Home Interface Diodes TVS diodes
NEW

TSD05C

ACTIVE

5.5-V 30-A bidirectional surge protection device

Product details

Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 400 IEC 61000-4-5 (A) 30 Vrwm (V) 5.5 Breakdown voltage (min) (V) 7 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 4 Clamping voltage (V) 11.5
Package name SOD323 (SOT) Peak pulse power (8/20 μs) (max) (W) 400 IEC 61000-4-5 (A) 30 Vrwm (V) 5.5 Breakdown voltage (min) (V) 7 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 4 Clamping voltage (V) 11.5
SOT (DYF) 2 3.445 mm² 2.65 x 1.3
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30 kV contact discharge
    • ±30 kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 30 A (8/20 µs)
    • Low clamping voltage: 14 V at 30 A (8/20 µs)
  • Low IO capacitance:
    • 4 pF (typical)
  • DC breakdown voltage: ±8 V (typical)
  • Ultra low leakage current: 50 nA (maximum)
  • Low ESD clamping voltage: 9.3 V at 16 A TLP
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.5 mm × 1.2 mm)
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30 kV contact discharge
    • ±30 kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 30 A (8/20 µs)
    • Low clamping voltage: 14 V at 30 A (8/20 µs)
  • Low IO capacitance:
    • 4 pF (typical)
  • DC breakdown voltage: ±8 V (typical)
  • Ultra low leakage current: 50 nA (maximum)
  • Low ESD clamping voltage: 9.3 V at 16 A TLP
  • Industrial temperature range: –55°C to +150°C
  • Industry standard SOD-323 leaded package (2.5 mm × 1.2 mm)

The TSD05C is a bidirectional TVS protection diode designed for clamping harmful transients such as ESD and surge. The TSD05C is rated to dissipate ESD strikes up to ±30 kV (contact and air gap discharge) and also meets the maximum level specified in the IEC 61000-4-2 international standard (Level 4). For surges, the device can clamp 8/20 µs surges with peak pulse currents up to 30 A in accordance with the IEC 61000-4-5 standard.

This device also features a 4 pF (typical) IO capacitance enabling it to protect high-speed data lines. The low dynamic resistance and low clamping voltage provides system level protection against transient events.

Combining the robust clamping performance and low capacitance of this device, TSD05C is an excellent TVS diode to protect both data lines and power lines in many different applications.

The TSD05C is offered in the industry standard, leaded SOD-323 package to enable easy solderability.

The TSD05C is a bidirectional TVS protection diode designed for clamping harmful transients such as ESD and surge. The TSD05C is rated to dissipate ESD strikes up to ±30 kV (contact and air gap discharge) and also meets the maximum level specified in the IEC 61000-4-2 international standard (Level 4). For surges, the device can clamp 8/20 µs surges with peak pulse currents up to 30 A in accordance with the IEC 61000-4-5 standard.

This device also features a 4 pF (typical) IO capacitance enabling it to protect high-speed data lines. The low dynamic resistance and low clamping voltage provides system level protection against transient events.

Combining the robust clamping performance and low capacitance of this device, TSD05C is an excellent TVS diode to protect both data lines and power lines in many different applications.

The TSD05C is offered in the industry standard, leaded SOD-323 package to enable easy solderability.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet TSD05C 5-V Bidirectional TVS Diode in SOD-323 Package datasheet (Rev. A) PDF | HTML 24 Jul 2023
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
Application note ISO 10605 Road Vehicles Test Methods for Elec. Disturbances from Electrostatic D (Rev. B) PDF | HTML 17 Aug 2022
Application brief Protecting I/O modules from surge events 04 Feb 2019
White paper Demystifying surge protection 06 Nov 2018
Application note How to select a Surge Diode 29 Aug 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
(...)

User guide: PDF | HTML
Not available on TI.com
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Reference designs

TIDA-010271 — Stackable battery management unit reference design for energy storage systems

This is a full cell-temperature sensing and high cell voltage accuracy Lithium-ion (Li-ion), lithium iron phosphate (LiFePO4) battery pack (32s) reference design. The design monitors each cell voltage, cell temperature and protects the battery pack to secure safe use. This design uses onboard and (...)
Design guide: PDF
Package Pins Download
SOT (DYF) 2 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos