ESDEVM 的特性
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
ESDEVM 的说明
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
<p>For typical high-speed ESD diodes, an impedance-controlled layout is implemented to take the S-parameter and de-embed the board trace. For non-high-speed ESD diodes, footprints with traces going to test points are provided to easily run DC tests such as breakdown voltage, holding voltage, leakage, etc. The board layout also makes it easy to connect any device pin to either power (V<sub>CC</sub>) or ground by shorting the signal pin to wherever the signal is.</p>