[
{
"name": "数据中心产生的热量比以往任何时候都多。 为此，散热能力必须同步提升。",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/data-centers-are-generating-more-heat-than-ever-cooling-has-to-keep-up.html",
"headline": "数据中心热量持续攀升，散热也必须同步升级",
"subheadline": "随着 AI 对数据中心提出极高的电力需求，工程师正在重新思考数据中心输送、监测和控制热量的方式。",
"image": "/content/dam/ticom/images/applications/enterprise-system/data-center-cooling-thermal-management.jpg",
"date": "31 八月 2026",
"category": "技术"
},
{
"name": "第一财经专访德州仪器：半导体技术，正在改变什么？",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/what-is-semiconductor-technology-changing.html",
"headline": "第一财经专访德州仪器：半导体技术，正在改变什么？",
"subheadline": "查看视频，了解半导体技术如何推动产业创新，以及德州仪器如何植根中国四十年，让先进技术走向大众。 ",
"image": "/content/dam/ticom/images/themes/training/yicai-interview-video-thumbnail.jpg",
"date": "31 八月 2026",
"category": "在 TI 的生活"
},
{
"name": "德州仪器人力资源副总裁祝薇：让每个人发挥所长，推动半导体技术创新",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/Julie_sharing.html",
"headline": "德州仪器人力资源副总裁祝薇：让每个人发挥所长，推动半导体技术创新",
"subheadline": "从连接团队到激发潜能，听祝薇分享如何搭建全球化高超团队，让人才与业务共同成长。",
"image": "/content/dam/master-files-archive/people/employees/on-site/julie-talking-on-mobile.jpg",
"date": "28 八月 2026",
"category": "在 TI 的生活"
},
{
"name": "创新背后：重新定义电流检测的方法",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/behind-the-innovation-the-road-to-rewriting-current-sensing.html",
"headline": "创新背后：重新定义电流检测的方法",
"subheadline": "TI 工程师团队如何解决长期存在的权衡难题，打造适用于牵引逆变器的多轴无芯霍尔效应传感器",
"image": "/content/dam/ticom/images/people/employees/on-site/tmcs2100-jason-cole-and-lei-ding-2.jpg",
"date": "25 八月 2026",
"category": "技术"
},
{
"name": "i-am-tier-sylvia",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/i-am-tier-sylvia.html",
"headline": "在数据中心的世界，她连接需求，更连接未来",
"subheadline": "我是 TI 人｜在德州仪器，我们正在塑造技术未来",
"image": "/content/dam/ticom/images/people/employees/on-site/sylvia-sun-on-site.jpg",
"date": "09 七月 2026",
"category": "在 TI 的生活"
},
{
"name": "将人形机器人带入现实世界需要什么？阅读我们专家的见解",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/what-will-it-take-to-bring-humanoid-robots-into-the-real-world-read-our-experts-insights.html",
"headline": "将人形机器人带入现实世界需要什么？阅读我们专家的见解",
"subheadline": "人形机器人是 AI 走进现实世界的一种方式，而半导体技术将助力机器人迈出下一步",
"image": "/content/dam/ticom/images/applications/factory-automation/humanoid-sensing-and-motor-control-in-factory.jpg",
"date": "24 六月 2026",
"category": "技术"
},
{
"name": "可靠性将决定未来十年的储能",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/reliability-will-define-the-next-decade-of-energy-storage.html",
"headline": "可靠性将决定未来十年的储能",
"subheadline": "电池管理的进步使电网规模系统的性能更加一致",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-energy-storage-system-at-sunset.jpg",
"date": "09 六月 2026",
"category": "技术"
},
{
"name": "智能底盘：悄然迭代，重塑汽车行驶逻辑",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-intelligent-chassis-the-silent-upgrade-thats-changing-how-cars-move.html",
"headline": "智能底盘：悄然迭代，重塑汽车行驶逻辑",
"subheadline": "转向、制动、悬架三大系统全面电子化，从根本改变车辆操控逻辑与驾乘体验",
"image": "/content/dam/ticom/images/applications/automotive/transparent-car-showing-an-intelligent-chassis.jpg",
"date": "01 六月 2026",
"category": "技术"
},
{
"name": "创新之处，影响所及",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/where-innovation-meets-impact.html",
"headline": "创新之处，影响所及",
"subheadline": "在德州仪器，我们正在推动工作场所的创新，践行做社区好邻居的承诺，并创造一个可持续的未来。",
"image": "/content/dam/ticom/images/literature/corporate/ccr-blog-r4-cn.jpg",
"date": "26 5 月 2026",
"category": "在 TI 的生活"
},
{
"name": "更智能的断路器，更安全的家：隐藏在充沛能源住宅背后的技术",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/smarter-breakers-safer-home-the-hidden-technology-within-your-energy-abundant-house.html",
"headline": "安全住宅中的隐藏科技：更智能的断路器",
"subheadline": "智能电气化如何帮助房主管理能源消耗，享受更安全、更便捷的生活",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/energized-home-overview.jpg",
"date": "26 5 月 2026",
"category": "技术"
},
{
"name": "改变世界的芯片",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-chips-that-change-the-world.html",
"headline": "改变世界的芯片",
"subheadline": "通用芯片如何为重塑生活的技术创新奠定基础",
"image": "/content/dam/ticom/images/applications/home-automation/smart-home-health-monitoring.jpg",
"date": "15 5 月 2026",
"category": "技术"
},
{
"name": "TI China 40 employee video",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-china-40-employee-video.html",
"headline": "与每一次创新同行 ｜ 熠路向上，耀向未来",
"subheadline": "观看视频，探寻 TI 人创新前行的力量",
"image": "/content/dam/ticom/images/people/employees/on-site/ti-china-40-employee-story.jpg",
"date": "14 5 月 2026",
"category": "在 TI 的生活"
},
{
"name": "未来从这里开启：从实习生到全职 TI 员工之路的三大心得",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-future-starts-here-3-insights-on-the-journey-from-intern-to-full-time-TIer.html",
"headline": "未来从这里开启：从实习生到德州仪器全职员工的三大心得",
"subheadline": "德州仪器员工回顾那些帮助他们职业生涯起步的实习经历，以及在此过程中学到的经验。",
"image": "/content/dam/ticom/images/people/employees/on-site/pre-intern-blog-cn.jpg",
"date": "13 5 月 2026",
"category": "在 TI 的生活"
},
{
"name": "揭秘 DSP 技术的传承：一款儿童玩具如何开启边缘 AI 革命",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/uncovering-the-legacy-of-DSP-technology-how-a-childrens-toy-sparked-the-edge-AI-revolution.html",
"headline": "揭秘 DSP 技术的传承：一款儿童玩具如何开启边缘 AI 革命",
"subheadline": "聆听这段传奇故事：TI 如何凭借 Speak & Spell* 奠定其在数字信号处理 (DSP) 领域的传承地位，并持续推动如今边缘 AI 设备的创新发展。",
"image": "/content/dam/ticom/images/themes/circuits/invention-of-ai.jpg",
"date": "04 5 月 2026",
"category": "技术"
},
{
"name": "engineering-a-path-with-impact",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/engineering-a-path-with-impact.html",
"headline": "以工程之力，塑造具有影响力的道路",
"subheadline": "德州仪器（TI）工程师分享职业成长、解决问题、社区贡献的感悟，以及如何打造以创新驱动现实改变的职业生涯。",
"image": "/content/dam/ticom/images/people/employees/on-site/engineers-in-a-lab-with-ashley-richmond.jpg",
"date": "08 四月 2026",
"category": "在 TI 的生活"
},
{
"name": "三大半导体技术重新定义电动汽车驾乘体验",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-semiconductor-technologies-that-are-redefining-the-EV-experience.html",
"headline": "重塑电动汽车驾乘体验的三大半导体技术",
"subheadline": "以协同创新为驱动的半导体技术，正加速电动汽车走向规模化应用，成为日常出行的重要选择",
"image": "/content/dam/ticom/images/people/employees/off-site/jerry-shi-charging-ev.jpg",
"date": "16 三月 2026",
"category": "技术"
},
{
"name": "不止于听：半导体创新如何重塑音频体验",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/beyond-sound-how-semiconductor-innovation-is-transforming-audio-experiences.html",
"headline": "不止于听：半导体创新如何重塑音频体验",
"subheadline": "音频技术让我们的生活更丰富、更个性化，甚至更安全，再加上半导体技术，一切皆有可能",
"image": "/content/dam/ticom/images/applications/audio/asc-audio.jpg",
"date": "20 二月 2026",
"category": "技术"
},
{
"name": "测试精密度",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/putting-precision-to-the-test.html",
"headline": "让测试测量的精度再提升",
"subheadline": "半导体技术进步如何推动测试设备实现突破性发展",
"image": "/content/dam/ticom/images/themes/circuits/precision-test-and-measurement.jpg",
