ZHCSEE1F October   2010  – September 2019 ADS1118

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      K 型热电偶测量使用集成温度传感器进行冷结点补偿
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Multiplexer
      2. 9.3.2 Analog Inputs
      3. 9.3.3 Full-Scale Range (FSR) and LSB Size
      4. 9.3.4 Voltage Reference
      5. 9.3.5 Oscillator
      6. 9.3.6 Temperature Sensor
        1. 9.3.6.1 Converting from Temperature to Digital Codes
        2. 9.3.6.2 Converting from Digital Codes to Temperature
    4. 9.4 Device Functional Modes
      1. 9.4.1 Reset and Power Up
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Single-Shot Mode and Power-Down
        2. 9.4.2.2 Continuous-Conversion Mode
      3. 9.4.3 Duty Cycling for Low Power
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
      2. 9.5.2 Chip Select (CS)
      3. 9.5.3 Serial Clock (SCLK)
      4. 9.5.4 Data Input (DIN)
      5. 9.5.5 Data Output and Data Ready (DOUT/DRDY)
      6. 9.5.6 Data Format
      7. 9.5.7 Data Retrieval
        1. 9.5.7.1 32-Bit Data Transmission Cycle
        2. 9.5.7.2 16-Bit Data Transmission Cycle
    6. 9.6 Register Maps
      1. 9.6.1 Conversion Register [reset = 0000h]
        1. Table 6. Conversion Register Field Descriptions
      2. 9.6.2 Config Register [reset = 058Bh]
        1. Table 7. Config Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Serial Interface Connections
      2. 10.1.2 GPIO Ports for Communication
      3. 10.1.3 Analog Input Filtering
      4. 10.1.4 Single-Ended Inputs
      5. 10.1.5 Connecting Multiple Devices
      6. 10.1.6 Pseudo Code Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from E Revision (October 2015) to F Revision

  • Changed maximum VDD voltage from 5.5 V to 7 V in the Absolute Maximum Ratings tableGo
  • Changed bit description of Config Register bit 0Go

Changes from D Revision (October 2013) to E Revision

  • Added 添加了 ESD 额定值 表、特性 说明 部分、噪声性能 部分、器件功能模式 部分、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 更改了标题、说明 部分、特性 部分和首页的方框图Go
  • Changed title from Product Family to Device Comparison Table and deleted Package Designator columnGo
  • Updated descriptions and changed name of I/O column in Pin Configurations and Functions tableGo
  • Changed digital input voltage range and added minimum specification for TJ in Absolute Maximum Ratings table Go
  • Added Differential input impedance specification in Electrical CharacteristicsGo
  • Changed Condition statement in Timing Requirements: Serial InterfaceGo
  • Moved tCSDOD, tDOPD, and tCSDOZ parameters from Timing Requirements to Switching CharacteristicsGo
  • Moved tCSDOD and tCSDOZ values from MIN column to MAX column.Go
  • Deleted Noise vs Input Signal, Noise vs Supply Voltage, and Noise vs Input Signal plotsGo
  • Updated Overview section and deleted "Gain = 2/3, 1, 2, 4, 8, or 16" from Functional Block DiagramGo
  • Updated Analog Inputs sectionGo
  • Updated Full-Scale Range (FSR) and LSB Size sectionGo
  • Updated Reset and Power Up sectionGo
  • Updated 32-Bit Data Transmission Cycle sectionGo
  • Updated Register Maps sectionGo
  • Updated Application Information sectionGo
  • Updated Figure 48Go
  • Deleted Thermocouple Measurement With Cold Junction Temperature section, and moved Figure 50 to Typical Application sectionGo

Changes from C Revision (February 2013) to D Revision

  • Deleted 删除了器件图形Go
  • Changed bit 1 to NOP0 in Figure 44Go
  • Changed NOP bit description in Figure 44: changes bits[2:0] to bits [2:1] and changed NOP to NOP[1:0]Go

Changes from B Revision (August 2012) to C Revision

  • 将文档更改为最新标准Go
  • Changed 更改了“单冲模式”子项目符号（在“低电流消耗” 特性 项目符号中）Go
  • Changed 更改了“内部温度传感器” 特性 项目符号Go
  • Changed 说明 部分中的 VDE 和 CSA 安全相关认证说明Go
  • Changed Product Family tableGo
  • Changed Function column name in Pin Descriptions tableGo
  • Changed Analog Input, Full-scale input voltage range parameter row in Electrical Characteristics tableGo
  • Changed footnotes 1 and 2 in Electrical Characteristics tableGo
  • Changed conditions for Electrical Characteristics tableGo
  • Changed System Performance, Integral nonlinearity and Gain Error test conditions in Electrical Characteristics tableGo
  • Changed first two Temperature Sensor, Temperature sensor accuracy parameter test conditions in Electrical Characteristics tableGo
  • Changed Power-Supply Requirements, Supply current parameter test conditions in Electrical Characteristics tableGo
  • Changed footnote 3 of Timing Requirements: Serial Interface Timing tableGo
  • Updated Figure 3Go
  • Updated Figure 9Go
  • Changed title of Figure 11 to Figure 14Go
  • Updated Figure 15 and Figure 33Go
  • Updated Figure 20Go
  • Changed conditions in Figure 21 to Figure 25Go
  • Changed comments in Figure 27 to Figure 31Go
  • Changed Overview sectionGo
  • Updated Multiplexer sectionGo
  • Changed Full-Scale Input sectionGo
  • Changed Voltage Reference sectionGo
  • Changed Oscillator sectionGo
  • Added multiplication points to example equations in Converting from Digital Codes to Temperature sectionGo
  • Changed Serial Interface, Chip Select, Serial Clock, Data Input, and Data Output and Data Ready sectionsGo
  • Changed Data Retrieval sectionGo
  • Changed Registers sectionGo
  • Changed Aliasing, Reset and Power Up, Operating Modes, and Duty Cycling for Low Power sectionsGo
  • Updated Figure 50Go

Changes from A Revision (July 2011) to B Revision