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SIMPLELINK-CC13X2-26X2-SDK

SimpleLink™ CC13x2 和 CC26x2 软件开发套件

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版本: 3.40.00.02
发布日期: 19 十二月 2019
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发布说明

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查看软件详细信息

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Windows Installer for Simplelink CC13X2 26X2 SDK  — 528056 K

Windows Installer for Simplelink CC13X2 26X2 SDK.

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Mac OS Installer for SimpleLink CC13X2 26X2 SDK  — 478910 K

Mac OS Installer for SimpleLink CC13X2 26X2 SDK.

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Linux Installer for SimpleLink CC13X2 26X2 SDK  — 478038 K

Linux Installer for SimpleLink CC13X2 26X2 SDK.

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产品
低功耗 2.4GHz 产品
CC2642R — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2651P3 — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2651R3 — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2652P — 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652P7 — 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU、704kB 闪存 CC2652R — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652R7 — 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU CC2652RB — 具有无晶振 BAW 谐振器的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652RSIP — 具有 352KB 内存的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块
Sub-1GHz 无线 MCU
CC1311P3 — 具有 352KB 闪存和集成 +20dBm 功率放大器的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1311R3 — 具有 352kB 闪存的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1312R — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU CC1312R7 — 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 无线 MCU CC1352P — 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU CC1352P7 — 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 和 2.4GHz 无线 MCU CC1352R — 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU
汽车类无线连接产品
CC2642R-Q1 — 符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
LAUNCHXL-CC1312R1 — CC1312R LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352P — CC1352P SimpleLink™ 多频带无线 MCU LaunchPad™ 开发套件 LAUNCHXL-CC1352R1 — CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC26X2R1 — CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LP-CC2652RB — CC2652RB LaunchPad™ development kit for BAW multi-protocol 2.4-GHz SimpleLink™ wireless MCU LP-CC2652RSIP — CC2652RSIP SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LPSTK-CC1352R — SimplElink™ 多频带 CC1352R 无线 MCU LaunchPad™ SensorTag 套件

文档

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Documentation Overview

SimpleLink CC13X2 26X2 SDK Documentation

最新动态

Bulk Acoustic Wave (BAW)

  • Initial production release of the SimpleLink™ CC2652RB Arm® Cortex®-M4F multiprotocol 2.4 GHz crystal-less BAW wireless MCU supporting Bluetooth Low Energy, Thread and Zigbee. Any CC2652RB applications developed using earlier SDKs must be updated to use this version of the SDK. Refer to the porting guide for more details.
  • The RF Lib now does continuous temperature compensation when running on the CC2652RB device. This will improve the device RF frequency consistency across the supported temperature range.

CC2642R-Q1

  • This is the first SDK that supports the Automotive AEC-Q100 qualified SimpleLink CC2642R-Q1 Bluetooth Low Energy wireless MCU. All Bluetooth 5.1 (BLE5-Stack), Real Time Localization Services (RTLS) and TI Drivers examples for the CC2642R are supported on the CC2642R-Q1. The CC26x2R LaunchPad is the development kit for the CC2642R-Q1.

Bluetooth 5.1 (BLE5-Stack)

  • It is now possible to follow up to eight connections while doing AoA. This allows one master to follow multiple slave nodes.
  • The multi role and OAD examples can now be run on the CC2652RB device.

TI 15.4-Stack

  • OAD for the TI 15.4-Stack has been updated to be more flexible and in most cases faster on low data rate connections. See the Turbo OAD feature chapter of the User’s Guide for more information.

RFLib

  • 2.4 GHz proprietary modes are now supported in SysConfig for all relevant devices.
  • RF driver now runs continuous temperature compensation when running on the CC2652RB device.

EasyLink

  • 2.4 GHz mode is now supported for all relevant devices.

Dynamic Multi-protocol Manager (DMM)

  • All 2.4 GHz examples can now be run on the CC2652RB device.

Updated CoreSDK component to version 4.40.00.03. The CoreSDK is comprised of the TI-RTOS SYS/BIOS kernel, DriverLib and TI Drivers.

Refer to the Document Overview for the individual release notes and details for starting development with each SDK component

Refer to the included Change Log for a summary of new features and fixed issues since the last SDK release

发布信息

The SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13x2 and CC26x2 family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13x2 and CC26x2 wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.1, Thread 1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU through time division multiplexing.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

This is version 3.40.00.02 of the SimpleLink CC13x2 / CC26x2 SDK.