"date": "16 二月 2026",
"category": "技术"
},
{
"name": "TI China 40th anniversary video",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-china-40th-anniversary-video.html",
"headline": "德州仪器中国四十周年｜熠四十，耀百年",
"subheadline": "走进视频，帧帧熠彩，共耀前路",
"image": "/content/dam/ticom/images/themes/infographic/ti-china-40-years-of-innovation.jpg",
"date": "06 二月 2026",
"category": "在 TI 的生活"
},
{
"name": "3 项半导体驱动的创新影响着我们体验世界的方式",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-semiconductor-enabled-innovations-impacting-how-we-experience-the-world.html",
"headline": "三项由半导体赋能的创新正影响着我们体验世界的方式",
"subheadline": "更安全的系统、更小型的器件和人工智能的普及，将重新定义未来科技发展。",
"image": "/content/dam/ticom/images/themes/concepts/woman-looking-at-connected-city.jpg",
"date": "31 十二月 2025",
"category": "技术"
},
{
"name": "the-future-starts-with-the-first-our-newest-300mm-wafer-fab-is-in-production",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-future-starts-with-the-first-our-newest-300mm-wafer-fab-is-i.html",
"headline": "芯启未来：德州仪器（TI）全新12 英寸半导体晶圆制造厂正式投产",
"subheadline": "从德克萨斯州谢尔曼晶圆厂交付首批量产芯片的一刻起，德州仪器在“开创先河”的传承中，再次迈出重要一步：我们正在构建当今世界所依赖的创新技术，亦创造未来世界所需的领先技术。",
"image": "/content/dam/ticom/images/themes/facilities/sm1-first-production-event.jpg",
"date": "31 十二月 2025",
"category": "制造"
},
{
"name": "塑造自动驾驶体验的半导体技术",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-semiconductor-technology-shaping-the-autonomous-driving-experience.html",
"headline": "塑造自动驾驶体验的半导体技术",
"subheadline": "未来的汽车将具备更强的自主性，从而减轻人们的驾驶负担。那么，设计工程师应该如何实现这一愿景？",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-using-driver-assist-system.jpg",
"date": "05 十二月 2025",
"category": "技术"
},
{
"name": "i-am-tier-eason",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/i-am-tier-eason.html",
"headline": "他以技术为刃，雕琢机器人关节的灵巧精度",
"subheadline": "我是 TI 人｜在德州仪器，我们正在塑造技术未来",
"image": "/content/dam/ticom/images/people/employees/on-site/i-am-tIer-eason.jpg",
"date": "17 十一月 2025",
"category": "在 TI 的生活"
},
{
"name": "2025-bring-kids-to-work",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/2025-bring-kids-to-work.html",
"headline": "TI 带小孩上班日｜童心与科技的奇妙相遇，创新在这里萌芽",
"subheadline": " ",
"image": "/content/dam/ticom/images/people/students/2025-bktw-student-looking-through-a-window-cn.jpg",
"date": "12 十一月 2025",
"category": "在 TI 的生活"
},
{
"name": "以当下边缘人工智能设备，铸就未来创新",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/building-tomorrows-innovations-with-todays-edge-AI-enabled-devices.html",
"headline": "以当下边缘人工智能设备，铸就未来创新",
"subheadline": "边缘AI 技术正让设备变得更高效、更易用、更精准，而这一切，仅仅只是序幕",
"image": "/content/dam/ticom/images/applications/medical/ai-use-cases-medical-patch.jpg",
"date": "11 十一月 2025",
"category": "技术"
},
{
"name": "从电网到栅极：赋能第三次能源革命",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/from-the-grid-to-the-gate-powering-the-third-energy-revolution.html",
"headline": "从电网到栅极：赋能第三次能源革命",
"subheadline": "利用可再生能源满足 AI 驱动的数据中心日益增长的电力需求",
"image": "/content/dam/ticom/images/themes/circuits/dce-program-datacenter.jpg",
"date": "07 十月 2025",
"category": "技术"
},
{
"name": "突破掩模局限：DLP® 技术如何借助高级封装技术实现新型计算解决方案",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/beyond-the-mask-how-dlp-technology-is-enabling-new-computing-solutions-with-advanced-packaging.html",
"headline": "突破掩模局限：DLP® 技术如何借助高级封装技术实现新型计算解决方案",
"subheadline": "半导体行业向高级封装的转型，需要光刻技术的同步革新 —— 而 DLP 技术正是达成这一目标的关键。",
"image": "/content/dam/ticom/images/applications/projection-display/dlp-digital-lithography.jpg",
"date": "30 九月 2025",
"category": "技术"
},
{
"name": "未来精彩可期：集成电路的传统技术在未来迎来突破 ",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-best-is-yet-to-come-the-legacy-of-the-integrated-circuit-in-tomorrows-breakthroughs.html",
"headline": "集成电路发明者：驱动每一次技术创新",
"subheadline": "Jack Kilby 发明的集成电路已成为现代创新的基石，持续赋能我们现在和未来的技术创新。",
"image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-day-2025.jpg",
"date": "12 九月 2025",
"category": "技术"
},
{
"name": "pearl-student-visit-shanghai-office",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/pearl-student-visit-shanghai-office.html",
"headline": "点亮珍珠梦想，照见未来可能",
"subheadline": "德州仪器用“芯”赋能下一代科技启蒙，用爱连接无限希望",
"image": "/content/dam/ticom/images/people/students/pearl-class-student-visit-ti-nbc-in-discussion.jpg",
"date": "09 九月 2025",
"category": "在 TI 的生活"
},
{
"name": "Building stronger communities worldwide: TIers uphold a long-standing commitment to giving back",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/building-stronger-communities-worldwide-tiers-uphold-a-long-standing-commitment-to-giving-back.html",
"headline": "在全球共建更强大的社区：德州仪器员工坚守回馈社会的长期承诺",
"subheadline": "从学生培养到紧急救援，德州仪器志愿者正在改善我们生活和工作所在的社区。",
"image": "/content/dam/ticom/images/people/employees/off-site/shanghai-employee-volunteering.jpg",
"date": "03 九月 2025",
"category": "在 TI 的生活"
},
{
"name": "im-a-tier-shaping-the-future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/im-a-tier-shaping-the-future.html",
"headline": "二十年追光者，以热爱为帆，他在 TI 通过技术创新改变世界",
"subheadline": "我是 TI 人 | 在德州仪器，我们正在塑造未来",
"image": "/content/dam/ticom/images/people/employees/on-site/albin-zhang-in-lab.jpg",
"date": "18 七月 2025",
"category": "在 TI 的生活"
},
{
"name": "Engineering a better world: our communities, workplace and environmental sustainability impact",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/engineering-a-better-world-our-communities-workplace-and-environmental-sustainability-impact.html",
"headline": "工程技术构建更美好的世界：我们的社区、工作场所和环境的可持续性影响",
"subheadline": "从投资教育和减少对环境的影响，到培养人才和保持业内优秀的安全记录，德州仪器正在加强企业公民影响力，让世界更美好。",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/solar-farm.jpg",
"date": "10 六月 2025",
"category": "在 TI 的生活"
},
{
"name": "3 ways semiconductor innovation is powering an evolving energy landscape",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-ways-semiconductor-innovation-is-powering-an-evolving-landscape.html",
"headline": "半导体创新推动能源格局演变的三种方式",
"subheadline": "半导体技术的逐步提升助力构建可再生能源的未来",
"image": "/content/dam/ticom/images/people/employees/off-site/keith-ogboenyiya-distributech-keynote.jpg",
"date": "04 六月 2025",
"category": "技术"
},
{
"name": "im-a-tier-create-life-changing-products-here",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/im-a-tier-create-life-changing-products-here.html",
"headline": "我在这里定义改变生活的产品，与团队一起突破技术边界",
"subheadline": "我是 TI 人 | 在德州仪器（TI），我们正在塑造未来",
"image": "/content/dam/ticom/images/people/employees/on-site/female-employee-walking-in-ti-office.jpg",
"date": "30 5 月 2025",
"category": "在 TI 的生活"
},
{
"name": "Creating a Sustainable Future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/earth-day-creating-a-sustainable-future.html",
"headline": "地球日，TI 人用行动让世界更美好",
"subheadline": "创造可持续发展的未来",
"image": "/content/dam/ticom/images/people/employees/off-site/china-eco-week-2025.jpg",
