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  • TMDS181x 6Gbps TMDS 重定时器

    • ZHCSE70D August   2015  – September 2017 TMDS181

      PRODUCTION DATA.  

  • CONTENTS
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  • TMDS181x 6Gbps TMDS 重定时器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Electrical Characteristics
    6. 6.6  TMDS Differential Input Electrical Characteristics
    7. 6.7  TMDS Differential Output Electrical Characteristics
    8. 6.8  DDC, I2C, HPD, and ARC Electrical Characteristics
    9. 6.9  Power-Up and Operation Timing Requirements
    10. 6.10 TMDS Switching Characteristics
    11. 6.11 HPD Switching Characteristics
    12. 6.12 DDC and I2C Switching Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Reset Implementation
      2. 8.3.2  Operation Timing
      3. 8.3.3  Swap and Polarity Working
      4. 8.3.4  TMDS Inputs
      5. 8.3.5  TMDS Inputs Debug Tools
      6. 8.3.6  Receiver Equalizer
      7. 8.3.7  Input Signal Detect Block
      8. 8.3.8  Audio Return Channel
      9. 8.3.9  Transmitter Impedance Control
      10. 8.3.10 TMDS Outputs
      11. 8.3.11 Pre-Emphasis/De-Emphasis
    4. 8.4 Device Functional Modes
      1. 8.4.1 Retimer Mode
      2. 8.4.2 Redriver Mode
      3. 8.4.3 DDC Training for HDMI2.0a Data Rate Monitor
      4. 8.4.4 DDC Functional Description
      5. 8.4.5 Mode Selection Functional Description
    5. 8.5 Register Maps
      1. 8.5.1 Local I2C Overview
      2. 8.5.2 Local I2C Control Bit Access TAG Convention
      3. 8.5.3 CSR Bit Field Definitions
        1. 8.5.3.1 ID Registers
        2. 8.5.3.2 MISC CONTROL Register
        3. 8.5.3.3 Equalization Control Register
        4. 8.5.3.4 RX PATTERN VERIFIER CONTROL/STATUS Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Source Side Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Sink Side Application
      3. 9.2.3 Application Chain Showing DDC Connections
        1. 9.2.3.1 Detailed Design Procedure
          1. 9.2.3.1.1 DDC Pullup Resistors
          2. 9.2.3.1.2 Compliance Testing
            1. 9.2.3.1.2.1 Pin Strapping Configuration for HDMI2.0a and HDMI1.4b
            2. 9.2.3.1.2.2 I2C Control for HDMI2.0a and HDMI1.4b
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息
  14. 重要声明
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DATA SHEET

TMDS181x 6Gbps TMDS 重定时器

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

1 特性

  • HDMI™ 输入端口与输出端口间具有时钟和数据恢复 (CDR) 电路,支持高达 6Gbps 的数据速率
  • 在重定时器模式下可兼容高达 6Gbps 的 HDMI™ 电气参数
  • 支持 4k2k60p 和高达 WUXGA 16 位色深或 1080p,具有更高的刷新率
  • 对输入流重新定时以补偿随机抖动
  • 自适应接收器均衡器或可编程固定均衡器
  • I2C 和引脚设置可编程
  • 5+ 位对内偏移补偿
  • 支持单端模式 ARC
  • 链路调试工具包括位于RX 均衡器之后眼图
  • 48 引脚 7mm × 7mm 0.5mm 间距超薄型四方扁平无引线 (VQFN) 封装
  • 扩展商业温度范围为 0°C 至 85°C (TMDS181)
  • 工业温度范围为 -40°C 至 85°C (TMDS181I)

2 应用

  • 数字电视
  • 数字投影仪
  • 音频/视频设备
  • Blu-Ray™DVD
  • 监视器
  • 台式机/一体化计算机
  • 有源线缆

3 说明

TMDS181x 是一款数字视频接口 (DVI) 或高清多媒体接口 (HDMI™) 重定时器。TMDS181x 支持四条 TMDS 通道,音频返回通道 (SPDIF_IN/ARC_OUT) 和数字显示控制 (DDC) 接口。TMDS181x 支持高达 6Gbps 的信号传输速率,可实现最高分辨率达 4k2k60p 24 位/像素和高达 WUXGA 16 位色深或 1080p,并且具有较高的刷新率。TMDS181x 经配置可支持 HDMI2.0a 标准。TMDS181x 在低于 1.0Gbps 的数据速率下会自动配置为重驱动器,而在高于该速率时会自动配置为重定时器。重驱动器模式支持 HDMI1.4b,数据速率高达 3.4Gbps

TMDS181x 支持双电源轨(VDD 为 1.2V,VCC 为 3.3V),有助于降低功耗。该器件采用多种电源管理方法来降低整体功耗。TMDS181x 通过 I2C 或引脚设置支持固定的接收 EQ 增益或自适应接收 EQ 控制,以补偿不同长度的输入电缆或电路板走线。

器件信息(1)

器件型号 封装 封装尺寸(标称值)
TMDS181 VQFN (48) 7.00mm × 7.00mm
TMDS181I
  1. 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品附录。

空白

简化电路原理图

TMDS181 TMDS181I sch_FAD_LASE75.gif
TMDS181 TMDS181I FAD_LASE75.gif

4 修订历史记录

Changes from C Revision (July 2016) to D Revision

  • Added Note 5 to the Power Supply Electrical Characteristic table Go
  • Deleted text "which is needed for certain HDMI CTS test." from the third paragraph in the Overview section Go
  • Changed section: Input Signal Detect Block Go
  • Changed H to X in the first row of the HPD_SNK column in Table 12Go
  • Changed the IN_Dx column in Table 12 Go

Changes from B Revision (April 2016) to C Revision

  • Recommended Operating Conditions, Changed the CONTROL PINS section Go
  • DDC, I2C, HPD, and ARC Electrical Characteristics, Changed the DDC AND I2C sectionGo

Changes from A Revision (October 2015) to B Revision

  • Recommended Operating Conditions, Added VIL "Low-level input voltage at HPD, OE"Go
  • Recommended Operating Conditions, Moved pin OE From: VIH MIN value of 2 V To: VIH MIN value of 2.6 V Go
  • Power-Up and Operation Timing Requirements, Deleted the VDD_ramp and VCC_ramp MIN values Go
  • Changed Figure 1 Go
  • DDC Functional Description, Changed text "address 22h (see Figure 31) through the I2C interface." To: "address 0Bh through the I2C interface."Go
  • Added Note to 11–400-kbps in Table 6Go
  • Added Note to 11–400-kbps in Table 6Go

Changes from * Revision (August 2015) to A Revision

  • 已将器件状态从“产品预览”更新为“量产数据”Go
  • Absolute Maximum Ratings, Changed max value from 1.56 V to VCC + 0.3V; added input current and Min valueGo
  • Absolute Maximum Ratings, Added Max Input Current on Main Link Differential Input pinsGo
  • Recommended Operating Conditions, Updated the note showing the values shown are only for Microcontroller driven and not values based upon pull up or pull down resistors. Go
  • Power Supply Electrical Characteristics, Increased Max Value of ISD2 from 10 to 15mA Go
  • TMDS Differential Input Electrical Characteristics, Changed Max Receiver impedance value to 115 Go
  • DDC, I2C, HPD, and ARC Electrical Characteristics, Inserted values for SCL/SDA_SNK Go
  • TMDS Switching Characteristics, Changed from 6000 to 3400 Go
  • Table 4, Deleted Clear and NA Access Tags Go
  • Table 8, Removed reg20h[5:4] ARC_SWING Go
  • Figure 35, Removed 1k pullup from switch as not needed Go
  • Pin Strapping Configuration for HDMI2.0a and HDMI1.4b, Added Note for VSADJ resistor value in Compliance Pin Strapping section Go
  • Pin Strapping Configuration for HDMI2.0a and HDMI1.4b, Changed De-emphasis value from 0 dB to -2 dB for recommended configuration for compliance testing.Go
  • I2C Control for HDMI2.0a and HDMI1.4b, Added Note for VSADJ resistor value in Compliance I2C control section and included register that can increase or decrease the VOD swing Go

