產品詳細資料

Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 375 Temp resolution (max) (bps) 12 Remote channels (#) 1 Addresses 9 Rating Space
Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 375 Temp resolution (max) (bps) 12 Remote channels (#) 1 Addresses 9 Rating Space
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Vendor item drawing (VID) V62/24615
  • Radiation tolerant:
    • TID characterized up to 50krad(Si)
    • TID RHA/RLAT assurance up to 30krad(Si)
    • SEL immune to LET: 43MeV×cm2/mg at 125°C
    • SEE characterized to LET: 43MeV×cm2/mg
    • SEFI characterized to LET: 43MeV×cm2/mg
  • I2C interface (SMBusTM compatible)

    • Pin-programmable address
    • 12-bit resolution: 0.0625°C (LSB)
  • Temperature accuracy and range:
    • Local (on-chip) temp accuracy: ±2.0°C (Max)
    • Remote junction temp accuracy: ±1.5°C (Max)
    • Remote range tested to: –64°C to 191°C
  • Small-size package: VSSOP-10, 4.9mm × 3.0mm
  • QMLP version: TMP9R01-SP (pre-release)
  • QMLV version: TMP461-SP
  • Integrated calibration/protection features:
    • η-factor and offset correction
    • Series resistance cancellation
    • Remote BJT/diode fault detection
    • Programmable digital filter
  • Wide operating range, low power:
    • Voltage supply range: 1.7V to 3.6V
    • I/O voltages: 1.8V, 2.5V, and 3.3V
    • Standby/shutdown IQ: 15µA/3µA
  • Space enhanced plastic (Space EP):
    • Meets NASA’s ASTM E595 outgassing spec
    • Military temperature range (-55°C to 125°C)
    • Au bondwire and NiPdAu lead finish
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Wafer lot traceability
    • Extended product change notification
  • Vendor item drawing (VID) V62/24615
  • Radiation tolerant:
    • TID characterized up to 50krad(Si)
    • TID RHA/RLAT assurance up to 30krad(Si)
    • SEL immune to LET: 43MeV×cm2/mg at 125°C
    • SEE characterized to LET: 43MeV×cm2/mg
    • SEFI characterized to LET: 43MeV×cm2/mg
  • I2C interface (SMBusTM compatible)

    • Pin-programmable address
    • 12-bit resolution: 0.0625°C (LSB)
  • Temperature accuracy and range:
    • Local (on-chip) temp accuracy: ±2.0°C (Max)
    • Remote junction temp accuracy: ±1.5°C (Max)
    • Remote range tested to: –64°C to 191°C
  • Small-size package: VSSOP-10, 4.9mm × 3.0mm
  • QMLP version: TMP9R01-SP (pre-release)
  • QMLV version: TMP461-SP
  • Integrated calibration/protection features:
    • η-factor and offset correction
    • Series resistance cancellation
    • Remote BJT/diode fault detection
    • Programmable digital filter
  • Wide operating range, low power:
    • Voltage supply range: 1.7V to 3.6V
    • I/O voltages: 1.8V, 2.5V, and 3.3V
    • Standby/shutdown IQ: 15µA/3µA
  • Space enhanced plastic (Space EP):
    • Meets NASA’s ASTM E595 outgassing spec
    • Military temperature range (-55°C to 125°C)
    • Au bondwire and NiPdAu lead finish
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Wafer lot traceability
    • Extended product change notification

The TMP9R01-SEP device is a radiation-tolerant, high-accuracy, low-power remote and local temperature sensor that integrates a 12‑bit ADC, bias currents, and on‑chip calibration circuitry for temperature sensing. This device is available in a 10-pin VSSOP plastic-encapsulated package. By forcing a bias current through an external BJT transistor, or the diode/junction integrated in an FPGA, ADC, or ASIC, the device digitizes the resulting ΔVBE and directly reports with a 0.0625°C temperature resolution. The second on‑chip sensor measures local temperature, enabling on-board temperature sensing.

The TMP9R01-SEP device incorporates multiple calibration and protection features, including series resistance cancellation, programmable non‑ideality factor (η-Factor), offset correction, and programmable digital filter. The user can set high and low temperature limits that drive the ALERT output for over- and under- temperature thermal protection. The I2C/SMBus serial interface accepts up to nine different pin-programmable addresses on the same I2C bus. The TMP9R01-SEP device is also available in a QMLV (TMP461-SP) and QMLP (TMP9R01-SP, prerelease) versions, with higher radiation specs.

