
SK-AM64 是一种原型评估模块,限量出售。
我们建议新用户选择 SK-AM64B 用于评估。该评估模块是新一代产品,包含可为安全应用定制密钥和加密的高安全性 - 现场安全 (HS-FS) 芯片以及具有集成功能和成本效益的全新 TPS65219 和 TPS65220 PMIC。
AM64x 入门套件是一个独立测试和开发平台,非常适合用于加速下一个设计的原型设计阶段。该套件包含:有线和无线连接、三个扩展头、多个引导选项和灵活的调试功能。
此入门套件还配有 TI 的 AM64x 处理器和优化的功能集,允许用户使用基于以太网的接口、USB 接口、有线串行接口以及 2.4GHz 和 5GHz 无线通信创建商业和工业解决方案。两个板载 1Gbps 以太网端口用于有线连接,此外还有三个扩展头用于扩展板功能。此套件采用标准串行协议(如 UART、I²C 和 SPI),可用作通信网关与多个其他器件进行连接。该入门套件可通过在 A53 内核上运行 Linux 进行评估,从而可作为远程工业通信网络中的中央引擎,也适合用作可编程逻辑控制器或运动控制器。额外的嵌入式仿真逻辑允许使用标准开发工具(例如 TI 的 Code Composer Studio™)进行仿真和调试。
要同时评估 A53 内核和 R5F 内核的完整功能,请考虑使用 TMDS64GPEVM。
如仅在 R5F 内核上进行开发,请考虑使用 LP-AM243。
SK-AM64 是一种原型评估模块,限量出售。
我们建议新用户选择 SK-AM64B 用于评估。该评估模块是新一代产品,包含可为安全应用定制密钥和加密的高安全性 - 现场安全 (HS-FS) 芯片以及具有集成功能和成本效益的全新 TPS65219 和 TPS65220 PMIC。
类型 | 标题 | 下载最新的英文版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 用户指南 | AM64x Starter Kit EVM Quick Start Guide | 2021年 7月 23日 | |||
应用手册 | 使用 LP8733xx 和 TPS65218xx PMIC 为 AM64x 和 AM243x Sitara 处理器供电 | PDF | HTML | 下载英文版本 | PDF | HTML | 2022年 6月 10日 | |
用户指南 | AM64x SK EVM (Rev. A) | 下载英文版本 (Rev.A) | 2022年 2月 3日 | |||
应用手册 | Powering the AM64xx With the LP8733xx PMIC | PDF | HTML | 2021年 7月 15日 | |||
技术文章 | We designed a Linux gateway for you. Here’s how you can use it in your next building automation application. | 2021年 5月 18日 | ||||
证书 | SK-AM64 EU RoHS Declaration of Conformity (DoC) (Rev. A) | 2021年 4月 26日 |
The Linux academy delivers easy-to-use training modules that span a wide range of topics for all AM64x devices.
Processor SDK LINUX AM64X - Linux Installer for sources, pre-built binaries and file system images generated using Yocto build environment
Processor SDK LINUX AM64X - SD card image
Get access to latest bug fixes and feature enhancements with Yocto build environment
Quick Start Guide for the AM64X evaluation module board
Quick Start Guide for the AM64X starter kit board
Processor SDK LINUX AM64X - Online SDK user manual for developers
Instructions to build Linux image for AM64x using Yocto build environment
Processor SDK LINUX AM64X - Instructions for creating an SD card
Learn how to build embedded Linux systems using AM64x processors
Processor SDK LINUX AM64X - Download SDK user manual for offline view
Processor SDK LINUX AM64X - Software manifest
Thank you for your interest in PROCESSOR SDK LINUX AM64X Software Development Kit (SDK). This SDK is a Linux only package. The Processor SDK is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices.
This release adds support for production Silicon Release 2.0 High Security - Field Securable (HS-FS) devices. For more information, please see the Migration Guide.
TI Linux CI/CD Snapshot
In order to improve access to the very latest bug fixes and feature enhancements, TI is enabling Continuous Integration and Continuous Deployment (CI/CD) for AM64x processors. The patches for these changes have always been available on public repositories hosted on git.ti.com, and these source repositories could be built using the Yocto build environment on a daily basis. The new TI Linux CI/CD Snapshot makes it even easier to consume these changes with pre-built binaries of Linux boot images to try out on TI Evaluation Modules (EVMs and SKs) before migrating or picking the patches. A detailed test report is also published to help users understand the status of the build and features being validated. The Linux boot images from a snapshot can be regenerated using sources by following the build instructions provided on the snapshot page.
The daily snapshot is not a replacement for the official Processors SDK releases which have full documentation, training and support. The snapshot is a new easy way to try bug fixes and feature enhancements planned for the next SDK while enabling much more tighter integration with customizations and application development. This improved integration should allow users to release their customized code built on the SDKs more quickly and confidently.
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
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