"date": "28 四月 2025",
"category": "在 TI 的生活"
},
{
"name": "Looking for the future of autonomous driving? It’s in your car today",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/looking-for-the-future-of-autonomous-driving-its-in-your-car-today.html",
"headline": "自动驾驶的未来在何处？已然藏在您的爱车中",
"subheadline": "当今的半导体技术如何推动当下和未来自动驾驶领域的发展",
"image": "/content/dam/ticom/images/applications/sensing/autodriving-car-truck.jpg",
"date": "14 四月 2025",
"category": "技术"
},
{
"name": "Rewiring STEM education through an engineering mindset CN",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/rewiring-STEM-education-through-an-engineering-mindset.html",
"headline": "工程思维驱动 STEM 教育革新",
"subheadline": "德州仪器工程师和领导者们凭借专业技术知识、商业专长以及亲身参与，助力女性学生迈向 STEM 职业道路，获得了德州仪器的最高志愿者奖项。 ",
"image": "/content/dam/ticom/images/people/employees/off-site/employees-community-service.jpg",
"date": "24 三月 2025",
"category": "在 TI 的生活"
},
{
"name": "I am a TIer Aki",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/im-a-tier-i-milestone-for-working-at-ti.html",
"headline": "我是 TI 人 | 听他说，追逐职业与人生的里程碑……",
"subheadline": "广阔平台、丰富资源，他在TI创造未来。",
"image": "/content/dam/ticom/images/people/employees/on-site/i-am-a-tier-aki.jpg",
"date": "14 三月 2025",
"category": "在 TI 的生活"
},
{
"name": "Software-defined future: Why prioritizing software is essential",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/software-defined-future-why-prioritizing-software-is-essential.html",
"headline": "软件定义未来：为何软件优先至关重要",
"subheadline": "软件的灵活性、互操作性与标准化如何引领未来创新",
"image": "/content/dam/ticom/images/themes/business/embedded-ecosystems-software.jpg",
"date": "06 二月 2025",
"category": "技术"
},
{
"name": "2024 TI China Bring Kids to Work Recap",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/2024-tichina-bring-kids-to-work.html",
"headline": "德州仪器带小孩上班日，精彩瞬间点击开启！",
"subheadline": "“小小TI人”，跟着爸妈上班行，智慧探索奇妙芯",
"image": "/content/dam/ticom/images/people/students/ti-china-bring-kids-to-work-day-2024.jpg",
"date": "20 一月 2025",
"category": "在 TI 的生活"
},
{
"name": "Redefining the commute: The advanced audio technology transforming your drive",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/redefining-the-commute-the-advanced-audio-technology-transforming-your-drive.html",
"headline": "重塑通勤体验：先进音频技术革新您的驾乘之旅",
"subheadline": "从环绕声到降噪，我们已蓄势待发，全面拥抱汽车音频技术的崭新未来",
"image": "/content/dam/ticom/images/applications/audio/immersive-auto-cabin-audio.jpg",
"date": "03 一月 2025",
"category": "技术"
},
{
"name": "Embracing robotics: Innovations that benefit society",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/embracing-robotics-innovations-that-benefit-society.html",
"headline": "拥抱机器人技术：造福社会的创新之举",
"subheadline": "在工业和个人生活层面，机器人正在积极地改善我们的日常生活",
"image": "/content/dam/ticom/images/people/employees/on-site/ti-errol-leon-stands-in-front-of-humanoid.jpg",
"date": "03 一月 2025",
"category": "技术"
},
{
"name": "The importance of reducing waste in our journey to create a more sustainable future ",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-importance-of-reducing-waste-in-our-journey-to-create-a-more-sustainable-future.html",
"headline": "减少废弃物对可持续发展未来的重要性",
"subheadline": "随着半导体需求的增长，我们在运营和制造过程中实施的一系列减少废弃物的战略计划，正在不断加强我们对环境保护的承诺。",
"image": "/content/dam/ticom/images/people/employees/off-site/waste-management-recycling-service.jpg",
"date": "20 十二月 2024",
"category": "在 TI 的生活"
},
{
"name": "Everyday industrial: The unsung technologies enhancing everyday life",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/everyday-industrial--the-unsung-technologies-enhancing-everyday-life.html",
"headline": "日常生活中的工业技术：助力智能生活的幕后力量",
"subheadline": "为什么工业应用是引领更可持续、更便利和更安全的生活不可或缺的一部分",
"image": "/content/dam/ticom/images/applications/industrial/everyday-industrial-edge-ai.jpg",
"date": "12 十二月 2024",
"category": "技术"
},
{
"name": "Shaping the future together: insights from TIers about building an impactful career ",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/shaping-the-future-together-insights-from-tiers-about-building-an-impactful-career.html",
"headline": "携手共同塑造未来：德州仪器（TI）员工分享如何打造有影响力的职业生涯",
"subheadline": "来自德州仪器的三名员工，分享了自己不同职业发展阶段的心得，以及如何利用自己独特的技能和经验发挥重要的影响。",
"image": "/content/dam/ticom/images/people/employees/on-site/holly-gu-engaging-with-her-laptop-at-a-table.jpg",
"date": "06 十二月 2024",
"category": "在 TI 的生活"
},
{
"name": "3 ways software-defined vehicles will transform the automotive industry",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-ways-software-defined-vehicles-will-transform-the-automotive-industry.html",
"headline": "软件定义车辆改变汽车行业的 3 种方式",
"subheadline": "支持软件的车辆对于制造商、驾驶员和乘客有何意义",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-front-of-a-blue-vehicle.jpg",
"date": "03 十二月 2024",
"category": "技术"
},
{
"name": "Living on the edge: How edge AI enhances everyday experiences",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/living-on-the-edge-how-edge-AI-enhances-everyday-experiences.html",
"headline": "边缘创新：边缘 AI 如何提升日常体验",
"subheadline": "边缘 AI 使嵌入式设备能够更高效地使用传感器数据，并提升我们的日常体验。",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/house-with-solar-panels.jpg",
"date": "08 十一月 2024",
"category": "技术"
},
{
"name": "How open-source software is driving the adoption of standards in EV charging",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-open-source-software-is-driving-the-adoption-of-standards-in.html",
"headline": "开源软件如何推动 EV 充电标准的普及",
"subheadline": "开源软件对于 EV 充电、互操作性及 EV 市场意义重大",
"image": "/content/dam/ticom/images/applications/automotive/ti-automotive-applications.jpg",
"date": "21 十月 2024",
"category": "技术"
},
{
"name": "Out of this world: How semiconductor technology enables research from space",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/semiconductor-technology-enables-environmental-research-from-space.html",
"headline": "超越常规：半导体技术如何推动太空中的环境研究",
"subheadline": "为什么成像技术、器件分级和封装可以帮助我们了解地球",
"image": "/content/dam/ticom/images/applications/space/sweep-satellite-over-earth-in-space.jpg",
"date": "03 十月 2024",
"category": "技术"
},
{
"name": "Texas Instruments for love — light up dreams and build stronger communities",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/texas-instruments-for-love-light-up-dreams-and-build-stronger-communities.html",
"headline": "德州仪器为爱行 - 点亮梦想，持续建设更强大的社区",
"subheadline": "用“芯”创造可持续发展的未来",
"image": "/content/dam/ticom/images/people/students/chinese-students-at-classroom-csr-recap.jpg",
"date": "16 九月 2024",
"category": "在 TI 的生活"
},
{
"name": "Equipping the next generation of young female innovators through STEM",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/equipping-the-next-generation-of-young-female-innovators-through-stem.html",
"headline": "破茧成蝶：用 STEM 赋能下一代女性创新者崛起",
