DDC3512

활성

512채널, 20KSPS 전류 입력 아날로그-디지털 컨버터

제품 상세 정보

Operating temperature range (°C) 0 to 70 Rating Catalog
Operating temperature range (°C) 0 to 70 Rating Catalog
NFBGA (ZWR) 656 227.04 mm² (17.2 mm × 13.2 mm)
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

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설계 및 개발

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평가 보드

DDC3256EVM — DDC3256 평가 모듈

DDC3256EVM은 DDC3256 디바이스용 평가 모듈 용도로 서용됩니다. 이 EVM 키트는 데이터 캡처용으로 TSWDC155EVM 평가 모듈 FPGA와 매끄럽게 결합되는 DUT 보드로 구성됩니다. 이 EVM에는 필요한 제어 신호와 온보드 전력 생성 기능이 모두 포함되어 있어 외부 장비의 필요성을 크게 줄여줍니다. 마지막으로, 이 평가 시스템에는 사용이 간편한 Microsoft® Windows®용 소프트웨어도 포함되어 있습니다. TSWDC155EVM은 별도로 주문해야 합니다.

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