ZHCSCI5B May   2014  – July 2016 TPS544B20 , TPS544C20

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Turn-On and Turn-Off Delay and Sequencing
      2. 8.3.2  Pre-Biased Output Start-Up
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Differential Remote Sense and Output Voltage Setting
      5. 8.3.5  PMBus Output Voltage Adjustment
      6. 8.3.6  Switching Frequency
      7. 8.3.7  Soft-Start
      8. 8.3.8  Linear Regulators BP3 and BP6
      9. 8.3.9  External Bypass (BPEXT)
      10. 8.3.10 Current Monitoring and Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 High-Side MOSFET Short-Circuit Protection
      12. 8.3.12 Over-Temperature Protection
      13. 8.3.13 Input Undervoltage Lockout (UVLO)
      14. 8.3.14 Output Overvoltage and Undervoltage Protection
      15. 8.3.15 Fault Protection Responses
      16. 8.3.16 PMBus General Description
      17. 8.3.17 PMBus Address
      18. 8.3.18 PMBus Connections
      19. 8.3.19 Auto ARA (Alert Response Address) Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 Operation with Internal BP6 Regulator
      3. 8.4.3 Operation with BP External
      4. 8.4.4 Operation with CNTL Signal Control
      5. 8.4.5 Operation with OPERATION Control
      6. 8.4.6 Operation with CNTL and OPERATION Control
      7. 8.4.7 Operation with Output Margining
    5. 8.5 Programming
      1. 8.5.1 Supported PMBus Commands
    6. 8.6 Register Maps
      1. 8.6.1  OPERATION (01h)
        1. 8.6.1.1 On
        2. 8.6.1.2 Margin
      2. 8.6.2  ON_OFF_CONFIG (02h)
        1. 8.6.2.1 pu
        2. 8.6.2.2 cmd
        3. 8.6.2.3 cpr
        4. 8.6.2.4 pol
        5. 8.6.2.5 cpa
      3. 8.6.3  CLEAR_FAULTS (03h)
      4. 8.6.4  WRITE_PROTECT (10h)
        1. 8.6.4.1 bit5
        2. 8.6.4.2 bit6
        3. 8.6.4.3 bit7
      5. 8.6.5  STORE_USER_ALL (15h)
      6. 8.6.6  RESTORE_USER_ALL (16h)
      7. 8.6.7  CAPABILITY (19h)
      8. 8.6.8  VOUT_MODE (20h)
        1. 8.6.8.1 Mode:
        2. 8.6.8.2 Exponent
      9. 8.6.9  VIN_ON (35h)
        1. 8.6.9.1 Exponent
        2. 8.6.9.2 Mantissa
      10. 8.6.10 VIN_OFF (36h)
        1. 8.6.10.1 Exponent
        2. 8.6.10.2 Mantissa
      11. 8.6.11 IOUT_CAL_OFFSET (39h)
        1. 8.6.11.1 Exponent
        2. 8.6.11.2 Mantissa
      12. 8.6.12 IOUT_OC_FAULT_LIMIT (46h)
        1. 8.6.12.1 Exponent
        2. 8.6.12.2 Mantissa
      13. 8.6.13 IOUT_OC_FAULT_RESPONSE (47h)
        1. 8.6.13.1 RS[2:0]
      14. 8.6.14 IOUT_OC_WARN_LIMIT (4Ah)
        1. 8.6.14.1 Exponent
        2. 8.6.14.2 Mantissa
      15. 8.6.15 OT_FAULT_LIMIT (4Fh)
        1. 8.6.15.1 Exponent
        2. 8.6.15.2 Mantissa
      16. 8.6.16 OT_WARN_LIMIT (51h)
        1. 8.6.16.1 Exponent
        2. 8.6.16.2 Mantissa
      17. 8.6.17 TON_RISE (61h)
        1. 8.6.17.1 Exponent
        2. 8.6.17.2 Mantissa
      18. 8.6.18 STATUS_BYTE (78h)
      19. 8.6.19 STATUS_WORD (79h)
      20. 8.6.20 STATUS_VOUT (7Ah)
      21. 8.6.21 STATUS_IOUT (7Bh)
      22. 8.6.22 STATUS_TEMPERATURE (7Dh)
      23. 8.6.23 STATUS_CML (7Eh)
      24. 8.6.24 STATUS_MFR_SPECIFIC (80h)
      25. 8.6.25 READ_VOUT (8Bh)
      26. 8.6.26 READ_IOUT (8Ch)
        1. 8.6.26.1 Exponent
        2. 8.6.26.2 Mantissa
      27. 8.6.27 READ_TEMPERATURE_2 (8Eh)
        1. 8.6.27.1 Exponent
        2. 8.6.27.2 Mantissa
      28. 8.6.28 PMBUS_REVISION (98h)
      29. 8.6.29 MFR_SPECIFIC_00 (D0h)
      30. 8.6.30 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
      31. 8.6.31 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
      32. 8.6.32 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
      33. 8.6.33 PCT_VOUT_FAULT_PG_LIMIT (MFR_SPECIFIC_07) (D7h)
      34. 8.6.34 SEQUENCE_TON_TOFF_DELAY (MFR_SPECIFIC_08) (D8h)
      35. 8.6.35 OPTIONS (MFR_SPECIFIC_21) (E5h)
      36. 8.6.36 MASK_SMBALERT (MFR_SPECIFIC_23) (E7h)
        1. 8.6.36.1  mOTFI
        2. 8.6.36.2  mPRTCL
        3. 8.6.36.3  mSMBTO
        4. 8.6.36.4  mIVC
        5. 8.6.36.5  mIVD
        6. 8.6.36.6  mPEC
        7. 8.6.36.7  mMEM
        8. 8.6.36.8  Auto_ARA
        9. 8.6.36.9  mOTF
        10. 8.6.36.10 mOTW
        11. 8.6.36.11 mOCF
        12. 8.6.36.12 mOCW
        13. 8.6.36.13 mOVF
        14. 8.6.36.14 mUVF
        15. 8.6.36.15 mPGOOD
        16. 8.6.36.16 mVIN_UV
      37. 8.6.37 DEVICE_CODE (MFR_SPECIFIC_44) (FCh)
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency Selection
        2. 9.2.2.2  Inductor Selection
        3. 9.2.2.3  Output Capacitor Selection
          1. 9.2.2.3.1 Response to a Load Transition
          2. 9.2.2.3.2 Output Voltage Ripple
        4. 9.2.2.4  D-CAP Mode and D-CAP2 Mode Stability
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  Bootstrap Capacitor and Resistor Selection
        7. 9.2.2.7  BP6, BP3 and BPEXT
        8. 9.2.2.8  R-C Snubber and VIN Pin High-Frequency Bypass
        9. 9.2.2.9  Temperature Sensor
        10. 9.2.2.10 Key PMBus Parameter Selection
          1. 9.2.2.10.1 Enable, UVLO and Sequencing
          2. 9.2.2.10.2 Soft-Start Time
          3. 9.2.2.10.3 Overcurrent Threshold and Response
          4. 9.2.2.10.4 Power Good, Output Overvoltage and Undervoltage Protection
        11. 9.2.2.11 Output Voltage Setting and Frequency Compensation Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Mounting and Thermal Profile Recommendation
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 德州仪器 (TI) Fusion Digital Power设计人员
      2. 12.1.2 器件命名规则
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 启用 PMBus 的转换器:20A,30A
  • 4.5V 至 18V 输入,0.6V 至 5.5V 输出
  • 5mm x 7mm 薄型四方扁平无引线 (LQFN) 封装,焊球间距为 0.5mm
  • 单个散热焊盘
  • 集成 4.5mΩ 和 2.0mΩ 堆叠 NexFET™功率级
  • 600mV,0.5% 基准
  • 无损耗、低侧金属氧化物半导体场效应晶体管 (MOSFET) 电流感测
  • 可选 D-CAP™和 D-CAP2™模式控制
  • 差分远程感应
  • 单启动至预偏置输出
  • 输出电压裕度和修整
  • 输出电压和输出电流报告
  • 使用 2N3904 时的外部温度监视
  • 可经由 PMBus 编程
    • 过流保护
    • 欠压闭锁 (UVLO),软启动
    • 电源正常 (PGOOD),过压 (OV),欠压 (UV),过热 (OT) 电平
    • 故障响应
    • 接通和关闭延迟
  • 热关断
  • 引脚兼容 20A,30A 转换器

