ZHCSFJ3A July   2014  – September 2016 ADS1148-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  ADC Input and Multiplexer
      2. 8.3.2  Low-Noise PGA
        1. 8.3.2.1 PGA Common-Mode Voltage Requirements
        2. 8.3.2.2 PGA Common-Mode Voltage Calculation Example
        3. 8.3.2.3 Analog Input Impedance
      3. 8.3.3  Clock Source
      4. 8.3.4  Modulator
      5. 8.3.5  Digital Filter
      6. 8.3.6  Voltage Reference Input
      7. 8.3.7  Internal Voltage Reference
      8. 8.3.8  Excitation Current Sources
      9. 8.3.9  Sensor Detection
      10. 8.3.10 Bias Voltage Generation
      11. 8.3.11 General-Purpose Digital I/O
      12. 8.3.12 System Monitor
        1. 8.3.12.1 Power-Supply Monitor
        2. 8.3.12.2 External Voltage Reference Monitor
        3. 8.3.12.3 Ambient Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Up
      2. 8.4.2 Reset
      3. 8.4.3 Power-Down Mode
      4. 8.4.4 Conversion Control
        1. 8.4.4.1 Settling Time for Channel Multiplexing
        2. 8.4.4.2 Channel Cycling and Overload Recovery
        3. 8.4.4.3 Single-Cycle Settling
        4. 8.4.4.4 Digital Filter Reset Operation
      5. 8.4.5 Calibration
        1. 8.4.5.1 Offset Calibration Register: OFC[2:0]
        2. 8.4.5.2 Full-Scale Calibration Register: FSC[2:0]
        3. 8.4.5.3 Calibration Commands
          1. 8.4.5.3.1 System Offset and Self Offset Calibration
          2. 8.4.5.3.2 System Gain Calibration
        4. 8.4.5.4 Calibration Timing
    5. 8.5 Programming
      1. 8.5.1 Digital Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Ready (DRDY)
        5. 8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 8.5.1.6 SPI Reset
        7. 8.5.1.7 SPI Communication During Power-Down Mode
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1  WAKEUP (0000 000x)
        2. 8.5.3.2  SLEEP (0000 001x)
        3. 8.5.3.3  SYNC (0000 010x)
        4. 8.5.3.4  RESET (0000 011x)
        5. 8.5.3.5  RDATA (0001 001x)
        6. 8.5.3.6  RDATAC (0001 010x)
        7. 8.5.3.7  SDATAC (0001 011x)
        8. 8.5.3.8  RREG (0010 rrrr, 0000 nnnn)
        9. 8.5.3.9  WREG (0100 rrrr, 0000 nnnn)
        10. 8.5.3.10 SYSOCAL (0110 0000)
        11. 8.5.3.11 SYSGCAL (0110 0001)
        12. 8.5.3.12 SELFOCAL (0110 0010)
        13. 8.5.3.13 NOP (1111 1111)
        14. 8.5.3.14 Restricted Command (1111 0001)
    6. 8.6 Register Maps
      1. 8.6.1 Register Map
      2. 8.6.2 Detailed Register Definitions
        1. 8.6.2.1  MUX0—Multiplexer Control Register 0 (address = 00h) [reset = 01h]
        2. 8.6.2.2  VBIAS—Bias Voltage Register (address = 01h) [reset = 00h]
        3. 8.6.2.3  MUX1—Multiplexer Control Register 1 (address = 02h) [reset = x0h]
        4. 8.6.2.4  SYS0—System Control Register 0 (address = 03h) [reset = 00h]
        5. 8.6.2.5  OFC—Offset Calibration Coefficient Register (address = 04h, 05h, 06h) [reset = 00h, 00h, 00h]
        6. 8.6.2.6  FSC—Full-Scale Calibration Coefficient Register (address = 07h, 08h, 09h) [reset = 00h, 00h, 40h]
        7. 8.6.2.7  IDAC0—IDAC Control Register 0 (address = 0Ah) [reset = x0h]
        8. 8.6.2.8  IDAC1—IDAC Control Register 1 (address = 0Bh) [reset = FFh]
        9. 8.6.2.9  GPIOCFG—GPIO Configuration Register (address = 0Ch) [reset = 00h]
        10. 8.6.2.10 GPIODIR—GPIO Direction Register (address = 0Dh) [reset = 00h]
        11. 8.6.2.11 GPIODAT—GPIO Data Register (address = 0Eh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 9.1.5 Isolated (or Floating) Sensor Inputs
      6. 9.1.6 Unused Inputs and Outputs
      7. 9.1.7 Pseudo Code Example
      8. 9.1.8 Channel Multiplexing Example
      9. 9.1.9 Power-Down Mode Example
    2. 9.2 Typical Applications
      1. 9.2.1 Ratiometric 3-Wire RTD Measurement System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Topology
          2. 9.2.1.2.2 RTD Selection
          3. 9.2.1.2.3 Excitation Current
          4. 9.2.1.2.4 Reference Resistor (RREF)
          5. 9.2.1.2.5 PGA Setting
          6. 9.2.1.2.6 Common-Mode Input Range
          7. 9.2.1.2.7 Input and Reference Low-Pass Filters
          8. 9.2.1.2.8 Register Settings
        3. 9.2.1.3 Application Curves
      2. 9.2.2 K-Type Thermocouple Measurement (-200°C to +1250°C) With Cold-Junction Compensation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Biasing Resistors
          2. 9.2.2.2.2 Input Filtering
          3. 9.2.2.2.3 PGA Setting
          4. 9.2.2.2.4 Cold-Junction Measurement
          5. 9.2.2.2.5 Calculated Resolution
          6. 9.2.2.2.6 Register Settings
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
    2. 10.2 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 文档支持

12.1.1 相关文档　

相关文档如下：

12.2 接收文档更新通知

如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

12.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.