ESD762
- Robust surge protection:
- IEC 61000-4-5 (8/20µs): 2.5A
- IEC 61000-4-2 level 4 ESD protection:
- ±18kV contact discharge
- ±18kV air-gap discharge
- 24V working voltage
- Bidirectional ESD protection
- 2-channel device provides complete ESD and surge protection with single component
- Low clamping voltage protects downstream components
- I/O capacitance = 1.7pF (typical)
ESD762 is a bidirectional ESD protection diode for USB power delivery (USB-PD) and industrial interfaces. ESD762 is rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±18kV contact and ±18kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.
These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 2.5A (8/20µs surge waveform) capability of the ESD762 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 1.7pF line capacitance of the ESD762 is suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.
ESD762 is offered in SOT-23 and DFN1110 packages for easy flow through routing.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | ESD762 24V, 2-Channel, ESD Protection With 2.5A of 8/20µs Surge Protection datasheet (Rev. D) | PDF | HTML | 2026年 4月 29日 |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 適用於 ESD 二極體封裝的通用評估模組,包括 0402、0201等
TIDA-010253 — 適用於儲能系統的電池控制單元參考設計
此設計使用高性能微控制器進行開發和測試應用。這些功能讓此參考設計適用於高容量電池架應用的中央控制器。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-23 (DBZ) | 3 | Ultra Librarian |
| USON (DXA) | 3 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。