5 Pin Configuration and Functions

RGZ Package
48-Pin VQFN
Top View
TMDS181 TMDS181I po_LASE75.gif

Pin Functions(2)

PIN TYPE(1) DESCRIPTION
NAME NO.
VCC 13, 43 P 3.3 V power supply
VDD 14, 23, 24, 37, 48 P 1.2 V power supply
GND 7, 19, 41, 30,
Thermal pad
G Ground
MAIN LINK INPUT PINS
IN_D2p/n 2, 3 I Channel 2 differential input
IN_D1p/n 5, 6 I Channel 1 differential input
IN_D0p/n 8, 9 I Channel 0 differential input
IN_CLKp/n 11, 12 I Clock differential input
MAIN LINK OUTPUT PINS (FAIL SAFE)
OUT_D2n/p 34, 35 O TMDS data 2 differential output
OUT_D1n/p 31, 32 O TMDS data 1 differential output
OUT_D0n/p 28, 29 O TMDS data 0 differential output
OUT_CLKn/p 25, 26 O TMDS data clock differential output
HOT PLUG DETECT PINS
HPD_SRC 4 O Hot plug detect output to source side
HPD_SNK 33 I Hot plug detect input from sink side
AUDIO RETURN CHANNEL AND DDC PINS
SPDIF_IN
ARC_OUT
45
44
I/O SPDIF signal input
Audio return channel output
SDA_SRC
SCL_SRC
47
46
I/O Source side TMDS port bidirectional DDC data line
Source side TMDS port bidirectional DDC clock line
SDA_SNK
SCL_SNK
39
38
I/O Sink side TMDS port bidirectional DDC data line
Sink side TMDS port bidirectional DDC clock line
CONTROL PINS
OE 42 I Operation enable/reset pin
OE = L: Power-down mode
OE = H: Normal operation
Internal weak pull up: Resets device when transitions from H to L
SIG_EN 17 I Signal detector circuit enable
SIG_EN = L: Signal detect circuit disabled:
SIG_EN = H: Signal detect circuit enabled: When no valid clock device enters standby mode.
Internal weak pull down
PRE_SEL 20 I
3 level
De-emphasis control when I2C_EN/PIN = Low.
PRE_SEL = L: –2 dB
PRE_SEL = No Connect: 0 dB
PRE_SEL = H: Reserved
When I2C_EN/PIN = High de-emphasis is controlled through I2C
EQ_SEL/A0 21 I
3 level
Input receive equalization pin strap when I2C_EN/PIN = Low
EQ_SEL = L: Fixed EQ at 7.5 dB at 3 GHz
EQ_SEL = No Connect: Adaptive EQ
EQ_SEL = H: Fixed at 14 dB at 3 GHz
When I2C_EN/PIN = High address bit 1
Note: 3 level for pin strap programming but 2 level when I2C address
I2C_EN/PIN 10 I I2C_EN/PIN = High; puts device into I2C Control Mode
I2C_EN/PIN = Low; puts device into pin strap mode
Note: I2C CSR is addressable at all times, but features that can be controlled by pin strapping can only be changed by I2C when this pin is pulled high
SCL_CTL 15 I I2C clock signal
Note: When I2C_EN = Low Pin strapping takes priority and those functions cannot be changed by I2C
SDA_CTL 16 I/0 I2C data signal
Note: When I2C_EN = Low Pin strapping takes priority and those functions cannot be changed by I2C
VSadj 22 I TMDS-compliant voltage swing control nominal resistor to GND
A1 27 I High address bit 2 for I2C programming
Weak internal pull down
Note: When in Pin Strapping Mode leave pin as No connect
TX_TERM_CTL 36 I
3 level
Transmit termination control
TX_TERM_CTL = H, no transmit termination
TX_TERM_CTL = L, transmit termination impedance in approximately 75 to 150 Ω
TX_TERM_CTL = No Connect, automatically selects the termination impedance
Data rate (DR) > 3.4 Gbps – 75 to 150 Ω differential near end termination
2 Gbps > DR < 3.4 Gbps – 150 to 300 Ω differential near end termination
DR < 2 Gbps – no termination
Note: If left floating will be in automatic select mode.
SWAP/POL 1 I
3 level
Input lane SWAP and polarity control pin
SWAP/POL = H: receive lanes polarity swap (retimer mode only)
SWAP/POL = L: receive lanes swap (redriver and retimer mode)
SWAP/POL = No Connect: normal operation
NC 18, 40 NA No connect
(1) G = Ground, I = Input, O = Output, P = Power
(2) (H) Logic high (pin strapped to VCC through 65 kΩ resistor); (L) Logic Low (pin strapped to GND through 65 kΩ resistor); (for mid-level = No connect)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Supply voltage(3) VCC –0.3 4 V
VDD –0.3 1.4
Voltage Main link input differential voltage (IN_Dx, IN_CLKx) IIN = 15mA VCC - 0.75V VCC + 0.3V V
TMDS outputs ( OUT_Dx) –0.3 4
HPD_SRC, Vsadj, SDA_CTL, SCL_CTL, OE, A1, PRE_SEL, EQ_SEL/A0, I2C_EN/PIN, SIG_EN, TX_TERM_CTL, –0.3 4
HDP_SNK, SDA_SNK, SCL_SNK, SDA_SRC, SCL_SRC –0.3 6
Input Current IIN Main link input current (IN_Dx, IN_CLKx) 15 mA
Continuous power dissipation See Thermal Information
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage nominal value 3.3 V 3.135 3.3 3.465 V
VDD Supply voltage nominal value 1.2 V 1.1 1.2 1.27 V
TCASE Case temperature 92.7 °C
TA Operating free-air temperature TMDS181 0 85 °C
TMDS181I –40 85 °C
MAIN LINK DIFFERENTIAL PINS
VID_PP Peak-to-peak input differential voltage 75 1560 mVpp
VIC Input common mode voltage VCC – 0.4 VCC + 0.1 V
dR Data rate 0.25 6 Gbps
RVSADJ TMDS compliant swing voltage bias resistor nominal 4.5 7.06 kΩ
CONTROL PINS
VI-DC DC input voltage Control pins –0.3 3.6 V
VIL(1) Low-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL, SWAP/POL pins only 0.3 V
Low-level input voltage at OE 0.8
VIM(1) Mid-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL, SWAP/POL pins only 1 1.2 1.4 V
VIH(1) High-level input voltage at PRE_SEL, EQ_SEL/A0, TX_TERM_CTL, SWAP/POL, OE(2) pins only 2.6 V
VOL Low-level output voltage 0.4 V
VOH High-level output voltage 2.4 V
IIH High-level input current –30 30 µA
IIL Low-level input current –25 25 µA
IOS Short-circuit output current –50 50 mA
IOZ High impedance output current 10 µA
ROEPU Pullup resistance on OE pin 150 250 kΩ
(1) These values are based upon a microcontroller driving the control pins. The pullup/pulldown/floating resistor configuration will set the internal bias to the proper voltage level which will not match the values shown here.
(2) This value is based upon a microcontroller driving the OE pin. A passive reset circuit using an external capacitor and the internal pullup resistor will set OE pin properly, but may have a different value than shown due to internal biasing.

6.4 Thermal Information

THERMAL METRIC(1)(2) TMDS181x UNIT
RGZ (VQFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 31.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.2 °C/W
RθJB Junction-to-board thermal resistance 8.1 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 8.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Test conditions for ΨJB and ΨJT are clarified in the Semiconductor and IC Package Thermal Metrics.

