ZHCS339E August   2010  – June 2019 AFE031

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
  4. 修订历史记录
  5. 说明(续)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Thermal Information
    4. 8.4  Electrical Characteristics: Transmitter (Tx)
    5. 8.5  Electrical Characteristics: Power Amplifier (PA)
    6. 8.6  Electrical Characteristics: Receiver (Rx)
    7. 8.7  Electrical Characteristics: Digital
    8. 8.8  Electrical Characteristics: Two-Wire Interface
    9. 8.9  Electrical Characteristics: Internal Bias Generator
    10. 8.10 Electrical Characteristics: Power Supply
    11. 8.11 Timing Requirements
    12. 8.12 Timing Diagrams
    13. 8.13 Typical Characteristics
  9. Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 PA Block
      2. 9.2.2 Tx Block
      3. 9.2.3 Rx Block
      4. 9.2.4 DAC Block
      5. 9.2.5 REF1 and REF2 Blocks
      6. 9.2.6 Zero Crossing Detector Block
      7. 9.2.7 ETx and ERx Blocks
    3. 9.3 Power Supplies
    4. 9.4 Pin Descriptions
      1. 9.4.1 Current Overload
      2. 9.4.2 Thermal Overload
    5. 9.5 Calibration Modes
      1. 9.5.1 Tx Calibration Mode
      2. 9.5.2 Rx Calibration Mode
    6. 9.6 Serial Interface
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Detailed Design Procedure
        1. 10.2.1.1 Line-Coupling Circuit
        2. 10.2.1.2 Circuit Protection
        3. 10.2.1.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
        1. 11.1.2.1 电力线通信开发者套件
        2. 11.1.2.2 TINA-TI™(免费软件下载)
        3. 11.1.2.3 TI 高精度设计
        4. 11.1.2.4 WEBENCH滤波器设计器
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from D Revision (May 2012) to E Revision

  • Deleted 删除了封装/订购信息 表;请参阅数据表末尾的封装选项附录Go
  • Deleted ESD specifications from Absolute Maximum Ratings table. Moved to separate ESD Ratings table.Go
  • Deleted references to Tx PGA calibration in Calibration ModesGo
  • Deleted reference to TX_PGA_CAL in Table 14Go

Changes from C Revision (March 2012) to D Revision

Changes from B Revision (September 2011) to C Revision

  • Changed 更 改 了说明 部分的变送功率放大器工作范围说明Go
  • Added cross-reference to footnote 2 to Output short-circuit (PA) parameter in Absolute Maximum Ratings tableGo
  • Changed Frequency Response, Passband frequency (B/C/D Modes) parameter minimum and typical specifications in Electrical Characteristics: Receiver (Rx)Go
  • Deleted Digital Outputs (INT, Tx_Flag, Rx_Flag), INT pin high, INT pin low, Tx_Flag high, Tx_Flag low, Rx_Flag high, and Rx_Flag low parameter units from Electrical Characteristics: DigitalGo
  • Changed Digital Outputs (INT, Tx_Flag, Rx_Flag), Tx_Flag high, Tx_Flag low, Rx_Flag high, and Rx_Flag low parameter specification descriptions in Electrical Characteristics: DigitalGo
  • Changed Operating Supply Range, Power amplifier supply voltage parameter maximum specification in Electrical Characteristics: Power SupplyGo
  • Changed title of Figure 20Go
  • Changed description of PA operating range in PA Block sectionGo
  • Updated Equation 2Go
  • Changed proper design margin note in PA Block sectionGo
  • Updated Figure 34Go
  • Changed description of REF1 and REF2 Blocks sectionGo
  • Changed second paragraph of Power Supplies sectionGo
  • Changed title of Table 11Go