应用范围

  • 测试和测量仪器
  • 以太网交换机、光交换机、路由器、基站
  • 服务器
  • 企业级存储固态硬盘 (SSD)
  • 高密度电源解决方案

说明

TPS544B20 和 TPS544C20 器件是 PMBus 兼容型非隔离式直流/直流集成式 FET 转换器,支持高频运行并提供 20A 或 30A 电流输出,采用 5mm × 7mm 封装,可实现高功率密度和快速瞬态性能,具有最小的 PCB 面积。PMBus 接口用于转换器配置,并监视关键参数,其中包括输出电压、电流和一个可选外部温度。由集成 NexFET 功率级和经优化驱动器提供的高频、低损耗开关可实现极高密度电源解决方案以及减小的电感器和滤波电容器尺寸。根据系统要求,对故障情况的响应可被设定为重新启动或锁断。

Table 1. 器件信息(1)

部件名称 封装 封装尺寸(标称值)
TPS544B20 LQFN (40) 5.00mm x 7.00mm
TPS544C20
  1. 如需了解所有可用封装,请见数据表末尾的可订购产品附录。

效率与输出电流间的关系

TPS544B20 TPS544C20 Efficiency_12vin_fp.png

修订历史记录

Changes from A Revision (February 2016) to B Revision

Changes from * Revision (May 2014) to A Revision