6.5 Power Supply Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
PD1(3)(4) Device power dissipation
(retimer operation)
OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 6 Gbps TMDS pattern, VI = 3.3 V, I2C_EN/PIN = L, PRE_SEL= NC, EQ_SEL= NC, SDA_CTL/CLK_CTL = 0 V
800 900 mW
PD2(3)(4) Device power dissipation
(redriver operation)
OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 2.97 Gbps TMDS pattern, VI = 3.3 V, I2C_EN/PIN = L, PRE_SEL= NC, EQ_SEL= H, SDA_CTL/CLK_CTL = 0 V
500 600 mW
PSD1(3)(4)(5) Device power in standby OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V, HPD = H, No valid input signal 50 100 mW
PSD2(3)(4)(5) Device power in power down OE = L, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V 10 30 mW
ICC1(3)(4) VCC supply current (TMDS 6Gpbs retimer mode) OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 6 Gbps TMDS pattern
I2C_EN/PIN = L, PRE_SEL = NC, EQ_CTL = NC, SDA_CTL/CLK_CTL = 0 V
131 150 mA
IDD1(3)(4) VDD supply current (TMDS 6Gpbs retimer mode) OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 6 Gbps TMDS pattern
I2C_EN/PIN = L, PRE_SEL = NC, EQ_CTL = NC, SDA_CTL/CLK_CTL = 0 V
332 350 mA
ICC2(3)(4) VCC supply current (TMDS 6Gpbs redriver mode) OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 2.97 Gbps TMDS pattern
I2C_EN/PIN = L, PRE_SEL = NC, EQ_CTL = H, SDA_CTL/CLK_CTL = 0 V
92 mA
IDD2(3)(4) VDD supply current (TMDS 6Gpbs redriver mode) OE = H, VCC= 3.3 V/3.465 V, VDD = 1.2 V/1.27 V
IN_Dx: VID_PP = 1200 mV, 3.4 Gbps TMDS pattern
I2C_EN/PIN = L, PRE_SEL = NC, EQ_CTL = H, SDA_CTL/CLK_CTL = 0 V
187 mA
ISD1(5) Standby current OE = H, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V, HPD = H: No valid signal on IN_CLK 3.3 V rail(3) 6 15 mA
1.2 V rail 40 50
ISD2(5) Power-down current OE = L, VCC = 3.3 V/3.465 V, VDD = 1.2 V/1.27 V 3.3 V rail(3) 2 5 mA
1.2 V rail 3.5 15
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C temperature unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C temperature unless otherwise noted
(3) ICC is a direct result of the source design as the TMDS181x integrated receive termination resistor accounts for 85 to 110 mA.
(4) IDD is impacted by ARC usage. Connecting a 500 kΩ resistor to GND at SPDIF reduces the value by more than 20 mA
(5) The measurements were made with no active source connected.

6.6 TMDS Differential Input Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
DR_RX_DATA_RT TMDS data lanes data rate (Retimer Mode) 0.25 6 Gbps
DR_RX_DATA_RD TMDS data lanes data rate (Redriver Mode) 0.25 3.4 Gbps
DR_RX_CLK TMDS clock lanes clock rate 25 340 MHz
tRX_DUTY Input clock duty circle 40% 50% 60%
tCLK_JIT Input clock jitter tolerance 0.3 Tbit
tDATA_JIT Input data jitter tolerance Test the TTP2, see Figure 12 150 ps
tRX_INTRA Input intrapair skew tolerance Test at TTP2 when DR = 1.6 Gbps, see Figure 12 112 ps
tRX_INTER Input interpair skew tolerance 1.8 ns
EQH(D) Fixed EQ gain for data lane IN_D(0,1,2)n/p EQ_SEL/A0 = H; fixed EQ gain, test at 6 Gbps 15 dB
EQL(D) Fixed EQ gain for data lane IN_D(0,1,2)n/p EQ_SEL/A0 = L; fixed EQ gain, test at 6 Gbps 7.5 dB
EQZ(D) Adaptive EQ gain for data lane IN_D(0,1,2)n/p EQ_SEL/A0 = NC; adaptive EQ (Retimer Mode Only) 2 15 dB
EQ(c) EQ gain for clock lane IN_CLKn/p EQ_SEL/A0 = H,L,NC 3 dB
RINT Input differential termination impedance 85 100 115 Ω
VITERM Input termination voltage OE = H 3.3 3.465 V
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C unless otherwise noted

6.7 TMDS Differential Output Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
VOH Single-ended high level output voltage
Data rate ≤1.65 Gbps
PRE_SEL = NC; TX_TERM_CTL = H; OE = H; DR = 750 Mbps; VSadj = 7.06 kΩ; VCC – 10 VCC + 10 V
Single-ended high level output voltage
Data rate >1.65 Gbps and <3.4 Gbps
PRE_SEL = NC; TX_TERM_CTL = NC; OE = H; DR = 2.97 Gbps; VSadj = 7.06 kΩ; VCC-200 VCC + 10
Single-ended high level output voltage
Data rate >3.4 Gbps and < 6 Gbps(1)
PRE_SEL = NC; TX_TERM_CTL = L; OE = H; DR = 6 Gbps; VSadj = 7.06 kΩ; VCC – 400 VCC + 10
VOL Single-ended low level output voltage
Data rate ≤1.65 Gbps
PRE_SEL = NC; TX_TERM_CTL = H; OE = H; DR = 750 Mbps; VSadj = 7.06 kΩ; VCC – 600 VCC – 400 V
Single-ended low level output voltage
Data rate >1.65 Gbps and <3.4 Gbps
PRE_SEL = NC; TX_TERM_CTL = NC; OE = H; DR = 2.97 Gbps; VSadj = 7.06 kΩ; VCC – 700 VCC – 400
Single-ended low level output voltage
Data rate >3.4 Gbps and < 6 Gbps(1)
PRE_SEL = NC; TX_TERM_CTL = L; OE = H; DR = 6 Gbps; VSadj = 7.06 kΩ; VCC – 1000 VCC – 400
VSWING_DA Single-ended output voltage swing on data lane PRE_SEL = NC; TX_TERM_CTL = H/NC/L; OE = H; DR = 270 Mbps/2.97/6 Gbps VSadj = 7.06 kΩ; 400 500 600 mV
VSWING_CLK Single-ended output voltage swing on clock lane PRE_SEL = NC; TX_TERM_CTL = H; OE = H; Data rate ≤ 3.4 Gbps; VSadj = 7.06 kΩ; 400 500 600 mV
PRE_SEL = NC; TX_TERM_CTL = NC; OE = H; Data rate > 3.4 Gbps; VSadj = 7.06 kΩ; 200 300 400
ΔVSWING Change in single-end output voltage swing per 100 Ω ΔVSadj 20 mV
ΔVOCM(SS) Change in steady state output common mode voltage between logic levels –5 5 mV
VOD(PP) Output differential voltage before pre-emphasis VSADJ = 7.06 kΩ; PRE_SEL = NC see Figure 10 800 1200 mV
VOD(SS) Steady state output differential voltage VSADJ = 7.06 kΩ; PRE_SEL = L, see Figure 11 600 1075 mV
VOD_range Total TMDS data lanes output differential voltage for HDMI2.0. Retimer Mode Only
See Figure 14
3.4 Gbps < Rbit ≤ 3.712 Gps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H; VSadj = 7.06 kΩ;
335 mV
3.712 Gbps < Rbit < 5.94 Gbps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H; VSadj = 7.06 kΩ;
–19.66 × (Rbit2) + (106.74 × Rbit) + 209.58
5.94 Gbps ≤ Rbit ≤ 6.0 Gbps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H; VSadj = 7.06 kΩ;
150
IOS Short-circuit current limit Main link output shorted to GND 50 mA
ILEAK Failsafe condition leakage current VCC = 0 V; VDD = 0 V; TMDS Outputs pulled to 3.3 V through 50 Ω resistor; 45 μA
RTERM Source termination resistance for HDMI2.0 75 150 Ω
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C unless otherwise noted

