Trade-offs between thermal performance and small solution size with DC/DC converters
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2018 年 3 月 8 日
As output current levels increase and PCB area continues to shrink, the hunt for better power density shows no signs of coming to an end. But while heat dissipation is improving with today's small packages, there is still a trade-off to be taken into consideration. The 36V, 3A LMR33630 provides an excellent test case, as it comes in both an SOIC-8 package as well as a 2mm x 3mm Hot Rod QFN. In this training, we compare the thermal performance of each under the same operating conditions. |
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使用直流/直流开关稳压器管理散热
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