The QFN16-DIP-EVM provides a fast and easy platform for prototyping TI's RUM16 package parts. This tool is targeted especially for TI's Quad OpAmps, but may be used with any device with the same footprint. Scoring allows each device to be separated into individual circuit boards. With included terminal strips, boards may be plugged into DIP type sockets or solderless breadboards.
- Low cost
- Flexible design allows use with any pinout
- Protoype up to 8 devices with one EVM
- Compatible with common solderless breadboards