6.8 DDC, I2C, HPD, and ARC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
DDC AND I2C
VI-DC SCL/SDA_SNK, SCL/SDA_SRC DC input voltage –0.3 5.5 V
SCL/SDA_CTL, DC input voltage –0.3 3.6 V
VIL SCL/SDA_SNK, SCL/SDA_SRC Low level input voltage 0.3 x VCC V
SCL/SDA_CTL Low level input voltage 0.3 x VCC V
VIH SCL/SDA_SNK, SCL/SDA_SRC high level input voltage 3 V
SCL/SDA_CTL high level input voltage 0.7 x VCC V
VOL SCL/SDA_CTL, SCL/SDA_SRC low level output voltage I0 = 3 mA and VCC > 2 V 0.4 V
I0 = 3 mA and VCC < 2 V 0.2 x VCC
fSCL SCL clock frequency fast I2C mode for local I2C control 400 kHz
Cbus Total capacitive load for each bus line (DDC and local I2C pins) 400 pF
HPD
VIH High-level input voltage HPD_SNK 2.1 V
VIL Low-level input voltage HPD_SNK 0.8 V
VOH High-level output voltage IOH = –500 µA; HPD_SRC, 2.4 3.6 V
VOL Low-level output voltage IOL = 500 µA; HPD_SRC, 0 0.1 V
ILEAK Failsafe condition leakage current VCC = 0 V; VDD = 0 V; HPD_SNK = 5 V; 40 μA
IH_HPD High-level input current Device powered; VIH = 5 V;
IH_HPD includes RpdHPD resistor current
40 µA
Device powered; VIL = 0.8 V;
IL_HPD includes RpdHPD resistor current
30
RpdHPD HPD input termination to GND VCC = 0 V 150 190 220 kΩ
SPDIF AND ARC
VEL Operating DC voltage for single mode ARC output Test at ARC_OUT, see Figure 22 0 5 V
VIN_DC Operating DC voltage for SPDIF input 0.05 V
VSP_SW Signal amplitude of SPDIF input 0.2 0.5 0.6 V
VElSWING Signal amplitude on the ARC output Test at ARC_OUT, 55 Ω external termination resistor, see Figure 22 0.4 0.5 0.6 V
CLK_ARC Signal frequency on ARC Test at ARC_OUT, see Figure 22 3.687 5.645 ±0.1% 13.517 MHz
Duty cycle Output clock duty cycle 45% 50% 55%
Data rate SPDIF input DR 7.373 11.29 27.034 Mbps
tEDGE Rise/fall time for ARC output From 10% to 90% voltage level 0.4 UI
R_IN_SPDIF Input termination resistance for SPDIF 75 Ω
Rest Single mode output termination resistance 0.1 MHz to 128× the maximum frame rate 36 55 75 Ω
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C unless otherwise noted

6.9 Power-Up and Operation Timing Requirements

over operating free-air temperature range (unless otherwise noted) (1)
MIN NOM MAX UNIT
td1 VDD stable before VCC 0 200 µs
td2 VDD and VCC stable before OE assertion 100 µs
td3 CDR active operation after retimer mode initial 15 ms
td4 CDR turn off time after retimer mode de-assert 120 ns
VDD_ramp VDD supply ramp up requirements 100 ms
VCC_ramp VCC supply ramp up requirements 100 ms
(1) See Operation Timing for more information
TMDS181 TMDS181I Power_up_Timing_sllsen7.gif Figure 1. Power-Up Timing for TMDS181
TMDS181 TMDS181I CDR_Timing_sllsen7.gif Figure 2. CDR Timing for TMDS181

6.10 TMDS Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
REDRIVER MODE
dR Data rate (redriver mode) 250 3400 Mbps
tPLH Propagation delay time (low to high) 250 600 ps
tPHL Propagation delay time (high to low) 250 800 ps
tT1(1.4b) Transition time (rise and fall time); measured at 20% and 80% levels for data lanes. TMDS clock meets tT3 for all three times. TX_TERM_CTL = NC; PRE_SEL = NC; OE = H; 1.48 Gbps and 2.97 Gbps data lines, 148 MHz and 297 MHz clock 75 ps
tT3 TX_TERM_CTL = NC; PRE_SEL = NC; OE = H; 1.48 Gbps, 2.97 Gbps 100 ps
tSK_INTRA Intra-pair output skew Default setting for internal intra-pair skew adjust, TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps, 2.97 Gbps; See Figure 8 40 ps
tSK_INTER Inter-pair output skew Default setting for internal inter-pair skew adjust, TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps, 2.97 Gbps; See Figure 8 100 ps
tJITD1(1.4b) Total output data jitter HDMI1.4b DR = 2.97 Gbps, PRE_SEL = NC, EQ_SEL/A0 = NC ; . See Figure 12 at TTP3 0.2 Tbit
tJITC1(1.4b) Total output clock jitter CLK = 25 MHz, 74.25 MHz, 75 MHz, 150 MHz, 297 MHz 0.25 Tbit
RETIMER MODE
dR Data rate (retimer mode) 0.25 6 Gbps
dXVR Automatic redriver to retimer crossover (when selected) Measured with input signal applied = 200 mVpp 0.75 1 1.25 Gbps
fCROSSOVER Crossover frequency hysteresis 250 MHz
PLLBW Data retimer PLL bandwidth Default loop bandwidth setting 0.4 1 MHz
tACQ Input clock frequency detection and retimer acquisition time 180 µs
IJT1 Input clock jitter tolerance Tested when data rate >1.0Gbps 0.3 Tbit
tT1(2.0) Transition time (rise and fall time); measured at 20% and 80% levels for data lanes. TMDS clock meets tT3 for all three times. TX_TERM_CTL = L; PRE_SEL = NC; 6 Gbps data lines, 45 ps
tT1 (1.4b) TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps and 2.97 Gbps data lines, 148 MHz and 297 MHz clock 75 ps
tT3 TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps, 2.97 Gbps, 6 Gbps data lines, 148 MHz, 297 MHz clock 100 ps
tDCD OUT_CLK ± duty cycle 40% 50% 60%
tSK_INTER Inter-pair output skew Default setting for internal inter-pair skew adjust, TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps, 2.97 Gbps, 6 Gbps data lines, 148 MHz, 297 MHz clock; See Figure 8 0.2 Tch
tSK_INTRA Intra-pair output skew Default setting for internal intra-pair skew adjust, TX_TERM_CTL = NC; PRE_SEL = NC; 1.48 Gbps, 2.97 Gbps, 6 Gbps data lines, 148 MHz, 297 MHz clock; See Figure 8 0.15 Tbit
tJITC1(1.4b) Total output clock jitter CLK = 25 MHz, 74.25 MHz, 75 MHz, 150 MHz, 297 MHz 0.25 Tbit
tJITC1(2.0) DR = 6 Gbps: CLK = 150 MHz 0.3 Tbit
tJITD2 Total output data jitter
See Figure 14
3.4 Gbps < Rbit ≤ 3.712 Gps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H
0.4 Tbit
3.712 Gbps < Rbit < 5.94 Gbps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H
–0.0332Rbit2 + 0.2312Rbit + 0.1998
5.94 Gbps ≤ Rbit ≤ 6.0 Gbps
TX_TERM_CTL = NC; PRE_SEL = NC; OE = H
0.6
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C unless otherwise noted

6.11 HPD Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX(1) UNIT
tPD(HPD) Propagation delay from HPD_SNK to HPD_SRC; rising edge and falling edge(1) See Figure 16; not valid during switching time 40 120 ns
tT(HPD) HPD logical disconnected timeout See Figure 17 2 ms
(1) The maximum rating is simulated at 3.465 V VCC and 1.27 V VDD and at 85°C unless otherwise noted
(2) The typical rating is simulated at 3.3 V VCC and 1.2 V VDD and at 27°C unless otherwise noted