"subheadline": "在世界各地，德州仪器与员工们持续发扬创新影响力，通过投资各种计划和建立伙伴关系，培养女孩们的 STEM（科学、技术、工程和数学）自信心，助力塑造美好未来。",
"image": "/content/dam/ticom/images/people/students/inspire-girls-in-stem.jpg",
"date": "09 九月 2024",
"category": "在 TI 的生活"
},
{
"name": "Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/breaking-the-mold-how-a-new-magnetic-packaging-technology-will-reshape-the-future-of-power-modules.html",
"headline": "打破陈规：磁性封装新技术将如何重塑电源模块的未来",
"subheadline": "德州仪器全球团队坚持克服挑战，为电源模块开发新的 MagPack™ 封装技术，这是一项将帮助推动电源设计未来的突破性技术。",
"image": "/content/dam/ticom/images/people/employees/off-site/kenji-kawano-outdoor-running.jpg",
"date": "09 八月 2024",
"category": "技术"
},
{
"name": "The inception of digital cinema and the journey ahead",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-inception-of-digital-cinema-and-the-journey-ahead.html",
"headline": "数字电影：创启华章，征程未央",
"subheadline": "德州仪器这一项技术，改变现在与未来的交互体验。",
"image": "/content/dam/ticom/images/people/employees/off-site/jeff-marsh-dlp25-behind-the-scenes.jpg",
"date": "24 七月 2024",
"category": "技术"
},
{
"name": "I’m a TIer | I never stop doing what I love at TI",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/im-a-tier-i-never-stop-doing-what-i-love-at-ti.html",
"headline": "我是 TI 人 | 听她说，在 TI 与爱同行，从未停歇……",
"subheadline": "她，在做好事中收获成长",
"image": "/content/dam/ticom/images/people/employees/off-site/tier-running-in-the-park.jpg",
"date": "22 七月 2024",
"category": "在 TI 的生活"
},
{
"name": "I’m a TIer | Hear from him about the path to career growth",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/im-ia-tier-hear-from-him-about-the-path-to-career-growth.html",
"headline": "我是 TI 人 | 听他说，职业成长之路",
"subheadline": "持续学习先进工艺和跨文化协作，让我不断成长",
"image": "/content/dam/ticom/images/people/employees/on-site/xiaoke-on-site.jpg",
"date": "03 六月 2024",
"category": "在 TI 的生活"
},
{
"name": "Composing a career from intern to leader",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/composing-a-career-from-intern-to-leader.html",
"headline": "从实习生到领导团队：谱写职业发展的乐章",
"subheadline": "一个热爱音乐、善于解决问题的实习生，成长为我们模拟音频业务部领导的故事",
"image": "/content/dam/ticom/images/people/employees/on-site/vikas-s-v-holding-guitar-sitting-on-sofa.jpg",
"date": "29 5 月 2024",
"category": "在 TI 的生活"
},
{
"name": "Exploring the essential role of analog technology",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/exploring-the-essential-role-of-analog-technology.html",
"headline": "探索模拟技术的重要作用",
"subheadline": "与德州仪器模拟信号链业务部负责人探讨通用模拟 IC 对电子设计的重要性",
"image": "/content/dam/ticom/images/people/employees/on-site/hagop-kozanian-on-site.jpg",
"date": "30 四月 2024",
"category": "技术"
},
{
"name": "Seamless connectivity for vehicle networking",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/seamless-connectivity-for-vehicle-networking.html",
"headline": "实现车辆组网的无缝连接",
"subheadline": "区域架构设计趋势如何改善汽车通信",
"image": "/content/dam/ticom/images/applications/automotive/connected-vehicle-zonal-architecture.jpg",
"date": "01 四月 2024",
"category": "技术"
},
{
"name": "The importance of ensuring supply for foundational semiconductor chips",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-importance-of-ensuring-supply-for-foundational-semiconductor-chips.html",
"headline": "为什么 45 纳米至 130 纳米的工艺节点很重要？",
"subheadline": "保障基础半导体芯片供应的重要性",
"image": "/content/dam/ticom/images/applications/industrial/essential-semiconductor-chips.jpg",
"date": "20 三月 2024",
"category": "制造"
},
{
"name": "TI employees globally have a legacy of giving back",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-employees-globally-have-a-legacy-of-giving-back.html",
"headline": "德州仪器全球员工积极传承回馈社会的优良传统",
"subheadline": "我们齐心协力，致力于建设更强大的社区。",
"image": "/content/dam/ticom/images/people/students/students-participating-on-hope-for-pearl-cn.jpg",
"date": "25 二月 2024",
"category": "在 TI 的生活"
},
{
"name": "Low-IQ technologies deliver more efficient power management",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/loq-iq-technologies-deliver-more-efficient-power-management.html",
"headline": "低 IQ 技术可实现更高效的电源管理",
"subheadline": "随着市场对电池供电型应用的需求继续迅速增长，低 IQ 技术可帮助在不影响系统性能的情况下延长电池寿命",
"image": "/content/dam/ticom/images/themes/circuits/low-iq-extended-battery-life.jpg",
"date": "14 十二月 2023",
"category": "技术"
},
{
"name": "Texas Instruments takes children to work day: Light the next generation with a “chip” and explore technology for the future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/texas-instruments-takes-children-to-work-day-light-the-next-generation-with-a-chip-and-explore-technology-for-the-future.html",
"headline": "德州仪器带小孩上班日：用“芯”照亮下一代，探索科技赴未来",
"subheadline": "科技与趣味连接工作与家庭",
"image": "/content/dam/ticom/images/people/employees/on-site/bring-kids-to-work-china.jpg",
"date": "08 十二月 2023",
"category": "在 TI 的生活"
},
{
"name": "The battery-management technology that will strengthen our grid",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-battery-management-technology-that-will-strengthen-our-grid.html",
"headline": "有助于强化电网的电池管理技术",
"subheadline": "电池系统中的半导体创新正在推动储能技术的应用",
"image": "/content/dam/ticom/images/applications/grid-infrastructure/battery-ess.jpg",
"date": "07 十二月 2023",
"category": "技术"
},
{
"name": "6 semiconductor technologies that help create safer, smarter vehicles",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/6-semiconductor-technologies-that-help-create-safer-smarter-vehicles.html",
"headline": "六大半导体技术助力构建更安全、更智能的车辆",
"subheadline": "从前保险杠到后保险杠，从车顶到车轮，汽车上使用的高效创新型半导体技术越来越多",
"image": "/content/dam/ticom/images/people/employees/on-site/fern-yoon-standing-on-site.jpg",
"date": "17 十一月 2023",
"category": "技术"
},
{
"name": "Q&A: How TI is creating a sustainable future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/qa-how-ti-is-creating-a-sustainable-future.html",
"headline": "问答：德州仪器如何助力打造可持续发展的未来",
"subheadline": "德州仪器全球环境、安全和健康部门负责人分享了公司悠久的可持续发展历史，以及如何降低对环境的影响",
"image": "/content/dam/ticom/images/people/employees/on-site/heidi-means-in-rfab.jpg",
"date": "16 十一月 2023",
"category": "在 TI 的生活"
},
{
"name": "In the factory and beyond, how robots are enhancing our world",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/in-the-factory-and-beyond-how-robots-are-enhancing-our-world.html",
"headline": "在工厂内外，机器人如何改善我们的世界",
"subheadline": "曾几何时，机器人是我们对未来的一种憧憬，而如今幻梦成真，机器人能够帮助人类在几乎任何环境下提高生产力、效率和安全性",
"image": "/content/dam/ticom/images/applications/industrial/robotics-automation.jpg",
"date": "08 十一月 2023",
"category": "技术"
},
{
"name": "Why accurate and reliable high-voltage sensing is critical to the future of electrification",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/why-accurate-and-reliable-high-voltage-sensing-is-critical-to-the-future-of-electrification.html",
"headline": "为何准确可靠的高压检测对于电气化的未来至关重要",
