产品详情

Number of ADC channels 8 Number of DAC channels 2 Digital audio interface DSP, I2S, L, R Analog inputs 1 Analog outputs 2 Sampling rate (max) (kHz) 125 Rating Catalog Features Phase-locked loop (PLL), Stereo headphone amplifier ADC SNR (typ) (dB) 97 DAC SNR (typ) (dB) 97 Operating temperature range (°C) -40 to 85
Number of ADC channels 8 Number of DAC channels 2 Digital audio interface DSP, I2S, L, R Analog inputs 1 Analog outputs 2 Sampling rate (max) (kHz) 125 Rating Catalog Features Phase-locked loop (PLL), Stereo headphone amplifier ADC SNR (typ) (dB) 97 DAC SNR (typ) (dB) 97 Operating temperature range (°C) -40 to 85
TSSOP (DA) 32 89.1 mm² 11 x 8.1
  • 4-Wire Touch Screen Interface
  • Integrated Touch Screen Processor With Fully Automated Modes of Operation
  • Programmable Converter Resolution, Speed, and Averaging
  • Programmable Autonomous Timing Control
  • Direct Battery Measurement
  • On-Chip Temperature Measurement
  • Stereo Audio Playback Up to 48 ksps
  • 97-dB Stereo Audio Playback
  • Integrated PLL for Audio Clock Generation
  • Programmable Digital Audio Effects Processing
  • Stereo Headphone Amplifier
  • SPI™ Serial Interface
  • Glueless Interface With OMAP™ and Xscale™ Processors
  • Full Power-Down Control
  • Low Power: 11-mW Stereo Audio Playback
  • 32-Pin TSSOP Package
  • APPLICATIONS
    • Personal Digital Assistants
    • Smart Cellular Phones
    • MP3 Players


US Patent No. 624639
SPI is a trademark of Motorola.
OMAP is a trademark of Texas Instruments.
Xscale is a trademark of Intel.

  • 4-Wire Touch Screen Interface
  • Integrated Touch Screen Processor With Fully Automated Modes of Operation
  • Programmable Converter Resolution, Speed, and Averaging
  • Programmable Autonomous Timing Control
  • Direct Battery Measurement
  • On-Chip Temperature Measurement
  • Stereo Audio Playback Up to 48 ksps
  • 97-dB Stereo Audio Playback
  • Integrated PLL for Audio Clock Generation
  • Programmable Digital Audio Effects Processing
  • Stereo Headphone Amplifier
  • SPI™ Serial Interface
  • Glueless Interface With OMAP™ and Xscale™ Processors
  • Full Power-Down Control
  • Low Power: 11-mW Stereo Audio Playback
  • 32-Pin TSSOP Package
  • APPLICATIONS
    • Personal Digital Assistants
    • Smart Cellular Phones
    • MP3 Players


US Patent No. 624639
SPI is a trademark of Motorola.
OMAP is a trademark of Texas Instruments.
Xscale is a trademark of Intel.

The TSC2102 is a highly integrated combination resistive touch screen controller with on-chip processor and audio DAC. The touch screen portion of the TSC2102 contains a 12-bit 4-wire resistive touch screen converter complete with drivers, and interfaces to the host controller through a standard SPI™ serial interface. The on-chip processor provides extensive features specifically designed to reduce host processor and bus overhead, with capabilities that include fully automated operating modes, programmable conversion resolution up to 12 bits, programmable sampling rates up to 125 kHz, programmable conversion averaging, and programmable on-chip timing generation.

The TSC2102 also features a high-performance audio DAC with 16, 20, 24, or 32-bit stereo playback functionality at up to 48 ksps. The stereo output drivers on the TSC2102 can be programmed for headphone drive or line-level drive, and support capless as well as ac-coupled output configurations. The digital audio data format is programmable to work with popular audio standard protocols (I2S, DSP, left/right justified) in master or slave mode, and also includes an on-chip PLL for flexible clock generation capability.

The TSC2102 offers two battery measurement inputs capable of reading battery voltages up to 6 V, while operating at only 2.7 V. It also has an on-chip temperature sensor capable of reading 0.3°C resolution. The TSC2102 is available in a 32-lead TSSOP.

The TSC2102 is a highly integrated combination resistive touch screen controller with on-chip processor and audio DAC. The touch screen portion of the TSC2102 contains a 12-bit 4-wire resistive touch screen converter complete with drivers, and interfaces to the host controller through a standard SPI™ serial interface. The on-chip processor provides extensive features specifically designed to reduce host processor and bus overhead, with capabilities that include fully automated operating modes, programmable conversion resolution up to 12 bits, programmable sampling rates up to 125 kHz, programmable conversion averaging, and programmable on-chip timing generation.

The TSC2102 also features a high-performance audio DAC with 16, 20, 24, or 32-bit stereo playback functionality at up to 48 ksps. The stereo output drivers on the TSC2102 can be programmed for headphone drive or line-level drive, and support capless as well as ac-coupled output configurations. The digital audio data format is programmable to work with popular audio standard protocols (I2S, DSP, left/right justified) in master or slave mode, and also includes an on-chip PLL for flexible clock generation capability.

The TSC2102 offers two battery measurement inputs capable of reading battery voltages up to 6 V, while operating at only 2.7 V. It also has an on-chip temperature sensor capable of reading 0.3°C resolution. The TSC2102 is available in a 32-lead TSSOP.