6.12 DDC and I2C Switching Characteristics

over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tr Rise time of both SDA and SCL signals VCC = 3.3 V 300 ns
tf Fall time of both SDA and SCL signals 300 ns
tHIGH Pulse duration, SCL high 0.6 μs
tLOW Pulse duration, SCL low 1.3 μs
tSU1 Setup time, SDA to SCL 100 ns
tST, STA Setup time, SCL to start condition 0.6 μs
tHD,STA Hold time, start condition to SCL 0.6 μs
tST,STO Setup time, SCL to stop condition 0.6 μs
t(BUF) Bus free time between stop and start condition 1.3 μs
tPLH1 Propagation delay time, low-to-high-level output Source to sink: 100kbps pattern; Cb(Sink) = 400 pF(1); see Figure 20 360 ns
tPHL1 Propagation delay time, high-to-low-level output 230 ns
tPLH2 Propagation delay time, low-to-high-level output Sink to source: 100kbps pattern; Cb(Source) = 100 pF(1); see Figure 21 250 ns
tPHL2 Propagation delay time, high-to-low-level output 200 ns
(1) Cb = total capacitance of one bus line in pF.

6.13 Typical Characteristics

TMDS181 TMDS181I D001_SLASE75.gif
Figure 3. Current vs Data Rate Redriver Mode
TMDS181 TMDS181I D003_SLASE75.gif
Figure 5. VSADJ vs VOD
TMDS181 TMDS181I D002_SLASE75.gif
Figure 4. Current vs Data Rate Retimer Mode

7 Parameter Measurement Information

TMDS181 TMDS181I tim_TMDS_main_link_LASE75.gif Figure 6. TMDS Main Link Test Circuit
TMDS181 TMDS181I tim_io_LASE75.gif Figure 7. Input/Output Timing Measurements
TMDS181 TMDS181I tim_TMDS_output_LASE75.gif Figure 8. TMDS Output Skew Measurements
TMDS181 TMDS181I tim_HDMI_LASE75.gif Figure 9. HDMI/DVI TMDS Output Common Mode Measurement
TMDS181 TMDS181I tim_output_pre-emp_LASE75.gif Figure 10. Output Differential Waveform
TMDS181 TMDS181I PRE_SEL_L_lase75.gif Figure 11. Output De-Emphasis Waveform
TMDS181 TMDS181I HDMI_output_LASE75.gif
A. The FR4 trace between TTP1 and TTP2 is designed to emulate 1 to 8 inches of FR4, AC coupling capacitor, connector, and another 1 to 8 inches of FR4. Trace width = 4 mils. 100-Ω differential impedance.
B. All jitter is measured at a BER of 10-9
C. Residual jitter reflects the total jitter measured at TTP4 minus the jitter measured at TTP1
D. AVCC = 3.3 V
E. RT = 50 Ω,
F. The input signal from parallel Bert does not have any pre-emphasis. Refer to Recommended Operating Conditions.
Figure 12. HDMI Output Jitter Measurement
TMDS181 TMDS181I input_eyemask_LASE75.gif Figure 13. Input Eye Mask Post EQ – TTP2_EQ
TMDS181 TMDS181I output_eyemask_LASE75.gif
A. See Table 1.
Figure 14. Output Eye Mask at TTP4_EQ

Table 1. Output Eye Mask V and H Values

TMDS Data Rate (Gbps) H (Tbit) V (mV)
3.4 < DR < 3.712 0.6 335
3.712 < DR < 5.94 –0.0332Rbit2 +0.2312 Rbit + 0.1998 –19.66Rbit2 + 106.74Rbit + 209.58
5.94 ≤ DR ≤ 6.0 0.4 150
TMDS181 TMDS181I HPD_test_LASE75.gif Figure 15. HPD Test Circuit
TMDS181 TMDS181I tim_HPD_1_LASE75.gif Figure 16. HPD Timing Diagram 1
TMDS181 TMDS181I logic_disconnect_LASE75.gif Figure 17. HPD Logic Disconnect Timeout
TMDS181 TMDS181I start_stop_LASE75.gif Figure 18. START and STOP Condition Timing
TMDS181 TMDS181I tim_SCL_SDA_LASE75.gif Figure 19. SCL and SDA Timing
TMDS181 TMDS181I DDC_delay_source_LASE75.gif Figure 20. DDC Propagation Delay – Source to Sink
TMDS181 TMDS181I DDC_delay_sink_LASE75.gif Figure 21. DDC Propagation Delay – Sink to Source
TMDS181 TMDS181I ARC_output_LASE75.gif Figure 22. ARC Output
TMDS181 TMDS181I ARC_rise_fall_LASE75.gif Figure 23. Rise and Fall Time of ARC

8 Detailed Description

8.1 Overview

The TMDS181 is a DVI or HDMI™ retimer. The TMDS181 supports four TMDS channels, audio return channel (SPDIF_IN/ARC_OUT), hot plug detect, and DDC interfaces. The TMDS181 supports signaling rates up to 6 Gbps in retimer mode to allow for the highest resolutions of 4k2k60p 24 bits per pixel and up to WUXGA 16-bit color depth or 1080p with higher refresh rates. In redriver mode it supports HDMI1.4b with data rates up to 3.4 Gbps. The TMDS181 can be configured to support the HDMI2.0a standard which includes higher data rate, lower clock swing, and clock frequency. The TMDS181 can automatically configure itself as a redriver at low data rate (<1.0 Gbps) or as a retimer above this data rate. For passing compliance and reducing system-level design issues, several features are included such as TMDS output amplitude adjust using an external resistor on the VSADJ pin and source termination selection control. Device operation and configuration can be programmed by pin strapping or I2C. Four TMDS181s can be used on one I2C bus when I2C_EN enable and device address set by A0/A1.

To reduce active power, the TMDS181 supports dual power supply rails of 1.2 V on VDD and 3.3 V on VCC. There are several methods of power management, such as going into power-down mode using three methods:

  • HPD is low
  • Writing a 1 to register 09h[3]
  • De-asserting OE

De-asserting OE clears the I2C registers, thus once reasserted the device must be reprogrammed if I2C was used for device setup. Upon return to normal active operation from reasserted OE or reasserted HPD, the TMDS181 requires the source to write a 1 to the TMDS_CLOCK_RATIO_STATUS bit for the TMDS181 to resume 1/40th clock mode. The TMDS181 does not reset this bit based upon a DDC read transaction. The SIG_EN pin enables the signal detect circuit that provides an automatic power-management feature during normal operation. When no valid signal is present on the inputs, the device will enter standby mode. By disabling the detect circuit, the receiver block is always on. DDC bridge supports the HDMI2.0 SCDC communication, 100 Kbps data rate default and 400 kbps adjustable by software.

TMDS181 supports both fixed EQ gain control or adaptive equalization to compensate for different lengths of input cables or board traces. The EQ gain can be software adjusted by I2C control or selection between two fixed values or adaptive (Retimer Mode Only) equalization by pin strapping EQ_SEL pin. The customer can pull up or down TX_TERM_CTL through a 65 kΩ resistor to change the termination impedance for improved output performance when working in HDMI1.4b or leave it not connected. When not connected, the TMDS181 in conjunction with the rate detect automatically changes its output termination to meet HDMI1.4b or HDMI2.0a needs. For HDMI1.4b a transmitter termination of 150 Ω to 300 Ω is allowed for data rates above 2 Gbps to compensate for reflections. The automatic termination selection will configure the TMDS181 for this. It is important to note that there are times that this is not the best solution and no termination may be needed to pass compliance. For HDMI2.0a the 75 Ω to 150 Ω transmitter termination is required and the link will not work if this is not set.