The TMP9R01-SEP device is ideal for multi‑location spacecraft housekeeping, satellite telemetry, avionics, and other high‑reliability industrial or medical designs that require precise temperature sensing and radiation tolerance.

The TMP9R01-SEP device is a radiation-tolerant, high-accuracy, low-power remote and local temperature sensor that integrates a 12‑bit ADC, bias currents, and on‑chip calibration circuitry for temperature sensing. This device is available in a 10-pin VSSOP plastic-encapsulated package. By forcing a bias current through an external BJT transistor, or the diode/junction integrated in an FPGA, ADC, or ASIC, the device digitizes the resulting ΔVBE and directly reports with a 0.0625°C temperature resolution. The second on‑chip sensor measures local temperature, enabling on-board temperature sensing.

The TMP9R01-SEP device incorporates multiple calibration and protection features, including series resistance cancellation, programmable non‑ideality factor (η-Factor), offset correction, and programmable digital filter. The user can set high and low temperature limits that drive the ALERT output for over- and under- temperature thermal protection. The I2C/SMBus serial interface accepts up to nine different pin-programmable addresses on the same I2C bus. The TMP9R01-SEP device is also available in a QMLV (TMP461-SP) and QMLP (TMP9R01-SP, prerelease) versions, with higher radiation specs.

The TMP9R01-SEP device is ideal for multi‑location spacecraft housekeeping, satellite telemetry, avionics, and other high‑reliability industrial or medical designs that require precise temperature sensing and radiation tolerance.

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類型 標題 日期
* Data sheet TMP9R01-SEP Radiation Tolerant, I2 C Digital Temperature Sensor with Remote and Local (On-Chip) Temperature Sensing datasheet PDF | HTML 2025年 7月 21日
* Radiation & reliability report TMP9R01-SEP Production Flow and Reliability Report (Rev. A) PDF | HTML 2025年 7月 31日
* Radiation & reliability report TMP9R01-SEP Total Ionizing Dose (TID) Report (Rev. C) 2025年 6月 27日
* Radiation & reliability report TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report (Rev. B) PDF | HTML 2025年 6月 19日
Application note How to Optimize Space-Grade Temperature Sensing Designs PDF | HTML 2025年 10月 27日
Selection guide TI Space Products (Rev. K) 2025年 4月 4日
Product overview TI Space Qualified Temperature Sensor Product Selection Guide (Rev. A) PDF | HTML 2025年 1月 22日
Application note Remote Temperature Transistor Sensor Selection Guide PDF | HTML 2021年 3月 24日

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開發板

TMP9R01EVM — TMP9R01 評估模組

TMP9R01EVM 旨在提供快速設定以評估 TMP9R01-SEP 裝置,並按照位元暫存器層級進一步熟悉所有產品。除了測試裝置的一般功能外,評估模組 (EVM) 也允許專為訊號事件展望 (SEL) 測試在輻射下進行測試。EVM 讓使用者能夠評估 TMP9R01 數位溫度感測器在太空條件的性能。
使用指南: PDF | HTML
TI.com 無法提供
開發板

ALPHA-3P-ADM-VA601-SPACE-AMD — Alpha Data ADM-VA601 套件,使用 AMD Versal 核心 XQRVC1902 ACAP 和 TI 耐輻射產品

外型尺寸採用 6U VPX,強調 AMD-Xilinx® Versal AI Core XQRVC1902 適應性 SoC/FPGA。ADM-VA600 為模組化機板設計,配備一個 FMC+ 連接器、DDR4 DRAM 及系統監控。零組件多數為耐輻射電源管理、介面、時脈與嵌入式處理裝置。

開發板

ALPHA-3P-VB630-SPACE-AMD — Alpha Data ADM-VB630 套件,使用 AMD Versal 核心 XQRVE2302 ACAP 和 TI 耐輻射產品

外型尺寸採用 3U VPX,突显 AMD-Xilinx® Versal AI Core XQRVE2302 適應性 SoC/FPGA。VB630 是 單板計算機板。零組件多數為耐輻射電源管理、介面、時脈與嵌入式處理裝置。

模擬型號

TMP9R01 IBIS model

SNIM014.ZIP (0 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VSSOP (DGS) 10 Ultra Librarian

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  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
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