COPYRIGHT (C) 2021 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER		-	TI          	
CARD NAME		-	308789-8787-D
PART NUMBER		-	-
DATE                  	-       29-April-2021
DESIGNED AT     	-       Tessolve Semiconductor Pvt. Ltd.
CONTACT E-Mail ID	-       engineering_cbe@tessolve.com
GERBER FORMAT 		-       RS274X , ENGLISH  2,5 LEADING
DRILL FORMAT 		-	EXCELLON ENGLISH  2,5 TRAILING
PACKAGE NAME   		-	8787-D_MMWCAS-DSP-EVM_FAB.zip

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LIST OF FILES INSIDE PACKAGE:

ELECTRICAL LAYERS :

PROC055B.GTL	- Layer 1 (L1 Top Layer)
PROC055B.G1     - Layer 2 (L2 GND) 
PROC055B.G2     - Layer 3 (L3 Signal)
PROC055B.GP1 	- Layer 4 (L4 GND)
PROC055B.G3 	- Layer 5 (L5 Signal)
PROC055B.GP2 	- Layer 6 (L6 GND)
PROC055B.G4 	- Layer 7 (L7 Signal)
PROC055B.G5 	- Layer 8 (L8 Signal)
PROC055B.GP3 	- Layer 9 (L9 GND)
PROC055B.GP4 	- Layer 10 (L10 PWR)
PROC055B.GP5 	- Layer 11 (L11 GND)
PROC055B.GP6 	- Layer 12 (L12 PWR)
PROC055B.GP7 	- Layer 13 (L13 GND)
PROC055B.GP8 	- Layer 14 (L14 PWR)
PROC055B.GP9 	- Layer 15 (L15 GND)
PROC055B.G6 	- Layer 16 (L16 Signal)
PROC055B.GP10 	- Layer 17 (L17 GND)
PROC055B.G7 	- Layer 18 (L18 Signal)
PROC055B.GP11 	- Layer 19 (L19 GND)
PROC055B.G8 	- Layer 20 (L20 Signal)
PROC055B.GP12 	- Layer 21 (L21 GND)
PROC055B.GBL 	- Layer 22 (L22 Bottom)


NON ELECTRICAL LAYERS :

PROC055B.GTS	- Solder Mask Top Side 
PROC055B.GBS	- Solder Mask Bottom Side 
PROC055B.GTO	- Silkscreen Top Side
PROC055B.GBO	- Silkscreen Bottom Side
PROC055B.GBP	- Solder Paste Bottom Side
PROC055B.GTP	- Solder Paste Top Side
PROC055B.GD1	- Drill Drawing (L01-L22)
PROC055B.GD2	- Drill Drawing (L01-L02)
PROC055B.GD3	- Drill Drawing (L20-L21)
PROC055B.GD4	- Drill Drawing (L02-L03)
PROC055B.GD5	- Drill Drawing (L21-L22)
PROC055B.GM1	- Board Outline
PROC055B.GM2	- Board dimension
PROC055B.GM9	- Title Block
PROC055B.GM10	- FAB information
PROC055B.GM12	- Layer Stack-up

DRILL LAYERS :

PROC055B-RoundHoles-Plated.TXT	  - Plated through holes drill file
PROC055B-RoundHoles-Plated.TX1	  - Plated drill L01 - L02
PROC055B-RoundHoles-Plated.TX2	  - Plated drill L20 - L21
PROC055B-RoundHoles-Plated.TX3	  - Plated drill L02 - L03
PROC055B-RoundHoles-Plated.TX4	  - Plated drill L21 - L22
PROC055B-SlotHoles-Plated.TXT	  - Plated through holes slot file
PROC055B-RoundHoles-NonPlated.TXT - Non-Plated through holes drill file

OTHER FILES :

IPC356A.ipc 		         - IPC-D-356A Netlist 
All Layers.pdf		         - PDF Plots of all layers
Readme_Fab.txt		         - This files