"subheadline": "温度、电流和电压测量技术有助于加快从化石燃料到可再生能源的转变",
"image": "/content/dam/ticom/images/applications/sensing/high-voltage-sensing-daytime.jpg",
"date": "12 十月 2023",
"category": "技术"
},
{
"name": "Light up a little “chip” wish to open up endless possibilities",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/light-up-a-little-chip-wish-to-open-up-endless-possibilities.html",
"headline": "点亮小小“芯”愿，开启无限可能",
"subheadline": "德州仪器公益行 – 孩子们的澳门科创之旅",
"image": "/content/dam/ticom/images/people/students/g-v-activity.jpg",
"date": "11 十月 2023",
"category": "在 TI 的生活"
},
{
"name": "How new connectivity technologies are lowering the barriers to Industry 4.0",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-new-connectivity-technologies-are-lowering-the-barriers-to-industry-4-0.html",
"headline": "新连接技术如何降低工业 4.0 的壁垒",
"subheadline": "当今工厂的网络架构不断发展，实现了更高的效率、安全性和可持续性。",
"image": "/content/dam/ticom/images/applications/factory-automation/connected-factory.jpg",
"date": "30 八月 2023",
"category": "技术"
},
{
"name": "How semiconductor innovations are making edge AI the future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-semiconductor-innovations-are-making-edge-ai-the-future.html",
"headline": "半导体创新如何塑造边缘 AI 的未来",
"subheadline": "处理器和软件的创新使得边缘智能更简单、更易使用并且更易于广泛实现",
"image": "/content/dam/ticom/images/themes/edge-ai/edge-ai-am6xa-graphic-platform.jpg",
"date": "29 八月 2023",
"category": "技术"
},
{
"name": "TI-China volunteer: Ying-ying Microlight, illuminating the “chip” journey",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-china-volunteer-ying-ying-microlight-illuminating-the-chip-journey.html",
"headline": "德州仪器中国员工志愿者：莹莹微光，照亮爱“芯”旅程",
"subheadline": "一直以来，德州仪器初心未改，致力于通过半导体技术让电子产品更经济实用，让世界更美好。",
"image": "/content/dam/ticom/images/people/students/smiling-students-at-classroom.jpg",
"date": "23 八月 2023",
"category": "在 TI 的生活"
},
{
"name": "The symphony of precision: Harmonizing power and signal integrity with low-noise technology",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-symphony-of-precision-harmonizing-power-and-signal-integrity-with-low-noise-technology.html",
"headline": "一场精度的“交响乐”：以低噪声技术协调电源和信号完整性",
"subheadline": "低噪声和高精度技术的创新不断推动医疗、测试和测量以及电动汽车电池管理系统的性能大幅提升。",
"image": "/content/dam/ticom/images/people/employees/on-site/steven-schnier-talking-to-colleagues.jpg",
"date": "13 六月 2023",
"category": "技术"
},
{
"name": "How TI’s investments in back-end manufacturing are helping build capacity for decades to come",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-tis-investments-in-back-end-manufacturing-are-helping-build-capacity-for-decades-to-come.html",
"headline": "德州仪器对后端制造业务的投资如何帮助满足未来几十年的产能需求",
"subheadline": "我们致力于在马来西亚的吉隆坡和马六甲扩展封装测试业务，不断践行提供更出色供应保障和满足客户需求的长期战略",
"image": "/content/dam/ticom/images/themes/facilities/chengdu-at-10-flip.jpg",
"date": "13 六月 2023",
"category": "制造"
},
{
"name": "Q&A: TI is inspiring a global culture of building stronger communities",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/qa-ti-is-inspiring-a-global-culture-of-building-stronger-communities.html",
"headline": "问答：德州仪器鼓励发扬建设更强大社区的全球性文化",
"subheadline": "Andy Smith 是德州仪器捐助和志愿服务团队的负责人，也是德州仪器基金会的执行董事。在这篇文章中，他讨论了如何将慈善精神植根到德州仪器的企业文化中，如何将我们生活和工作的社区建设得更强大，以及回馈社会对于他的意义。",
"image": "/content/dam/ticom/images/people/students/reading-day22.jpg",
"date": "23 5 月 2023",
"category": "在 TI 的生活"
},
{
"name": "How semiconductors enable the future of energy",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-semiconductors-enable-the-future-of-energy.html",
"headline": "半导体如何实现能源可持续未来",
"subheadline": "模拟和嵌入式处理产品将通过更智能、更可靠和更易用的太阳能、储能和电动汽车充电系统实现电气化",
"image": "/content/dam/ticom/images/people/employees/off-site/renewable-energy.jpg",
"date": "18 四月 2023",
"category": "技术"
},
{
"name": "3 trends impacting the future of embedded processing technology",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-trends-impacting-the-future-of-embedded-processing-technology.html",
"headline": "影响嵌入式处理技术未来发展的三个趋势",
"subheadline": "让嵌入式未来成为可能的技术正在变革智能家居、城市、工厂和汽车领域，优化日常电子产品，并开启创造更美好世界的新途径",
"image": "/content/dam/ticom/images/applications/industrial/gp-platform-process-warehouse.jpg",
"date": "07 四月 2023",
"category": "技术"
},
{
"name": "3 reasons GaN is changing power management",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-reason-gan-is-changing-power-management.html",
"headline": "氮化镓 (GaN) 带来电源管理变革的 3 大原因",
"subheadline": "氮化镓正取代硅，越来越多地用于需要更大功率密度和更高能效的应用中",
"image": "/content/dam/ticom/images/applications/enterprise-system/hv-foundation-delta-server.jpg",
"date": "04 四月 2023",
"category": "技术"
},
{
"name": "How vehicle networks help keep drivers safe",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-vehicle-networks-help-keep-drivers-safe.html",
"headline": "车载网络如何帮助保障驾驶员安全",
"subheadline": "借助集成和连接的通信协议将车辆安全提升到新水平",
"image": "/content/dam/ticom/images/applications/automotive/adas-vehicle-networks.jpg",
"date": "23 三月 2023",
"category": "技术"
},
{
"name": "Q&A: Pradeep Shenoy shares how he’s inspiring the next generation of power engineers",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/qa-pradeep-shenoy-shares-how-hes-inspiring-the-next-generation-of-power-engineers.html",
"headline": "问答：Pradeep Shenoy 分享如何激励下一代电力工程师",
"subheadline": "汽车电源设计服务团队的负责人论述了他如何主持应用电力电子会议并使其让更多人参加，以及为何热衷于打造汽车的未来",
"image": "/content/dam/ticom/images/people/employees/on-site/pradeep-shenoy-working-in-lab.jpg",
"date": "14 三月 2023",
"category": "在 TI 的生活"
},
{
"name": "Texas Instruments: Join with the "chip" and go along the way",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/texas-instruments-join-with-the-chip-and-go-along-the-way.html",
"headline": "德州仪器：用“芯”相伴，一路同行",
"subheadline": "客户成长的道路上，德州仪器一直伴随左右。 从选型、设计到产品量产， 我们提供全方位本土化支持。",
"image": "/content/dam/ticom/images/themes/infographic/china-local-support-robotics.jpg",
"date": "09 三月 2023",
"category": "在 TI 的生活"
},
{
"name": "Ultrasonic lens cleaning brings camera reliability into focus",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ultrasonic-lens-cleaning-brings-camera-reliability-into-focus.html",
"headline": "超声波镜头清洗技术使摄像头可靠性成为焦点",
"subheadline": "随着自主技术的进步，车辆、无人机、机器人等设备上的摄像头和传感器数量成倍增加，纯电动式清洗方法应运而生",
"image": "/content/dam/ticom/images/applications/automotive/ultra-lens-cleaning-side-mirror-auto.jpg",
"date": "02 二月 2023",
"category": "技术"
},
{
"name": "High-voltage technologies are key to empowering a more sustainable future",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/high-voltage-technologies-are-key-to-empowering-a-more-sustainable-future.html",
"headline": "高电压技术是构建更可持续未来的关键",
"subheadline": "随着电气化的普及，半导体创新使我们能够与电动汽车、可再生能源和其他高压系统安全可靠地进行交互。",
"image": "/content/dam/ticom/images/applications/automotive/ev-charging-hvfoundation.jpg",
