SM320DM642-HIREL

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High reliability product digital media DM642 DSP

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参数

DSP 1 C64x DSP MHz (Max) 720 CPU 32-/64-bit Ethernet MAC 10/100 Rating Catalog Operating temperature range (C) -40 to 105 open-in-new 查找其它 数字信号处理器(DSP)

封装|引脚|尺寸

FCBGA (ZDK) 548 529 mm² 23 x 23 open-in-new 查找其它 数字信号处理器(DSP)

特性

  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Digital Media Processor
    • 2 ns, 1.67 ns, 1.39 ns Instruction Cycle Time
    • 720 MHz Clock Rate (500/600 MHz devices are product preview only)
    • Eight 32-Bit Instructions/Cycle
    • 5760 MIPS
    • Fully Software-Compatible With C64x™
  • VelociTI.2™ Extensions to VelociTI™
    Advanced Very Long Instruction Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32/40 Bit), Each Supports Single 32 Bit, Dual 16 Bit,
        or Quad 8 Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32 Bit Results) per
        Clock Cycle or Eight 8 × 8 Bit Multiplies (16 Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte Addressable (8/16/32/64 Bit Data)
    • 8-Bit Overflow Protection
    • Bit Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2™ Increased Orthogonality
  • L1/L2 Memory Architecture
    • 128K Bit (16K Byte) L1P Program Cache (Direct Mapped)
    • 128K Bit (16K Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M Bit (256K Byte) L2 Unified Mapped RAM/Cache (Flexible RAM/Cache
      Allocation)
  • Endianess: Little Endian, Big Endian
    • 64 Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous
      Memories (SRAM and EPROM) and
      Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
  • 1024M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA)
    Controller (64 Independent Channels)
  • 10/100 Mbps Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Media Independent Interface (MII)
    • Eight Independent Transmit (TX) Channels and
      One Receive (RX) Channel
  • Management Data Input/Output (MDIO)
  • Three Configurable Video Ports
    • Provide a Glueless I/F to Common Video Decoder and Encoder Devices
    • Supports Multiple Resolutions/Video Stds
  • VCXO Interpolated Control Port (VIC)
    • Supports Audio/Video Synchronization
  • Host Port Interface (HPI) [32/16 Bit]
  • 32 Bit/66 MHz, 3.3-V Peripheral Component
    Interconnect (PCI) Master/Slave Interface
    Conforms to PCI Specification 2.2
  • Multichannel Audio Serial Port (McASP)
    • Eight Serial Data Pins
    • Wide Variety of I2S and Similar Bit Stream Format
    • Integrated Digital Audio I/F Transmitter Supports S/PDIF,
      IEC60958-1, AES-3, CP-430 Formats
  • Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Buffered Serial Ports (McBSPs)
  • Three 32 Bit General Purpose Timers
  • Sixteen General Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 548 Pin Ball Grid Array (BGA) Package, 0.8 mm Ball Pitch
  • 0.13 µm/6 Level Cu Metal Process (CMOS)
  • 3.3 V I/O, 1.4 V Internal (A-500, A-600, -600, -720)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
C64x, VelociTI.2, VelociTI, TMS320C64x, C6000, TMS320C6000, DM64x, C62x, TMS320C62x, TMS320C67x, Code Composer Studio, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

open-in-new 查找其它 数字信号处理器(DSP)

描述

The C64x™ DSPs (including the SM320DM642-EP device) are the highest-performance fixed-point DSP generation in the C6000 DSP platform. The DM642 device is based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI), making these DSPs an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000 DSP platform.

With performance of up to 5760 million instructions per second (MIPS) at a clock rate of 720 MHz, the DM642 device offers cost-effective solutions to high-performance DSP programming challenges. The DM642 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)—with VelociTI.2™ extensions. The VelociTI.2 extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The DM642 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2880 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 5760 MMACS. The DM642 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices.

The DM642 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: three configurable video ports; a 10/100 Mbps Ethernet MAC (EMAC); a management data input/output (MDIO) module; a VCXO interpolated control port (VIC); one multichannel buffered audio serial port (McASP0); an inter-integrated circuit (I2C) Bus module; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral component interconnect (PCI); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 64-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and peripherals.

The DM642 device has three configurable video port peripherals (VP0, VP1, and VP2). These video port peripherals provide a glueless interface to common video decoder and encoder devices. The DM642 video port peripherals support multiple resolutions and video standards (e.g., CCIR601, ITU-BT.656, BT.1120, SMPTE 125M, 260M, 274M, and 296M).

These three video port peripherals are configurable and can support either video capture and/or video display modes. Each video port consists of two channels — A and B with a 5120-byte capture/display buffer that is splittable between the two channels.

For more details on the Video Port peripherals, see the TMS320C64x™ DSP Video Port/VCXO Interpolated Control (VIC) Port Reference Guide (literature number SPRU629).

The McASP0 port supports one transmit and one receive clock zone, with eight serial data pins that can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The DM642 has sufficient bandwidth to support all eight serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP0 transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

McASP0 also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The VCXO interpolated control (VIC) port provides digital-to-analog conversion with resolution from 9-bits to up to 16-bits. The output of the VIC is a single bit interpolated D/A output.For more details on the VIC port, see the TMS320C64x™ DSP Video Port/VCXO Interpolated Control (VIC) Port Reference Guide (literature number SPRU629).

The ethernet media access controller (EMAC) provides an efficient interface between the DM642 DSP core processor and the network. The DM642 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex, with hardware flow control and quality of service (QOS) support. The DM642 EMAC makes use of a custom interface to the DSP core that allows efficient data transmission and reception.For more details on the EMAC, see the TMS320C6000 DSP Ethernet Media Access Controller (EMAC) / Management Data Input/Output (MDIO) Module Reference Guide (literature number SPRU628).