The TMDS181 supports the audio return channel to support HDMI1.4b. To make implementation easier, the TMDS181 supports input pin swapping and input polarity swap. When swapping the input pins, IN_CLK and IN_D2 swap and IN_D1 and IN_D0 swap with each other. Swap works in both retimer and redriver mode. Polarity swap exchanges the N and P channel polarity in each input lane and is only available during retimer mode. Lane swap and polarity swap can be implemented at the same time in retimer mode.

Two temperature gradient versions of the device are available: extended commercial temperature range 0ºC to 85ºC (TMDS181) and industrial temperature range from –40ºC to 85ºC (TMDS181I).

8.2 Functional Block Diagram

TMDS181 TMDS181I fbd_LASE75.gif

8.3 Feature Description

8.3.1 Reset Implementation

When OE is de-asserted, control signal inputs are ignored; the HDMI inputs and outputs are high impedance. It is critical to transition the OE from a low level to a high level after the VCC supply has reached the minimum recommended operating voltage. Achieve this transition by a control signal to the OE input, or by an external capacitor connected between OE and GND. To ensure the TMDS181 is properly reset, the OE pin must be de-asserted for at least 100 μs before being asserted. When OE is reasserted, the TMDS181 must be reprogrammed if it was programmed by I2C and not pin strapping. When implementing the external capacitor, the size of the external capacitor depends on the power up ramp of the VCC supply, where a slower ramp-up results in a larger-value external capacitor. Refer to the latest reference schematic for TMDS181; consider approximately 200 nF capacitor as a reasonable first estimate for the size of the external capacitor. Figure 24 and Figure 25 show both OE implementations.

TMDS181 TMDS181I ext_cap_OE_LASE75.gif Figure 24. External Capacitor Controlled OE
TMDS181 TMDS181I OE_input_active_LASE75.gif Figure 25. OE Input from Active Controller

8.3.2 Operation Timing

TMDS181 starts to operate after the OE signal is properly set after power-up timing completes. See Figure 1, Figure 2, and Power-Up and Operation Timing Requirements. If OE is held low until VDD and VCC become stable, there is no rail sequence requirement.

8.3.3 Swap and Polarity Working

TMDS181 incorporates swap function, which can set the input lanes in swap mode. The IN_D2 routes to the OUT_CLK position. The IN_D1 swaps with IN_D0. The swap function only changes the input pins. The EQ setup follows the new mapping (see Figure 26). This function can be used with the SWAP/POL pin 1 and control the register 0x09h bit 7 for SWAP enable. Lane swap function works in both redriver and retimer mode.

The TMDS181 can also swap the input polarity signals. When SWAP/POL is high the n and p pins on each lane will swap. Polarity swap only works when in retimer mode. Take care when this function is enabled and the device is in automatic crossover mode between redriver and retimer modes. When the data rate drops to the redriver level, the polarity swap is lost.

Table 2. SWAP Function(1)

Normal Operation SWAP = L or CSR 0x09h bit 7 is 1’b1
IN_D2 → OUT_D2 IN_D2 → OUT_CLK
IN_D1 → OUT_D1 IN_D1 → OUT_D0
IN_D0 → OUT_D0 IN_D0 → OUT_D1
IN_CLK → OUT_CLK IN_CLK → OUT_D2
(1) The output lanes never change, only the input lanes change. See Figure 26.
TMDS181 TMDS181I swap_function_LASE75.gif Figure 26. TMDS181 Swap Function

8.3.4 TMDS Inputs

Standard TMDS terminations are integrated on all TMDS inputs. External terminations are not required. Each input data channel contains an adaptive or fixed equalizer to compensate for cable or board losses. The voltage at the TMDS input pins must be limited below the absolute maximum ratings. An unused input should not be connected to ground because this would result in excessive current flow damaging the device. An unused input channel can be externally biased to prevent output oscillation. The complementary input pin is recommended to be grounded through a 1 kΩ resistor and the other pin left open. The input pins can be polarity changed through the local I2C register when in retimer mode.

8.3.5 TMDS Inputs Debug Tools

There are two methods for debugging a system to make sure the inputs to the TMDS181 are valid. A TMDS error checker is implemented to provide a rough bit error rate per data lane. This allows the system implementer to determine how the link between the source and TMDS181 is performing on all three data lanes. See RX PATTERN VERIFIER CONTROL/STATUS Register.

If a high error count is evident, the TMDS181 has a way to view the general eye quality. A tool is available that uses the I2C link to download the data that can be plotted for an eye diagram. This is available per data lane. This tool also provides a method to turn on an internal PRBS generator that will transmit a data signal on the data pins. A clock at the proper frequency is required on the IN_CLK pins to generate the expected output data rate.

8.3.6 Receiver Equalizer

Equalizers are used to clean up inter-symbol interference (ISI) jitter or loss from the bandwidth-limited board traces and cables. TMDS181 supports fixed receiver equalizer (Retimer and Redriver Mode) and adaptive receiver equalizer (Retimer Mode) by setting the EQ_SEL/A0 pin or through I2C reg0Ah[5]. When EQ_SEL/A0 is high, the EQ gain is fixed to 14 dB and when set low ,the EQ gain is set to 7.5 dB. TMDS181 operates in adaptive equalizer mode when the EQ_SEL/A0 pin is left floating. The EQ gain is automatically adjusted based on the data rate to compensate for trace or cable loss. Various fixed EQ values can be set through local I2C control, reg0Dh[5:1]. The fixed EQ value can be programmed for both the data and clock. Adaptive equalization is the default setting.

TMDS181 TMDS181I gr_EQ_LLSEJ2.gif Figure 27. Adaptive EQ Gain Curve for >3.4 Gbps

8.3.7 Input Signal Detect Block

When SIG_EN is enabled, the TMDS looks for a valid TMDS clock signal input. The device is fully functional when a valid signal is detected. If no valid TMDS clock signal is detected, the device enters standby mode waiting for a valid signal at the clock input. The internal CDR is shut down and all of the TMDS outputs are in high-Z status. TMDS signal detect circuit can be set as enable by SIG_EN pin or through local I2C control but is default disabled. Implementer should activate this function in normal operation for power saving.

8.3.8 Audio Return Channel

The audio return channel in TMDS181 enables a TV, through a single HDMI cable, to send audio data upstream to an A/V receiver or surround audio controller, increasing user flexibility and eliminating the need for any separate S/PDIF audio connection. The TMDS181 supports single mode audio return channel. Customer can import the S/PDIF signal to SPDIF_IN and send out the signal from ARC_OUT and pass through the general HDMI cable to audio receiver. By I2C control, customer can disable ARC_OUT by register. Default enable after initialize.

8.3.9 Transmitter Impedance Control

HDMI2.0a standard requires a termination impedance in the 75 Ω to 150 Ω range for data rates >3.4 Gbps. Source termination is disabled at data rates <2 Gbps. When the data rate is between 2 Gbps and 3.4 Gbps, the output signal may be better if the termination value is between 150 Ω to 300 Ω, depending upon system implementation. It is important to note that there are times that this is not the best solution and no termination may be needed to pass compliance. TMDS181 supports three different source termination impedances for HDMI1.4b and HDMI2.0a. Pin 36, TX_TERM_CTL, offers a selection option to choose the output termination impedance value. This function can be programmed using I2C, reg0Bh[4:3] TX_TERM_CTL. For HDMI2.0a the 75 Ω to 150 Ω transmitter termination is required and the link will not work if this is not set.

