TPA301
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V - 5.5 V
- Output Power for RL = 8
- 350 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
- Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) | 2004年 6月 24日 | |
| Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
| User guide | TPA301EVM - User Guide (Rev. A) | 2001年 4月 17日 |
設計與開發
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TPA301EVM — TPA301 評估模組 (EVM)
A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。