ZHCSJ53 December   2018 TMUX1109

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      应用示例
      2.      方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VDD = 5 V ±10 %)
    6. 6.6  Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 6.7  Electrical Characteristics (VDD = 2.5 V ±10 %), (VSS = –2.5 V ±10 %)
    8. 6.8  Electrical Characteristics (VDD = 1.8 V ±10 %)
    9. 6.9  Electrical Characteristics (VDD = 1.2 V ±10 %)
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make
      6. 7.1.6  tON(EN) and tOFF(EN)
      7. 7.1.7  Charge Injection
      8. 7.1.8  Off Isolation
      9. 7.1.9  Crosstalk
      10. 7.1.10 Bandwidth
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail to Rail Operation
      3. 7.3.3 1.8 V Logic Compatible Inputs
      4. 7.3.4 Fail-Safe Logic
      5. 7.3.5 Ultra-low Leakage Current
      6. 7.3.6 Ultra-low Charge Injection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Information
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性