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Design Rule Verification Report

Date : 5/16/2014
Time : 6:14:19 PM
Elapsed Time : 00:00:15
Filename : D:\TIDA_00181\Completed -E2\TIDA-00181\TIDA-00181.PcbDoc
Warnings : 0
Rule Violations : 14

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=10mil) (IsSMTPin),(IsVia) 14
Clearance Constraint (Gap=12mil) (IsVia),(IsVia) 0
Clearance Constraint (Gap=7.8mil) (InPadClass('Spacing Btwn Pads')),(InPadClass('Spacing Btwn Pads')) 0
Clearance Constraint (Gap=20mil) (InPolygon),(All) 0
Clearance Constraint (Gap=8mil) (All),(All) 0
Width Constraint (Min=8mil) (Max=100mil) (Preferred=15mil) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Routing Layers(All) 0
Routing Via (MinHoleWidth=16mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=20mil) (MinWidth=30mil) (MaxWidth=40mil) (PreferedWidth=40mil) (IsVia and InAnyComponent) 0
Routing Via (MinHoleWidth=16mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=16mil) (MinWidth=30mil) (MaxWidth=40mil) (PreferedWidth=30mil) (All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Minimum Annular Ring (Minimum=7mil) (All) 0
Hole Size Constraint (Min=8mil) (Max=251mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Net Antennae (Tolerance=0mil) (All) 0
Total 14

Clearance Constraint (Gap=10mil) (IsSMTPin),(IsVia)
Via (3258.8mil,691.6mil) Top Layer to Bottom Layer Pad U4-9(3258.8mil,691.6mil) Top Layer
Via (3258.6mil,4556.814mil) Top Layer to Bottom Layer Pad U12-9(3258.6mil,4556.814mil) Top Layer
Via (3258.6mil,5491.014mil) Top Layer to Bottom Layer Pad U14-9(3258.6mil,5491.014mil) Top Layer
Via (3244.8mil,1638.6mil) Top Layer to Bottom Layer Pad U6-9(3244.8mil,1638.6mil) Top Layer
Via (3249.6mil,2617.2mil) Top Layer to Bottom Layer Pad U8-9(3249.6mil,2617.2mil) Top Layer
Via (3260mil,3562.378mil) Top Layer to Bottom Layer Pad U10-9(3258.6mil,3557.707mil) Top Layer
Via (880mil,2690mil) Top Layer to Bottom Layer Pad Q3-9(851.862mil,2620mil) Top Layer
Via (880mil,2550mil) Top Layer to Bottom Layer Pad Q3-9(851.862mil,2620mil) Top Layer
Via (783.197mil,2690mil) Top Layer to Bottom Layer Pad Q3-9(851.862mil,2620mil) Top Layer
Via (783.197mil,2550mil) Top Layer to Bottom Layer Pad Q3-9(851.862mil,2620mil) Top Layer
Via (798.197mil,3340mil) Top Layer to Bottom Layer Pad Q2-9(863.725mil,3270mil) Top Layer
Via (798.197mil,3200mil) Top Layer to Bottom Layer Pad Q2-9(863.725mil,3270mil) Top Layer
Via (893.197mil,3340mil) Top Layer to Bottom Layer Pad Q2-9(863.725mil,3270mil) Top Layer
Via (891.862mil,3200mil) Top Layer to Bottom Layer Pad Q2-9(863.725mil,3270mil) Top Layer
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