 has the highest priority.

To disable action response to an alarm, set the corresponding bits in ALARM_ACT to 0h. Alarm action response is cleared either when the triggered condition bit resets (behavior depends on whether the fault bit in ALARM_STATUS is sticky or not), or by changing the action configuration to 0h.

Note:

An alarm action, as configured, executes when an alarm occurs depending on ALARM_STATUS and ALARM_ACT registers. Action response is independent of ALARM_STATUS_MASK settings.