首頁 邏輯和電壓轉換 正反器、鎖存器和暫存器 D 型正反器
首頁
邏輯和電壓轉換
正反器、鎖存器和暫存器
D 型正反器

SN74AUP1G79

現行

低功耗單路正緣觸發 D 型正反器

立即訂購
產品規格表

SN74AUP1G79

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 1 Technology family AUP Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUP Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
USON (DRY) 6 1.45 mm² (1.45 mm × 1 mm) SOT-23 (DBV) 5 8.12 mm² (2.9 mm × 2.8 mm) SOT-5X3 (DRL) 5 2.56 mm² (1.6 mm × 1.6 mm) X2SON (DSF) 6 1 mm² (1 mm × 1 mm) X2SON (DPW) 5 0.64 mm² (0.8 mm × 0.8 mm) SOT-SC70 (DCK) 5 4.2 mm² (2 mm × 2.1 mm)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption:
    ICC = 0.9 µA Maximum
  • Low Dynamic-Power Consumption:
    Cpd = 3 pF Typical at 3.3 V
  • Low Input Capacitance:
    Ci = 1.5 pF Typical
  • Low Noise: Overshoot and Undershoot
    < 10% of VCC
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption:
    ICC = 0.9 µA Maximum
  • Low Dynamic-Power Consumption:
    Cpd = 3 pF Typical at 3.3 V
  • Low Input Capacitance:
    Ci = 1.5 pF Typical
  • Low Noise: Overshoot and Undershoot
    < 10% of VCC
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74AUP1G79 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74AUP1G79 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
filter 尋找其它 D 型正反器
下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
針腳對針腳的功能與所比較的裝置相同。
SN74LVC1G79 現行 單路正緣觸發 D 型正反器 Voltage range 1.65V to 5.5V, average propagation delay 5.5ns, average drive strength 24mA

技術文件

找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 4
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop datasheet (Rev. I) PDF | HTML 2017/9/6
Application brief Understanding Schmitt Triggers (Rev. B) PDF | HTML 2025/4/17
應用說明 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
應用說明 Designing and Manufacturing with TI's X2SON Packages 2017/8/23

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組

靈活的 EVM 旨在支援任何針腳數為 5 至 8 支且採用 DCK、DCT、DCU、DRL 或 DBV 封裝的裝置。
使用指南: PDF
支援產品和硬體
有庫存
限制：
??asset.out-of-stock-ti_zh_TW??
無法提供
開發板

5-8-NL-LOGIC-EVM — 支援 5 至 8 針腳 DPW、DQE、DRY、DSF、DTM、DTQ 和 DTT 封裝的通用邏輯和轉譯 EVM

支援任何具 DTT、DRY、DPW、DTM、DQE、DQM、DSF 或 DTQ 封裝的邏輯或轉換裝置之通用 EVM。可實現靈活評估的電路板設計。

使用指南: PDF | HTML
支援產品和硬體
有庫存
限制：
??asset.out-of-stock-ti_zh_TW??
無法提供
模擬型號

SN74AUP1G79 IBIS Model (Rev. B)

SCEM442B.ZIP (65 KB) - IBIS 模型
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
USON (DRY) 6 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片