"date": "30 一月 2023",
"category": "技术"
},
{
"name": "Haviv Ilan to become next president and CEO of TI",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/haviv-ilan-to-become-next-president-and-ceo-of-ti.html",
"headline": "Haviv Ilan将担任德州仪器(TI)下一任总裁及首席执行官",
"subheadline": "现任首席执行官Rich Templeton将继续担任公司董事长",
"image": "/content/dam/ticom/images/people/employees/on-site/ceo-haviv-ilan.jpg",
"date": "19 一月 2023",
"category": "在 TI 的生活"
},
{
"name": "5 reasons EVs are here to stay",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/5-reasons-evs-are-here-to-stay.html",
"headline": "电动汽车渐成主流的 5 个理由",
"subheadline": "半导体创新技术为电动汽车提供动力，消除了电动汽车普及的障碍，并使汽车制造商能够设计出深受消费者青睐的经济型汽车。",
"image": "/content/dam/ticom/images/people/employees/off-site/mark-ng-in-car.jpg",
"date": "04 一月 2023",
"category": "技术"
},
{
"name": "TI’s latest 300-millimeter wafer fab in Lehi, Utah, begins production",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/tis-latest-300-millimeter-wafer-fab-in-lehi-utah-begins-production.html",
"headline": "德州仪器位于美国犹他州李海的新12英寸晶圆制造厂开始投产",
"subheadline": "LFAB于2021年被收购，是我们在2022年投产的第二家12英寸晶圆厂",
"image": "/content/dam/ticom/images/themes/facilities/lfab-front-entrance-aerial-view.jpg",
"date": "06 十二月 2022",
"category": "制造"
},
{
"name": "It’s a Matter of standardization: new wireless protocol provides a connected foundation for smart devices",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/its-a-matter-of-standardization-new-wireless-protocol-provides-a-connected-foundation-for-smart-devices.html",
"headline": "利用 Matter 协议实现标准化：全新无线协议为智能设备互联构筑基石",
"subheadline": "随着智能、互联设备日益融入我们的日常生活，Matter 无线连接协议旨在将分散的物联网生态系统统一起来",
"image": "/content/dam/ticom/images/applications/home-automation/matter-connected-applications-home.jpg",
"date": "29 十一月 2022",
"category": "技术"
},
{
"name": "A story behind an order",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/a-story-behind-an-order.html",
"headline": "一个订单背后的故事",
"subheadline": "一键值购，便利直达，助力客户成功",
"image": "/content/dam/ticom/images/themes/infographic/worker-efficiently-sorts-boxes-in-warehouse-environment-cn.jpg",
"date": "09 十一月 2022",
"category": ""
},
{
"name": "5 things you should know about V2G",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/5-things-you-should-know-about-v2g.html",
"headline": "关于车辆到电网（V2G）的 5 个须知事项",
"subheadline": "随着日益增长的用电需求不断突破电网限制，车辆到电网 (V2G) 双向充电能够帮助消除峰值容量",
"image": "/content/dam/ticom/images/applications/automotive/vehicle-to-grid.jpg",
"date": "08 十一月 2022",
"category": "技术"
},
{
"name": "Q&A: How TI is investing in manufacturing capacity to support growth for decades to come",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/qa-how-ti-is-investing-in-manufacturing-capacity-to-support-growth-for-decades-to-come.html",
"headline": "问答：TI 如何投资产能以满足未来几十年的增长需求",
"subheadline": "我们的技术和制造组负责人 Kyle Flessner 讨论了 TI 关于长期扩大自有产能的计划",
"image": "/content/dam/ticom/images/people/employees/on-site/flessner-kyle-manufacturing.jpg",
"date": "01 十一月 2022",
"category": "制造"
},
{
"name": "How thermal efficiency is helping data centers run more sustainably",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-thermal-efficiency-is-helping-data-centers-run-more-sustainably.html",
"headline": "热效率如何助力实现数据中心更可持续运行",
"subheadline": "随着服务器功率需求的增加，创新的半导体设计和封装技术在不断提高数据中心的效率",
"image": "/content/dam/ticom/images/applications/enterprise-system/thermals-power-density.jpg",
"date": "25 十月 2022",
"category": "技术"
},
{
"name": "TI’s new 300-millimeter wafer fab in Richardson, Texas, begins initial production",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/tis-new-300-millimeter-wafer-fab-in-richardson-texas-begins-initial-production.html",
"headline": "TI位于美国德州理查森的新12英寸晶圆厂开始初步投产",
"subheadline": "我们正在构建半导体制造的新时代，以满足电子产品未来增长的需求",
"image": "/content/dam/ticom/images/themes/facilities/richardson-texas-wafer-fabs.jpg",
"date": "29 九月 2022",
"category": "制造"
},
{
"name": "From idea to invention: The origin story of the tiny chip that changed the world",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/from-idea-to-invention-the-origin-story-of-the-tiny-chip-that-changed-the-world.html",
"headline": "从创意到发明：改变世界的微型芯片的起源故事",
"subheadline": "堪萨斯州的一场冰风暴如何激发了 Jack Kilby 对电子产品的兴趣并推动其研发出第一个集成电路",
"image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-looking-at-integrated-circuit.jpg",
"date": "12 九月 2022",
"category": "技术"
},
{
"name": "Traction inverters: the intersection of automotive innovation and performance",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/traction-inverters-the-intersection-of-automotive-innovation-and-performance.html",
"headline": "牵引逆变器：汽车创新与性能的相互交融",
"subheadline": "新一代牵引逆变器中的半导体创新将有助于进一步提升电动汽车的性能，并带来更有趣的驾驶体验。",
"image": "/content/dam/ticom/images/applications/automotive/red-auto-mountain-road-traction-inverter.jpg",
"date": "12 九月 2022",
"category": "技术"
},
{
"name": "Why isolation matters for your power electronics",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/why-isolation-matters-for-your-power-electronics.html",
"headline": "为何隔离技术对电力电子产品至关重要",
"subheadline": "隔离技术的创新为实现更复杂的电动汽车、个人电子产品和医疗设备等铺平了道路",
"image": "/content/dam/ticom/images/applications/automotive/isolation-hand-charging-electric-vehicle.jpg",
"date": "30 八月 2022",
"category": "技术"
},
{
"name": "The vehicle-to-grid vision: unleashing the power of electric vehicles",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-vehicle-to-grid-vision-unleashing-the-power-of-electric-vehicles.html",
"headline": "车辆到电网愿景：释放电动汽车的潜能",
"subheadline": "借助半导体技术，车辆到电网(V2G)双向充电可以向电网提供储存在电池里的电能，以在用电需求高峰期增强电网功能，并在电费价格昂贵或停电时为您的住宅供电。",
"image": "/content/dam/ticom/images/applications/automotive/vehicle-grid-technology.jpg",
"date": "23 八月 2022",
"category": "技术"
},
{
"name": "The birth of a chip in TI China",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-birth-of-a-chip-in-ti-china.html",
"headline": "一颗芯片在TI中国的诞生",
"subheadline": "助力汽车和工业客户应对严苛设计挑战",
"image": "/content/dam/ticom/images/themes/infographic/integrated-rd-chip-is-born-cn.jpg",
"date": "15 八月 2022",
"category": ""
},
{
"name": "From sun to switch, semiconductors enable the journey of energy",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/from-sun-to-switch-semiconductors-enable-the-journey-of-energy.html",
"headline": "将能量从太阳输送至开关，半导体芯片助力能量之旅",
"subheadline": "随着可再生能源日益普及，半导体芯片可以高效、安全地将能量输送到越来越多的家庭、建筑和城市",
"image": "/content/dam/ticom/images/applications/industrial/residential-solar-panels.jpg",
"date": "02 八月 2022",
"category": "技术"
},
{
"name": "Space-grade ICs help the James Webb Telescope peer deep into the cosmos",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/space-grade-ics-help-the-james-webb-telescope-peer-deep-into-the-cosmos.html",
"headline": "航天级IC助推詹姆斯·韦伯太空望远镜深入探索宇宙奥秘",
