TPA6211T-Q1
- AEC-Q100 Qualified for automotive applications
- Device Temperature Grade 2: –40°C to 105°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C6
- 3.1W into 3Ω from a 5V supply at THD = 10% (typical)
- Low supply current: 4mA (typical) at 5V
- Shutdown current: 0.01µA (typical)
- Fast startup with minimal pop
- Only three external components
- Improved PSRR (80dB) and wide supply voltage (2.5V to 5.5V) for direct battery operation
- Fully differential design reduces RF rectification
- 63dB CMRR Eliminates two input coupling capacitors
The TPA6211T-Q1 device is a 3.1W mono fullydifferential amplifier designed to drive a speaker with at least 3Ω impedance while consuming only 20mm2 total printed-circuit board (PCB) area in most applications. The device operates from 2.5V to 5.5V, drawing only 4mA of quiescent supply current. The TPA6211T-Q1 device is available in the space-saving 8-pin HVSSOP package.
The device includes features such as a 80dB supply voltage rejection ratio from 20Hz to 2kHz, improved RF rectification immunity, small PCB area, and a fast start-up with minimal pop makes the TPA6211TQ1 device an excellent choice for emergency call applications. Additionally, the device supports lowpower needs in infotainment and cluster applications, such as cluster chimes or driver notification.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TPA6211T-Q1 Automotive, 3.1W Mono, Analog Input, Class AB Audio Amplifier datasheet (Rev. C) | PDF | HTML | 2024年 5月 13日 |
設計與開發
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TPA6211A1EVM — TPA6211A1 評估模組 (EVM)
The TPA6211A1 is a 3.1-W mono fully differential amplifier designed to drive a speaker with at least 3-Ohm impedance while comsuming less than 20mm2 total board space.
The device operates from 2.5V to 5.5V while consuming only 4mA of quiescent current. The TPA6211A1 is available in a space-saving (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。