Altiumcustomize

Design Rule Verification Report

Date : 2/21/2014
Time : 10:49:05 AM
Elapsed Time : 00:00:21
Filename : D:\MCCB_PGA\COMPLETED_E2\DesignFiles_FEB_21_2014\ISE3003.PcbDoc
Warnings : 0
Rule Violations : 17

Summary

Warnings Count
Total 0

Rule Violations Count
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('NewDifferentialPair1')) 0
Width Constraint (Min=10mil) (Max=200mil) (Preferred=10mil) (InDifferentialPair('NewDifferentialPair1')) 0
Net Antennae (Tolerance=0mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=10mil) (Max=100mil) (Preferred=10mil) (All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_1')) 1
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_2')) 0
Hole Size Constraint (Min=8mil) (Max=251mil) (All) 0
Minimum Annular Ring (Minimum=7mil) (All) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Un-Routed Net Constraint ( (All) ) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Routing Via (MinHoleWidth=12mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=16mil) (MinWidth=26mil) (MaxWidth=40mil) (PreferedWidth=32mil) (All) 0
Routing Via (MinHoleWidth=7.874mil) (MaxHoleWidth=12mil) (PreferredHoleWidth=7.874mil) (MinWidth=19.685mil) (MaxWidth=26mil) (PreferedWidth=19.685mil) (IsVia and InAnyComponent) 0
Routing Layers(All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Width Constraint (Min=6mil) (Max=100mil) (Preferred=10mil) (All) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InNetClass('RS485')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InDifferentialPair('RS485_1')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InDifferentialPair('RS485_2')) 0
Clearance Constraint (Gap=8mil) (All),(All) 0
Clearance Constraint (Gap=15mil) (InPolygon),(All) 0
Clearance Constraint (Gap=40mil) (OnCopper and Not InComponentClass('Logo') and not InComponentClass('FiducialMark') and not InRegion(1000,500,4000,800) and Not IsKeepout),(IsKeepOut) 1
Clearance Constraint (Gap=25mil) (OnCopper and InPoly),(IsKeepOut) 0
Clearance Constraint (Gap=40mil) (OnCopper and InComponentClass('Mounting Holes')),(IsKeepOut) 0
Clearance Constraint (Gap=20mil) (InPolygon),(InPolygon) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin) 15
Clearance Constraint (Gap=12mil) (IsVia),(IsVia) 0
Clearance Constraint (Gap=7.9mil) (InPadClass('PADClass')),(InPadClass('PADClass')) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsThruPin) 0
Clearance Constraint (Gap=22mil) (InNet('39V')),(All) 0
Clearance Constraint (Gap=40mil) (InPadClass('MTG')),(InPolygon) 0
Width Constraint (Min=10mil) (Max=10mil) (Preferred=10mil) (InDifferentialPair('RS485_2')) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_2')) 0
Total 17

Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_1'))
Differential Pairs Routing Between Net RS485_ISO_A And Net RS485_ISO_B
Back to top

Clearance Constraint (Gap=40mil) (OnCopper and Not InComponentClass('Logo') and not InComponentClass('FiducialMark') and not InRegion(1000,500,4000,800) and Not IsKeepout),(IsKeepOut)
Region (0 hole(s)) Keep-Out Layer Pad H7-1(1377.953mil,1968.504mil) Multi-Layer
Back to top

Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin)
Via (3418mil,2823.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3418mil,2921.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3418mil,3019.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3320mil,2823.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3222mil,2823.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3320mil,2921.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3222mil,2921.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3320mil,3019.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (3222mil,3019.89mil) Top Layer to Bottom Layer Pad U3-2(3320mil,2921.89mil) Top Layer
Via (404.95mil,1764.85mil) Top Layer to Bottom Layer Pad U5-17(420.05mil,1750.15mil) Top Layer
Via (434.95mil,1734.85mil) Top Layer to Bottom Layer Pad U5-17(420.05mil,1750.15mil) Top Layer
Via (3411.378mil,2433.622mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3411.378mil,2386.378mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3458.622mil,2433.622mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3458.622mil,2386.378mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Back to top