Table 3. TX Termination Control

PIN 36 CONFIGURATION DESCRIPTION
TX_TERM_CTL = H The transmitter has no termination
TX_TERM_CTL = L The transmit termination impedance is approximately 75 Ω to 150 Ω to support HDMI2.0a
TX_TERM_CTL = NC Automatically selects the impedance
  • DR > 3.4 Gbps – 75 Ω to 150 Ω differential near end termination
  • 2 Gbps > DR < 3.4 Gbps – 150 Ω to 300 Ω differential near-end termination
  • DR < 2 Gbps – No termination

8.3.10 TMDS Outputs

A 1% precision resistor, 7.06 kΩ, is recommended to be connected from VSADJ pin to ground to allow the differential output swing to comply with TMDS signal levels. The differential output driver provides a typical 10 mA current sink capability, which provides a typical 500 mV voltage drop across a 50 Ω termination resistor.

TMDS181 TMDS181I TMDS_drv_termin_LASE75.gif Figure 28. TMDS Driver and Termination Circuit

Referring to Figure 28, if VCC (TMDS181 supply) and AVCC (sink termination supply) are both powered, the TMDS output signals are high impedance when OE = high. The normal operating condition is that both supplies are active. Refer to Figure 28, if VCC is on and AVCC is off, the TMDS outputs source a typical 5-mA current through each termination resistor to ground. A total of 33 mW of power is consumed by the terminations independent of the OEB logical selection. When AVCC is powered on, normal operation (OE controls output impedance) is resumed. When the power source of the device is off and the power source to termination is on, the IO(off) output leakage current specification ensures the leakage current is limited to 45 μA or less. The VOD of the clock and data lanes can be reduced through I2C. See Table 12 for details. Figure 3 shows the different output voltages based on the different VSADJ settings.

8.3.11 Pre-Emphasis/De-Emphasis

The TMDS181 provides de-emphasis as a way to compensate for ISI loss between the TMDS181 outputs to a TMDS receiver. There are two methods to implement this function. When in pin strapping mode the PRE_SEL pin controls this function. The PRE_SEL pin provides - 2 dB or 0 dB de-emphasis, which allows the output signal pre-conditioning to offset interconnect losses from the TMDS181 device to the TMDS receiver. De-emphasis is recommended to be set at 0 dB while connecting to a receiver through short PCB route. When pulled to ground though a 65 kΩ resistor - 2 dB can be realized, see Figure 11. When using I2C, reg0Ch[1:0] is used to make these adjustments.

As there are times that true pre-emphasis may be the best solution there are two ways to accomplish this. If pin strapping is being used the best method is to reduce the VSADJ resistor value thus increasing the VOD swing and then pulling the PRE_SEL pin to ground using the 65 kΩ resistor, see Figure 29. If using I2C there are two methods to accomplish this. The first is similar to pin strapping by reducing the VSADJ resistor value and then implementing - 2 dB de-emphasis. The second method is to set reg0Ch[7:5] = 011 and set reg0Ch[1:0] = 01 which will accomplish the same pre-emphasis setting, see Figure 30.

NOTE

De-emphasis is only implement able during retimer mode. In redriver mode this function is not available.

TMDS181 TMDS181I pre-emp_pin_strap_lase75.gif Figure 29. Output Pre-Emphasis Using Pin Strapping
TMDS181 TMDS181I pre_emp_I2C_lase75.gif Figure 30. Output Pre-Emphasis Using I2C

8.4 Device Functional Modes

8.4.1 Retimer Mode

Clock and data recovery circuits (CDR) are used to track, sample, and retime the equalized data bit streams. The CDRs are designed with a loop bandwidth to minimize the amount of jitter transfer from the video source to the TMDS outputs. Input jitter within the CDR’s PLL bandwidth, < 1 MHz will be transferred to the TMDS outputs. Higher frequency jitter above the CDR loop bandwidth is attenuated, providing a jitter cleaning function to reduce the amount of high frequency jitter from the video source. The retimer is automatically activated at pixel clock approximately above 100 MHz when jitter cleaning is needed for robust operation when this option is enabled (default). The retimer operates at about 1 Gbps to 6 Gbps DR.

When systems switch to higher data rates above 3.4 Gbps, the CDR operates at between 85 MHz to 150 MHz pixel clock (3.4+ to 6.0 Gbps), supporting up to 4K2K high resolution with a 60 Hz refresh rate, or 3D 1080p HDTV. At pixel clock below 100 MHz, the TMDS181 automatically bypasses the internal retimer and operates as a redriver. When the video source changes resolution, the internal retimer starts the acquisition process to determine the input clock frequency and acquire lock to new data bit streams. During the clock frequency detection period and the retimer acquisition period that last approximately 7 ms, the TMDS drivers can be kept active (default) or programmed to be disabled to avoid sending invalid clock or data to the downstream receiver. The TMDS181 can be configured to work as a redriver (full range), crossover (redriver-retimer), and retimer (full range).

8.4.2 Redriver Mode

The TMDS181 also has a redriver mode that can be enabled through I2C, at reg0Ah[1:0] DEV_FUNC_MODE, which compensates for ISI channel loss. In this mode, power is reduced as the CDR and PLL are turned off. When in automatic mode, the TMDS181 is in redriver mode for data rates <1.0 Gbps. By using I2C, the device can be put in redriver mode for the complete data range of 250 Mbps to 3.4 Gbps. This is done by writing a 00 to register 0Ah[1:0]. If the link has excessive random jitter, then retimer mode is the best operating mode. When in redriver mode, the device only compensates for ISI loss. When in redriver mode compliance is not guaranteed as skew compensation and retiming functions are disabled. If a significant amount of random jitter is present, the system may not pass compliance at the connector.

8.4.3 DDC Training for HDMI2.0a Data Rate Monitor

As part of discovery, the source reads the sink’s E-EDID information to understand the capabilities of the sink. Part of this read is HDMI Forum Vendor Specific Data Block (HF-VSDB) MAX_TMDS_Character_Rate byte to determine the data rate supported. Depending upon the value, the source writes to slave address 0xA8 offset 0x20 bit1, TMDS_CLOCK_RATIO_STATUS. The TMDS181 snoops this write to determine the TMDS clock ratio and thus sets its own TMDS_CLOCK_RATIO_STATUS bit accordingly. If a 1 is written, then the TMDS clock is set to 1/40th of TMDS bit period. If a 0 is written, then the TMDS clock is set to 1/10th of TMDS bit period. The TMDS181 defaults to 1/10th of TMDS bit period unless a 1 is written to address 0xA8 offset 0x20 bit 1. When HPD is deasserted, this bit is reset to default values. If the source does not write this bit, the TMDS181 will not be configured for TMDS clock 1/40th mode in support of HDMI2.0a. As the TMDS181 is in the system link, but not recognized as part of the link, it is possible that the source could read the sink EDID where this bit is set and does not rewrite this bit. If the TMDS181 has entered a power-down state, this bit is cleared and does not re-set on a read. To work properly, the bit has to be set again with a write by the source.

8.4.4 DDC Functional Description

The TMDS181 solves sink/source level issues by implementing a master/slave control mode for the DDC bus. When the TMDS181 detects the start condition on the DDC bus from the SDA_SRC/SCL_SRC, it will transfer the data or clock signal to the SDA_SNK/SCL_SNK with little propagation delay. When SDA_SNK detects the feedback from the downstream device, the TMDS181 will pull up or pull down the SDA_SRC bus and deliver the signal to the source.

The DDC link defaults to 100 kbps but can be set to various values including 400 kbps by setting the correct value to address 0Bh through the I2C interface. The DDC lines are 5 V tolerant when the device is powered off.

