选择版本

选择版本

未找到结果。请清除搜索,并重试。

SIMPLELINK-CC13X2-26X2-SDK

SimpleLink™ CC13x2 和 CC26x2 软件开发套件

选择版本
未找到结果。请清除搜索,并重试。
版本: 4.20.01.04
发布日期: 13 八月 2020

Windows Installer for Simplelink CC13X2 26X2 SDK.

MD5 校验和

Mac OS Installer for SimpleLink CC13X2 26X2 SDK.

MD5 校验和

Linux Installer for SimpleLink CC13X2 26X2 SDK.

MD5 校验和

Link to Windows Installer for Code Composer Studio IDE

Link to Mac OS Installer for Code Composer Studio IDE

Link to Linux Installer for Code Composer Studio IDE

lock = 需要出口许可(1 分钟)
产品
低功耗 2.4GHz 产品
CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2651P3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2651R3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2652P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU、704kB 闪存 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU CC2652RB 具有无晶振 BAW 谐振器的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652RSIP 具有 352KB 内存的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块
Sub-1GHz 无线 MCU
CC1311P3 具有 352KB 闪存和集成 +20dBm 功率放大器的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1311R3 具有 352kB 闪存的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1312R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU CC1312R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 无线 MCU CC1352P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU CC1352P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 和 2.4GHz 无线 MCU CC1352R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU
汽车类无线连接产品
CC2642R-Q1 符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
LAUNCHXL-CC1312R1 CC1312R LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352P CC1352P SimpleLink™ 多频带无线 MCU LaunchPad™ 开发套件 LAUNCHXL-CC1352R1 CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC26X2R1 CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LP-CC2652RB CC2652RB LaunchPad™ development kit for BAW multi-protocol 2.4-GHz SimpleLink™ wireless MCU LP-CC2652RSIP CC2652RSIP SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LPSTK-CC1352R SimplElink™ 多频带 CC1352R 无线 MCU LaunchPad™ SensorTag 套件

文档

SimpleLink CC13X2 26X2 SDK Documentation

最新动态

  • Added 6 to 10dBm support to the BLE Stack on PA Devices.
  • Fixed an issue where the TX power varied across channels when using Direct Test Mode on the CC1352P-2.

发布信息

The SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13x2 and CC26x2 family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13x2 and CC26x2 wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.1, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI's 15.4 Stack as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU through time division multiplexing.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

This is version 4.20.01.04 of the SimpleLink CC13x2 / CC26x2 SDK.