热成像摄像机
产品和参考设计
热成像摄像机
概述
Thermal imaging cameras have features like low-light operation and immunity to visual limitations. These cameras demand compact designs, low-power consumption and light weight with high performance. Our integrated circuits and reference designs help you differentiate your next camera design with high image quality.
设计要求
Thermal imaging camera designs often require:
- Superior image quality with low noise and excellent linearity.
- Ultra-low flicker noise to avoid frame-to-frame pattern noise.
- Low-power consumption of analog front-end electronics to minimize background radiation interfering with external IR energy from scene.
- Analog signal chain supports wide range of sensor resolution from QQVGA to XGA and both cooled and uncooled LWIR detectors.
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类型 | 标题 | 下载最新的英文版本 | 日期 | |||
---|---|---|---|---|---|---|
更多文献资料 | Building your application with security in mind (Rev. E) | 2020年 10月 28日 | ||||
更多文献资料 | SimpleLink™ Wi-Fi® CC3x20 MCU Security (Rev. A) | 2019年 8月 5日 | ||||
白皮书 | Low-Power Internet Connectivity Over Wi-Fi (Rev. A) | 2019年 7月 19日 | ||||
应用手册 | CC3120, CC3220 SimpleLink™ Wi-Fi® IoC Networking Subsystem Power Managment (Rev. C) | 2018年 11月 5日 |