The management data input/output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the DSP, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the DSP, allowing the DSP to poll the link status of the device without continuously performing costly MDIO accesses. For more details on the MDIO, see the TMS320C6000™ DSP Ethernet Media Access Controller (EMAC) / Management Data Input/Output (MDIO) Module Reference Guide (literature number SPRU628).

The I2C0 port on the DM642 allows the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

The DM642 has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

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* 数据表 Video/Imaging Point Digital Signal Processor 数据表 (Rev. A) 2010年 10月 19日
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应用手册 Power Consumption Guide for the C66x 2011年 10月 6日

设计与开发

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硬件开发

调试探针 下载
995
说明

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)

特性

XDS560v2 是 XDS560 系列高性能 TI 处理器调试探针(仿真器)的最新型号。XDS560v2 具有整个系列中最快的速度和最多的功能,对于 TI 微控制器、处理器和无线连接微控制器的调试来说,它是最全面的解决方案。

XDS560v2 是 XDS560 调试探针系列中最先提供系统跟踪 (STM) 功能的一款,这种类型的跟踪可以通过捕获系统事件(例如处理内核的状态、内部总线和外设)来监控整个设备。大多数 XDS560v2 模型还提供系统引脚跟踪模式,在这种模式中,系统跟踪数据被送到 XDS560v2 内的外部存储器缓冲区 (128MB),因此能够捕获大量系统事件。系统引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。

在 XDS560 调试探针系列中,XDS560v2 PRO TRACE 是提供内核引脚跟踪功能(指令和数据)的第二代产品,这种跟踪可以捕获内核执行的所有指令并将其发送到 XDS560v2 PRO TRACE 内的外部存储器缓冲区 (1GB)。内核引脚跟踪并不干扰系统的实时行为,而且可以捕获更多的指令。内核引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。

为了支持所有类型的引脚跟踪(指令和系统),XDS560v2 的所有型号都提供标准的 60 引脚 MIPI HSPT 连接器作为与目标之间的主要 JTAG 连接。此外,所有型号都提供针对 TI 和 ARM 标准 JTAG 连接器的模块化目标适配器(提供的适配器因型号而异)。

XDS560v2 支持传统的 IEEE1149.1 (JTAG) 仿真和 IEEE1149.7 (cJTAG),运行时的 JTAG 接口电平为 1.2V 至 +4.1V。

与传统 JTAG 相比,紧凑 JTAG (cJTAG) 有巨大的进步;因为它仅需使用两个引脚即可支持所有功能,可用于某些指定的 TI 无线连接微控制器中。

所有 XDS560v2 (...)

调试探针 下载
1495
说明

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)

特性

XDS560v2 是 XDS560 系列高性能 TI 处理器调试探针(仿真器)的最新型号。XDS560v2 具有整个系列中最快的速度和最多的功能,对于 TI 微控制器、处理器和无线连接微控制器的调试来说,它是最全面的解决方案。

XDS560v2 是 XDS560 调试探针系列中最先提供系统跟踪 (STM) 功能的一款,这种类型的跟踪可以通过捕获系统事件(例如处理内核的状态、内部总线和外设)来监控整个设备。大多数 XDS560v2 模型还提供系统引脚跟踪模式,在这种模式中,系统跟踪数据被送到 XDS560v2 内的外部存储器缓冲区 (128MB),因此能够捕获大量系统事件。系统引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。

在 XDS560 调试探针系列中,XDS560v2 PRO TRACE 是提供内核引脚跟踪功能(指令和数据)的第二代产品,这种跟踪可以捕获内核执行的所有指令并将其发送到 XDS560v2 PRO TRACE 内的外部存储器缓冲区 (1GB)。内核引脚跟踪并不干扰系统的实时行为,而且可以捕获更多的指令。内核引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。

为了支持所有类型的引脚跟踪(指令和系统),XDS560v2 的所有型号都提供标准的 60 引脚 MIPI HSPT 连接器作为与目标之间的主要 JTAG 连接。此外,所有型号都提供针对 TI 和 ARM 标准 JTAG 连接器的模块化目标适配器(提供的适配器因型号而异)。

XDS560v2 支持传统的 IEEE1149.1 (JTAG) 仿真和 IEEE1149.7 (cJTAG),运行时的 JTAG 接口电平为 1.2V 至 +4.1V。

与传统 JTAG 相比,紧凑 JTAG (cJTAG) 有巨大的进步;因为它仅需使用两个引脚即可支持所有功能,可用于某些指定的 TI 无线连接微控制器中。

所有 XDS560v2 (...)

软件开发

驱动程序或库 下载
TMS320C6000 DSP 库 (DSPLIB)
SPRC265 TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
特性

Optimized DSP routines including functions for:

  • Adaptive filtering
  • Correlation
  • FFT
  • Filtering and convolution: FIR, biquad, IIR, convolution
  • Math: Dot products, max value, min value, etc.
  • Matrix operations
驱动程序或库 下载

设计工具和仿真

设计工具 下载
Arm-based MPU, arm-based MCU and DSP third-party search tool
PROCESSORS-3P-SEARCH TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI Processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
特性
  • Supports many TI processors including Sitara and Jacinto Processors and DSPs
  • Search by type of product, TI devices supported, or country
  • Links and contacts for quick engagement
  • Third-party companies located around the world

CAD/CAE 符号

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包含信息:
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  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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