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类型 标题 下载最新的英语版本 日期
* 数据表 Programmable Touch Screen Controller w/Integrat Stereo Audio DAC & Headphone Amp 数据表 (Rev. A) 2004年 6月 17日
应用手册 TSC210x 和 TLV320AIC26/28 上的音频加电/断电编程 (Rev. A) 英语版 (Rev.A) 2005年 11月 7日
应用手册 如何通过 PC 将 TSC/AIC EVM 设置为录制和回放音频或其它声音 英语版 2005年 11月 7日
应用手册 通过 McBSP 连接至 TSC 英语版 2005年 11月 7日
应用手册 Using the PGA Function in TSC210x/AIC26/AIC28/DAC26 Devices 2005年 6月 3日
应用手册 Programming Sequences and Tips for TSC2000/2200/230x Applications 2004年 3月 8日
应用手册 TSC2100 WinCE Generic Drivers 2004年 3月 8日

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仿真模型

TSC2102 IBIS Model

SLAM109.ZIP (28 KB) - IBIS Model
计算工具

COEFFICIENT-CALC Coefficient Calculator For Digital Biquad Filters

COEFFICIENT-CALC (TIBQ) calculates the coefficients for the digital filter biquad transfer function implemented in TI audio codecs. The characteristics of the digital filter are adjusted by selecting a filter type and moving a control point within a window that shows the transfer function gain and (...)

支持的产品和硬件

支持的产品和硬件

产品
音频编解码器
TLV320AIC26 具有耳机/扬声器放大器和 12 位测量 ADC 的低功耗单声道 ADC/立体声 DAC TLV320AIC28 具有 6 个音频输入和耳机/扬声器放大器的低功耗单声道 ADC/立体声 DAC TLV320AIC29 具有 6 个音频输入和耳机/扬声器放大器的低功耗单声道 ADC/立体声 DAC TLV320AIC3007 具有集成 D 级放大器的低功耗立体声编解码器 TLV320AIC31 具有 6 输入、6 输出集成耳机/扬声器放大器以及 3D 效果的低功耗立体声编解码器 TLV320AIC3100 具有音频处理和单声道 D 级放大器的低功耗音频编解码器 TLV320AIC3101 具有 6 个输入、6 个输出、扬声器/耳机放大器和增强数字效果的低功率立体声编解码器 TLV320AIC3104 具有 6 个输入、6 个输出、耳机放大器和增强数字效果的低功耗立体声编解码器 TLV320AIC3105 具有 6 个输入、6 个输出、耳机放大器和增强数字效果的低功耗立体声编解码器 TLV320AIC3106 具有 10 个输入、7 个输出、耳机放大器和增强数字效果的低功耗立体声编解码器 TLV320AIC3107 具有集成单声道 D 级放大器的低功耗立体声编解码器 TLV320AIC3110 具有 1.3W 立体声 D 级扬声器放大器的低功耗音频编解码器 TLV320AIC3111 具有嵌入式 miniDSP 和立体声 D 级扬声器放大器的低功耗音频编解码器 TLV320AIC3120 具有 miniDSP 和 2.5W 单声道 D 级扬声器放大器的低功耗音频编解码器 TLV320AIC32 具有 6 输入、6 输出、耳机/扬声器放大器和 3D 效果的低功耗立体声编解码器 TLV320AIC3204 采用 PowerTune™ 技术的超低功耗立体声音频编解码器 TLV320AIC3206 具有 DirectPath™ 耳机放大器的低功耗立体声编解码器 TLV320AIC3254 具有可编程 miniDSP 的极低功耗立体声音频编解码器 TLV320AIC3256 具有 miniDSP 和 DirectPath™ 耳机放大器的极低功耗立体声编解码器 TLV320AIC33 具有 10 个输入、7 个输出、耳机/扬声器放大器和增强数字效果的低功耗立体声编解码器 TLV320AIC34 低功耗 4 通道编解码器 TSC2100 具有立体声 DAC/带耳机/扬声器放大器的单声道 ADC 的 4 线触摸屏控制器 TSC2101 具有立体声 DAC/带耳机/扬声器放大器的单声道 ADC 的 4 线触摸屏控制器 TSC2102 具有带耳机放大器的立体声 DAC 的 4 线触摸屏控制器 TSC2117 具有低功耗单声道 ADC/立体声 DAC 的 4 线触摸屏控制器 TSC2301 具有耳机放大器的立体声编解码器的 4 线触摸屏控制器(键盘接口 + 6 个 GPIO)
音频 ADC
TLV320ADC3001 92dB SNR 低功耗立体声 ADC (ADC3001) TLV320ADC3101 支持数字麦克风且具有 miniDSP 的 92dB SNR 低功耗立体声 ADC
扬声器放大器
TAS2505 具有音频处理和单声道耳机放大器的 2W 单声道、数字和模拟输入 D 类音频放大器 TAS2505-Q1 具有音频处理功能的汽车类 2W 单声道数字或模拟输入 D 类放大器 TAS2521 具有 miniDSP 和 18mW 单声道耳机驱动器的 2W 单声道、数字和模拟输入 D 类音频放大器
模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。

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TSSOP (DA) 32 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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