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  • WL18x7MOD WiLink™ 8 Dual-Band Industrial Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE)

    • SWRS170L March   2014  – May 2025 WL1807MOD , WL1837MOD

      PRODUCTION DATA  

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  • WL18x7MOD WiLink™ 8 Dual-Band Industrial Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE)
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 7.9  WLAN Performance: 5GHz Transmitter Power
    10. 7.10 WLAN Performance: Currents
    11. 7.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 7.12 Bluetooth Performance: Transmitter, BR
    13. 7.13 Bluetooth Performance: Transmitter, EDR
    14. 7.14 Bluetooth Performance: Modulation, BR
    15. 7.15 Bluetooth Performance: Modulation, EDR
    16. 7.16 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    17. 7.17 Bluetooth Low Energy Performance: Transmitter Characteristics
    18. 7.18 Bluetooth Low Energy Performance: Modulation Characteristics
    19. 7.19 Bluetooth BR and EDR Dynamic Currents
    20. 7.20 Bluetooth Low Energy Currents
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Power Management
        1. 7.21.1.1 Block Diagram – Internal DC-DCs
      2. 7.21.2 Power-Up and SHUTDOWN States
      3. 7.21.3 Chip Top-level Power-Up Sequence
      4. 7.21.4 WLAN Power-Up Sequence
      5. 7.21.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.21.6 WLAN SDIO Transport Layer
        1. 7.21.6.1 SDIO Timing Specifications
        2. 7.21.6.2 SDIO Switching Characteristics – High Rate
      7. 7.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.21.7.1 UART 4-Wire Interface – H4
      8. 7.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1837MOD Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM
  14. IMPORTANT NOTICE
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Data Sheet

WL18x7MOD WiLink™ 8 Dual-Band Industrial Module –
Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE)

1 Features

  • General
    • Integrates RF, power amplifiers (PAs), clocks, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –40°C to +85°C industrial temperature grade
    • Small form factor: 13.3mm × 13.4mm × 2mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi®
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
    • 20MHz and 40MHz SISO and 20MHz 2 × 2 MIMO at 2.4GHz for high throughput: 80Mbps (TCP), 100Mbps (UDP)
    • 2.4GHz MRC support for extended range and 5GHz diversity capable
    • Fully calibrated: Production calibration is not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth® and Bluetooth Low Energy: WL1837MOD only
    • Bluetooth 5.1 secure connection compliant and CSA2 support; declaration ID: D052427
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI's Bluetooth and Bluetooth Low Energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices' connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

 
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