"subheadline": "NASA发布了使用其超大超强太空望远镜以空前分辨率和灵敏度观测宇宙时拍摄的首批图像。",
"image": "/content/dam/ticom/images/applications/space/webb-telescope.jpg",
"date": "19 七月 2022",
"category": "技术"
},
{
"name": "3 ways semiconductors enhance automation and efficiency",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-ways-semiconductors-enhance-automation-and-efficiency.html",
"headline": "半导体提高自动化和效率的 3 种方式",
"subheadline": "从机器人技术到工厂自动化、电网和家居自动化等, 半导体技术助力最大限度提高一系列工业系统的生产力",
"image": "/content/dam/ticom/images/applications/industrial/enhancing-automation-warehouse.jpg",
"date": "28 六月 2022",
"category": "技术"
},
{
"name": "How sensor fusion is driving vehicle autonomy forward",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-sensor-fusion-is-driving-vehicle-autonomy-forward.html",
"headline": "如何通过传感器融合技术提升自动驾驶水平",
"subheadline": "随着 ADAS 技术扩展至紧急刹车、前方碰撞警告和避让以及盲点探测等时间敏感型关键应用领域，它可通过结合来自多个传感器的数据实时提供可靠的决策，从而带来更安全的自动驾驶体验",
"image": "/content/dam/ticom/images/applications/automotive/real-time-processing.jpg",
"date": "07 六月 2022",
"category": "技术"
},
{
"name": "5 trends shaping the future of power management",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/5-trends-shaping-the-future-of-power-management.html",
"headline": "塑造电源管理未来的 5 大趋势",
"subheadline": "得益于功率密度、电磁干扰、隔离、静态电流以及噪声和精度等方面性能的改善，设计师可以进一步推动电源发展",
"image": "/content/dam/ticom/images/people/employees/on-site/jeff-morroni-showing-small-ic.jpg",
"date": "06 四月 2022",
"category": "技术"
},
{
"name": "Sensor fusion is enabling the next wave of smart, autonomous robots",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/sensor-fusion-is-enabling-the-next-wave-of-smart-autonomous-robots.html",
"headline": "传感器融合正在催生新一波智能自主机器人",
"subheadline": "机器人中模拟人类视觉的传感器正在加速自动化，提高可靠性和安全性，让我们的生活更轻松",
"image": "/content/dam/ticom/images/applications/industrial/robots-moving-boxes-in-warehouse.jpg",
"date": "29 三月 2022",
"category": "技术"
},
{
"name": "TI programs in university engineering education",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-programs-in-university-engineering-education.html",
"headline": "高校工程教育，TI芯相随",
"subheadline": "了解更多TI中国 在TI，我们相信改变世界的可能性，所需要的是你的好奇心和教育。",
"image": "/content/dam/ticom/images/themes/infographic/a-worker-collaborate-on-electronics-work.jpg",
"date": "24 二月 2022",
"category": "在 TI 的生活"
},
{
"name": "Building a fast, flexible EV charging network",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/building-a-fast-flexible-EV-charging-network.html",
"headline": "构建快速、灵活的电动汽车充电网络",
"subheadline": "在我们未来的电动汽车行业中，半导体技术将为电网运营商提供更大的灵活性，从而更好地管理能源基础设施",
"image": "/content/dam/ticom/images/people/employees/off-site/henrik-mannesson-electric-car.jpg",
"date": "08 二月 2022",
"category": "技术"
},
{
"name": "What’s next in BMS? Safer, more affordable electric vehicles",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/whats-next-in-bms-safer-more-affordable-electric-vehicles.html",
"headline": "BMS 的下一个目标是什么？更安全、更经济实惠的电动汽车",
"subheadline": "随着汽车制造商考虑新的电动汽车电池化学成分，采用先进半导体技术的电池管理系统 (BMS) 比以往更加重要",
"image": "/content/dam/ticom/images/applications/automotive/red-car-wheat-field.jpg",
"date": "25 一月 2022",
"category": "技术"
},
{
"name": "Dan Wang on enabling a safer world with TI mmWave radar: ‘It’s just the beginning’",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/dan-wang-on-enabling-a-safer-world-with-ti-mmwave-radar-its-just-the-beginning.html",
"headline": "Dan Wang畅想使用TI毫米波雷达构建更安全的世界: “一切才刚开始”",
"subheadline": "作为毫米波雷达应用领域的领军人物，Dan憧憬着传感技术的未来",
"image": "/content/dam/ticom/images/people/employees/on-site/dan-wang.jpg",
"date": "10 一月 2022",
"category": "技术"
},
{
"name": "TI has local support to simplify your selection, design and purchase",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/ti-has-local-support-to-simplify-your-selection-design-and-purchase.html",
"headline": "TI全方位本地支持，简化您的选型、设计及购买",
"subheadline": "了解更多TI中国 环顾四周，我们的世界日新月异。更智能、更安全、更互联、更节能。 这一切改变的背后，源自孜孜不倦的创新。",
"image": "/content/dam/ticom/images/themes/infographic/china-local-support-robotics.jpg",
"date": "13 十二月 2021",
"category": ""
},
{
"name": "7 ways semiconductors are accelerating the future of automotive technology",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/7-ways-semiconductors-are-accelerating-the-future-of-automotive-technology.html",
"headline": "半导体技术加速汽车技术未来发展的7种方式",
"subheadline": "在全球大力发展汽车电气化的趋势下，半导体技术可助力汽车制造商优化性能、加快开发速度并为更多人提供性价比更高的电动汽车。",
"image": "/content/dam/ticom/images/people/employees/off-site/keith-ogboenyiya-automotive.jpg",
"date": "30 十一月 2021",
"category": "技术"
},
{
"name": "Q&A: How low quiescent current is transforming battery-powered devices",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/qa-how-low-quiescent-current-is-transforming-battery-powered-devices.html",
"headline": "深度对话：低静态电流如何改变电池供电设备",
"subheadline": "低静态电流可延长智能手表和烟雾探测器等设备的电池寿命",
"image": "/content/dam/ticom/images/people/employees/off-site/keith-kunz-running-on-trail-timg.jpg",
"date": "10 十一月 2021",
"category": "技术"
},
{
"name": "ADAS: The technology driving automotive safety forward",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/adas-the-technology-driving-automotive-safety-forward.html",
"headline": "ADAS：技术进步实现更安全的移动驾驶场景",
"subheadline": "使汽车更安全、更智能的高级驾驶辅助系统将帮助汽车制造商实现零碰撞的移动驾驶场景。",
"image": "/content/dam/ticom/images/applications/automotive/cars-using-adas-on-highway.jpg",
"date": "05 十月 2021",
"category": "技术"
},
{
"name": "Integrated manufacturing base in Chengdu to support core growth",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/integrated-manufacturing-base-in-chengdu-to-support-core-growth.html",
"headline": "成都一体化制造基地，助力芯成长",
"subheadline": "了解更多TI中国 在德州仪器 TI，我们致力于通过半导体技术让电子产品更经济实用，让世界更美好。",
"image": "/content/dam/ticom/images/themes/infographic/chengdu-manufacturing-employee-with-globe.jpg",
"date": "16 八月 2021",
"category": "制造"
},
{
"name": "From the rice fields to technology leadership",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/from-the-rice-fields-to-technology-leadership.html",
"headline": "从稻农成长为技术领导者",
"subheadline": "自从年轻时离开稻田追求个人事业发展以来，钱金荣一直开拓创新、锐意进取，为客户和公司创造价值。",
"image": "/content/dam/ticom/images/people/employees/on-site/jinrong-qian-outside-ti-south-campus.jpg",
"date": "10 八月 2021",
"category": "在 TI 的生活"
},
{
"name": "Bringing high-quality 3D printing to your desktop",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/bringing-high-quality-3d-printing-to-your-desktop.html",
"headline": "桌面级DLP®3D打印",
"subheadline": "TI DLP 技术降低了高质量 3D 打印技术的成本，使小型企业主、业余爱好者和其他人不再望“价格”而却步。",
"image": "/content/dam/ticom/images/applications/projection-display/dlp-3d-printing.jpg",
"date": "20 七月 2021",
"category": "技术"
},
{
"name": "Yilu, with Shan Wu Township",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/yilu-with-shan-wu-township.html",
