DRV8311-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C ≤ TA ≤ 125°C
- Three-phase PWM motor driver
- 3-Phase brushless DC motors
- 3-V to 20-V operating voltage
- 24-V Absolute maximum voltage
- High output current capability
- 5-A Peak current drive
- Low on-state resistance MOSFETs
- 210-mΩ typ RDS(ON) (HS + LS) at TA = 25°C
- Low power sleep mode
- 1.5-µA at VVM = 12-V, TA = 25°C
- Multiple control interface options
- 6x PWM control interface
- 3x PWM control interface
- PWM generation mode (SPI/tSPI) with optional calibration between MCU and DRV8311-Q1
- tSPI (DRV8311P-Q1)
- PWM duty and frequency update over SPI
- Control multiple DRV8311P-Q1 devices using standard 4-wire SPI
- Supports up to 200-kHz PWM frequency
- Integrated current sensing
- No external resistor required
- Sense amplifier output, one per 1/2-bridge
- SPI and hardware device variants
- 10-MHz SPI communication (SPI/tSPI)
- Supports 1.8-V, 3.3-V, and 5-V logic inputs
- Built-in 3.3-V ± 4.5%, 100-mA LDO regulator
- Integrated protection features
- VM undervoltage lockout (UVLO)
- Charge pump undervoltage (CPUV)
- Overcurrent protection (OCP)
- Thermal warning and shutdown (OTW/OTSD)
- Fault condition indication pin (nFAULT)
The DRV8311-Q1 provides three integrated MOSFET half-H-bridges for driving a three-phase brushless DC (BLDC) motor for 5V, 9V, 12V, or 18V DC rails or 1S to 4S battery powered applications. The device integrates three current-sense amplifiers (CSA) with integrated current sense for sensing the three phase currents of BLDC motors to achieve optimum FOC and current-control system implementation.
The DRV8311P-Q1 device provides capability to generate and configure PWM timers over Texas Instruments SPI (tSPI), and allows the control of multiple BLDC motors directly over the tSPI. This feature reduces the number of required I/O ports from the primary controller to control multiple motors.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | DRV8311-Q1 Three-Phase PWM Motor Driver 数据表 | PDF | HTML | 2025年 10月 29日 | ||
| 应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| WQFN (RRW) | 24 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点