SLVA959B November   2018  – October 2021

1.   Trademarks
2. 1Grounding Optimization
   1. 1.1 Frequently Used Terms/Connections
   2. 1.2 Using a Ground Plane
      1. 1.2.1 Two-Layer Board Techniques
   3. 1.3 Common Problems
      1. 1.3.1 Capacitive and Inductive Coupling
      2. 1.3.2 Common and Differential Noise
   4. 1.4 EMC Considerations
3. 2Thermal Overview
   1. 2.1 PCB Conduction and Convection
   2. 2.2 Continuous Top-Layer Thermal Pad
   3. 2.3 Copper Thickness
   4. 2.4 Thermal Via Connections
   5. 2.5 Thermal Via Width
   6. 2.6 Summary of Thermal Design
4. 3Vias
   1. 3.1 Via Current Capacity
   2. 3.2 Via Layout Recommendations
      1. 3.2.1 Multi-Via Layout
      2. 3.2.2 Via Placement
5. 4General Routing Techniques
6. 5Bulk and Bypass Capacitor Placement
   1. 5.1 Bulk Capacitor Placement
   2. 5.2 Charge Pump Capacitor
   3. 5.3 Bypass/Decoupling Capacitor Placement
      1. 5.3.1 Near Power Supply
      2. 5.3.2 Near Power Stage
      3. 5.3.3 Near Switch Current Source
      4. 5.3.4 Near Current Sense Amplifiers
      5. 5.3.5 Near Voltage Regulators
7. 6MOSFET Placement and Power Stage Routing
   1. 6.1 Common Power MOSFET Packages
      1. 6.1.1 DPAK
      2. 6.1.2 D2PAK
      3. 6.1.3 TO-220
      4. 6.1.4 8-Pin SON
   2. 6.2 MOSFET Layout Configurations
   3. 6.3 Power Stage Layout Design
      1. 6.3.1 Switch Node
      2. 6.3.2 High-Current Loop Paths
      3. 6.3.3 VDRAIN Sense Pin
8. 7Current Sense Amplifier Routing
   1. 7.1 Single High-Side Current Shunt
   2. 7.2 Single Low-Side Current Shunt
   3. 7.3 Two-Phase and Three-Phase Current Shunt Amplifiers
   4. 7.4 Component Selection
   5. 7.5 Placement
   6. 7.6 Routing
   7. 7.7 Useful Tools (Net Ties and Differential Pairs)
   8. 7.8 Input and Output Filters
   9. 7.9 Do's and Don'ts
9. 8References
10. 9Revision History