"headline": "益路同行，与善吾乡",
"subheadline": "了解更多TI中国 一直以来，我们初心未改，通过半导体技术让电子产品经济实用，让我们的世界更美好",
"image": "/content/dam/ticom/images/themes/infographic/children-in-classroom.jpg",
"date": "08 七月 2021",
"category": "在 TI 的生活"
},
{
"name": "Developing the first ICs to orbit Earth",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/developing-the-first-ics-to-orbit-earth.html",
"headline": "开发第一款在太空中使用的IC",
"subheadline": "对于Charles“Bob”Cook来说，Jack Kilby委派的项目不仅促使开发出了第一个绕地球轨道运行的集成电路，还为未来的航天电子学奠定了基础。",
"image": "/content/dam/ticom/images/themes/size/charles-cook-holding-integrated-circuit.jpg",
"date": "24 六月 2021",
"category": "技术"
},
{
"name": "The power of packaging",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-power-of-packaging.html",
"headline": "封装的力量",
"subheadline": "随着电子产品变得越来越小并且集成了更多组件，保护集成电路的封装设计变得越来越重要。",
"image": "/content/dam/ticom/images/themes/size/small-packaging.jpg",
"date": "01 六月 2021",
"category": "技术"
},
{
"name": "The North, Shanghai, and Shenzhen Research and Development Centre provides insight into local needs",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-north-shanghai-and-shenzhen-research-and-development-centre-provides-insight-into-local-needs.html",
"headline": "北上深三地研发中心，洞悉本土需求",
"subheadline": "引领创新，服务中国和全球市场",
"image": "/content/dam/ticom/images/themes/infographic/engineer-in-lab.jpg",
"date": "25 5 月 2021",
"category": "技术"
},
{
"name": "Carmakers charge ahead with electric vehicle powertrain integration",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/carmakers-charge-ahead-with-electric-vehicle-powertrain-integration.html",
"headline": "动力总成系统集成化推动电动汽车进一步高效、可靠、轻量化",
"subheadline": "通过将动力总成系统集成到紧凑的机械外壳中，可实现更实用、更高效的电动汽车 (EVs)。",
"image": "/content/dam/ticom/images/applications/automotive/integrated-power-train.jpg",
"date": "28 四月 2021",
"category": "技术"
},
{
"name": "Tackling the EMI challenge",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/tackling-the-emi-challenge.html",
"headline": "应对 EMI 挑战",
"subheadline": "由于消费者期望其电子产品具有更出色的性能，如何缓解电磁干扰 (EMI) 成为我们需要解决的重要问题。",
"image": "/content/dam/ticom/images/people/employees/on-site/jeff-meroni-engineering-progress.jpg",
"date": "19 四月 2021",
"category": "技术"
},
{
"name": "3 ways real-time control can make cities more sustainable",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/3-ways-real-time-control-can-make-cities-more-sustainable.html",
"headline": "三种实时控制方式促进城市可持续发展",
"subheadline": "从电动汽车充电站到太阳能解决方案，通过实时控制等先进技术，城市正在变得更加高效。",
"image": "/content/dam/ticom/images/themes/landmark/shanghai-skyline.jpg",
"date": "13 四月 2021",
"category": "技术"
},
{
"name": "Small satellites, big advances",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/small-satellites-big-advances.html",
"headline": "小型卫星也能出类拔萃",
"subheadline": "TI 的高可靠性航天级电源管理器件可帮助为下一代更智能、更小的卫星供电，从而使 NASA 的工程师们能够更好地探索宇宙",
"image": "/content/dam/ticom/images/applications/space/earth-with-illustrated-air-routes-network.jpg",
"date": "02 三月 2021",
"category": "技术"
},
{
"name": "More miles, fewer wires in future electric vehicles",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/more-miles-fewer-wires-in-future-electric-vehicles.html",
"headline": "里程更远，导线更少，电动汽车实现电池管理系统无线化",
"subheadline": "——随着下一代电池管理系统(BMS)实现无线化，电动汽车内部错综复杂的通信布线将减少，从而有助于延长行驶里程并提高可靠性。",
"image": "/content/dam/ticom/images/applications/automotive/wbms-car-nature.jpg",
"date": "06 一月 2021",
"category": "技术"
},
{
"name": "Driving the electric vehicle evolution with GaN",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/driving-the-electric-vehicle-evolution-with-gan.html",
"headline": "通过 GaN 推动电动汽车的发展",
"subheadline": "TI独特、高度集成的氮化镓（GaN）解决方案全面覆盖从入门级到高级的电动和混合动力汽车，让充电速度更快、行驶距离更远、受益人群范围更广。",
"image": "/content/dam/ticom/images/applications/automotive/electric-car-on-scenic-road.jpg",
"date": "09 十一月 2020",
"category": "技术"
},
{
"name": "The chip that changed the world",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-chip-that-changed-the-world.html",
"headline": "芯片改变世界",
"subheadline": "基于Jack Kilby的突破性发明来实现更安全的汽车、智能水表和袖珍型超声波设备。",
"image": "/content/dam/ticom/images/people/employees/on-site/jack-kilby-day.jpg",
"date": "16 九月 2020",
"category": "技术"
},
{
"name": "Doing more with less power",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/doing-more-with-less-power.html",
"headline": "更少功耗，完成更多任务",
"subheadline": "应对日益上涨电力需求的新挑战——如何在更小空间内封装更多电源，同时降低系统成本",
"image": "/content/dam/ticom/images/applications/enterprise-system/engineering-progress.jpg",
"date": "25 八月 2020",
"category": "技术"
},
{
"name": "Perfect timing",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/perfect-timing.html",
"headline": "Perfect timing",
"subheadline": "可实现与世界最大射电望远镜（平方公里阵列）同步的微芯片的内部原理",
"image": "/content/dam/ticom/images/applications/space/square-kilometer-array.jpg",
"date": "21 七月 2020",
"category": "技术"
},
{
"name": "The TI Cup is helping develop electronics engineering professionals in China ",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/the-ti-cup-is-helping-develop-electronics-engineering-professionals-in-china.html",
"headline": "TI杯助力中国电子工程专业人才培养",
"subheadline": "自2018年起至2027年，全国大学生电子设计竞赛，现称为“TI杯”，由德州仪器赞助并独家冠名，旨在帮助理工科学生在实践中强化工程设计技能。",
"image": "/content/dam/ticom/images/people/employees/off-site/ti-cup-competition.jpg",
"date": "15 六月 2020",
"category": "在 TI 的生活"
},
{
"name": "Helping our customers fight COVID-19, TI employees in action ",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/helping-our-customers-fight-covid-19-ti-employees-in-action.html",
"headline": "帮助我们的客户抗击新冠疫情, TI员工在行动",
"subheadline": "“您是否觉得呼吸困难？” 您的智能手机应用会每日向您发送问题进行询问。",
"image": "/content/dam/ticom/images/applications/medical/doctor-examining-patients-x-ray.jpg",
"date": "31 5 月 2020",
"category": "技术"
},
{
"name": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/how-two-engineers-used-problem-solving-to-turn-a-terminal-diagnosis-into-hope-for-their-son-and-countless-others.html",
"headline": "How two engineers used problem solving to turn a terminal diagnosis into hope for their son and countless others",
"subheadline": "Everything changed for TI engineers Matt and Gina Hann on March 7, when they were told to prepare for the end of their son’s life.",
"image": "/content/dam/ticom/images/people/employees/off-site/batten-hope-family.jpg",
"date": "19 九月 2017",
"category": "技术"
},
{
"name": "Why packaging is the next frontier in power design innovation",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/why-packaging-is-the-next-frontier-in-power-design-innovation.html"
},
{
"name": "Why packaging is the next frontier in power design innovation",
"path": "https://www.ti.com.cn/zh-cn/about-ti/behind-chip/articles/why-packaging-is-the-next-frontier-in-power-design-innovation.html"
}
]