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TS3DS10224

現行

3.3-V、4:1 差動 1 通道或 2:1 差動 2 通道類比多工器

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產品規格表

TS3DS10224

現行
產品規格表 立即訂購

產品詳細資料

Configuration Crosspoint/exchange Number of channels 2 Protocols USB 2.0 Ron (typ) (Ω) 13 CON (typ) (pF) 12 Supply current (typ) (µA) 50 Bandwidth (MHz) 1200 Operating temperature range (°C) -40 to 85 Features Bi-directional, Fail Safe Protection Input/output continuous current (max) (A) 0.1 Rating Catalog
Configuration Crosspoint/exchange Number of channels 2 Protocols USB 2.0 Ron (typ) (Ω) 13 CON (typ) (pF) 12 Supply current (typ) (µA) 50 Bandwidth (MHz) 1200 Operating temperature range (°C) -40 to 85 Features Bi-directional, Fail Safe Protection Input/output continuous current (max) (A) 0.1 Rating Catalog
WQFN (RUK) 20 9 mm² (3 mm × 3 mm)
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.
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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) PDF | HTML 2019/10/17

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介面轉接器

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EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。  此電路板具有封裝設計，可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
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模擬型號

TS3DS10224 HSpice AIO (Linux) Model

SCDM137.ZIP (511 KB) - HSpice 模型
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模擬型號

TS3DS10224 HSpice AIO (Windows) Model

SCDM136.ZIP (511 KB) - HSpice 模型
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模擬型號

TS3DS10224 IBIS Model

SCDM301.ZIP (4 KB) - IBIS 模型
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
WQFN (RUK) 20 Ultra Librarian
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