NOTE

The TMDS181 utilizes clock stretching for DDC transactions. As there are sources and sinks that do not perform this function correctly a system may not work correctly as DDC transactions are incorrectly transmitted/received. To overcome this a snoop configuration can be implemented where the SDA/SCL from the source is connected directly to the SDA/SCL sink. The TMDS181 will need its SDA_SNK and SCL_SNK pins connected to this link in order to correctly configure the TMDS_CLOCK_RATIO_STATUS bit. Care must be taken when this configuration is being implemented as the voltage levels for DDC between the source and sink may be different, 3.3 V vs 5 V; See Figure 35 and See Figure 36

8.4.5 Mode Selection Functional Description

Mode selection definition: This bit lets the receiver know where the device is located in a system for the purpose of centering the AEQ point. The TMDS181 is targeting sink applications, so the default value is 1, which will center the EQ at 12 to 13 dB depending upon TMDS_CLOCK_RATIO_STATUS value (see Equalization Control Register). If the TMDS181 is in a source application, the value should be changed to a value of 0, which centers the EQ at 6.5 to 7.5 dB depending upon the TMDS_CLOCK_RATIO_STATUS value.

8.5 Register Maps

8.5.1 Local I2C Overview

The TMDS181 local I2C interface is always enabled, but will only be able to overwrite pin strapped features when I2C_EN/PIN is high. The SCL_CTL and SDA_CTL terminals are used for I2C clock and data respectively. The TMDS181 I2C interface conforms to the two-wire serial interface defined by the I2C Bus Specification, Version 2.1 (January 2000), and supports the fast mode transfer up to 400 kbps.

The device address byte is the first byte received following the START condition from the master device. The 7-bit device address for TMDS181 decides by the combination of EQ_SEL/A0 and A1. Figure 31 clarifies the TMDS181 target address.

Figure 31. TMDS181 I2C Device Address Description
A1/A0 7 (MSB) 6 5 4 3 2 1 0 (W/R) HEX
00 1 0 1 1 1 1 0 0/1 BC/BD
01 1 0 1 1 1 0 1 0/1 BA/BB
10 1 0 1 1 1 0 0 0/1 B8/B9
11 1 0 1 1 0 1 1 0/1 B6/B7

The typical source application of the TMDS181 is as a retimer in a TV connecting the HDMI output connector and an internal HDMI transmit through flat cables. The register setup can adjust by source side. When TMDS181 is used in a sink side application, it receives data from input connector and transmits to receiver. Local I2C buses run at 400 kHz supporting fast-mode I2C operation.

The following procedure is used to write to the TMDS181 I2C registers:

  1. The master initiates a write operation by generating a start condition (S), followed by the TMDS181 7-bit address and a zero-value W/R bit to indicate a write cycle.
  2. The TMDS181 acknowledges the address cycle.
  3. The master presents the sub-address (I2C register within TMDS181) to be written, consisting of one byte of data, MSB-first.
  4. The TMDS181 acknowledges the sub-address cycle.
  5. The master presents the first byte of data to be written to the I2C register.
  6. The TMDS181 acknowledges the byte transfer.
  7. The master may continue presenting additional bytes of data to be written, with each byte transfer completing with an acknowledge from the TMDS181.
  8. The master terminates the write operation by generating a stop condition (P).

The following procedure is used to read the TMDS181 I2C registers.

  1. The master initiates a read operation by generating a start condition (S), followed by the TMDS181 7-bit address and a one-value W/R bit to indicate a read cycle.
  2. The TMDS181 acknowledges the address cycle.
  3. The TMDS181 transmits the contents of the memory registers MSB-first starting at register 00h.
  4. The TMDS181 waits for either an acknowledge (ACK) or a not-acknowledge (NACK) from the master after each byte transfer; the I2C master acknowledges reception of each data byte transfer.
  5. If an ACK is received, the TMDS181 transmits the next byte of data.
  6. The master terminates the read operation by generating a stop condition (P).

NOTE

Upon reset, the TMDS181 sub-address is always set to 0x00. When no sub-address is included in a read operation, the TMDS181 sub-address increments from the previous acknowledged read or write data byte. If it is required to read from a sub-address that is different from the TMDS181 internal sub-address, a write operation with only a sub-address specified is needed before performing the read operation.

Refer to Local I2C Control Bit Access TAG Convention for TMDS181 local I2C register descriptions. Reads from reserved fields not described return zeros, and writes are ignored.

8.5.2 Local I2C Control Bit Access TAG Convention

Reads from reserved fields return zero, and writes to read-only reserved registers are ignored. All addresses not defined by this specification are considered reserved. Reads from these addresses return zero and writes are ignored.

BIT ACCESS TAG CONVENTIONS

A table of bit descriptions is typically included for each register description that indicates the bit field name, field description, and the field access tags. Table 4 describes the field access tags.

Table 4. Field Access Tags

ACCESS TAG NAME DESCRIPTION
R Read The field will be read by software
W Write The field will be written by software
S Set The field will be set by a write of 1. Writes of 0 to the field have no effect
U Update Hardware may autonomously update this field

8.5.3 CSR Bit Field Definitions

8.5.3.1 ID Registers

Table 5. ID Registers Field Descriptions

ADDRESS BITS DESCRIPTION ACCESS
00h~07h 7:0 DEVICE_ID
These fields return a string of ASCII characters “TMDS181” followed by one space character.
TMDS181: Address 0x00 – 0x07 = {- 0x54”T”, 0x4D”M”, 0x44”D”, 0x53”S”, 0x31”1”, 0x38”8”, 0x31”1”, 0x20},
R
08h 7:0 REV _ID. This field identifies the device revision.
0000001 – TMDS181 revision 1
R

8.5.3.2 MISC CONTROL Register

Table 6. MISC CONTROL Register Field Descriptions

ADDRESS BITS DEFAULT DESCRIPTION ACCESS
09h 7 1’b0 LANE_SWAP. This field swaps the input lanes as per Figure 26.
0 – Disable (default) no lane swap
1 – Enable: Swaps input lanes (redriver and retimer mode)
Note: Field is loaded from SWAP/POL pin; Writes are ignored when I2C_EN/PIN = 0
RWU
6 1’b0 LANE_POLARITY swaps the input data and clock lanes polarity.
0 – Disabled (default) no polarity swap
1 – Swaps the input data and clock lane polarity (retimer mode only)
Note: Field is loaded from SWAP/POL pin; Writes are ignored when I2C_EN/PIN = 0
RWU
5 1’b0 Reserved R
4 1’b0 SIG_EN. This field enables the clock lane activity detect circuitry. (Redriver mode only because the retimer requires a clock input to work, so without a clock input, the device enters standby regardless)
0 – Disable (default) Clock detector circuit closed and receiver always works in normal operation.
1 – Enable, clock detector circuit makes the receiver automatically enter the standby state when no valid data detect.
Note: Field is loaded from SIG_EN pin; Writes are ignored when I2C_EN/PIN = 0
RWU
3 1’b0 PD_EN
0 – Normal working (default)
1 – Forced power down by I2C, lowest power state
RW
2 1’b0 HPD_AUTO_PWRDWN_DISABLE
0 – Automatically enters power-down mode based on HPD_SNK (default)
1 – Does not automatically enter power down mode
RW
1:0 2’b10 I2C_DR_CTL. I2C data rate supported for configuring device.
00 – 5 Kbps
01 – 10 Kbps
10 – 100 Kbps (default)
11 – 400 Kbps (Note: HPD_AUTO_PWRDWN_DISABLE must be set before enabling 400 Kbps mode)
RW
0Ah 7 1’b1 Application mode selection (see Device Functional Modes)
TMDS181
0 – Source
1 – Sink (default)
RW
6 1’b0 HPDSNK_GATE_EN. The field sets the functional relationship between HPD_SNK and HPD_SRC.
0 – HPD_SNK passed through to the HPD_SRC (default)
1 – HPD_SNK does not pass through to the HPD_SRC.
RW
5 1’b1 EQ_ADA_EN. This field enables the equalizer functioning state.
0 – Fixed EQ
1 – Adaptive EQ (default)
Writes are ignored when I2C_EN/PIN = 0
RWU
4 1’b1 EQ_EN. This field enables the equalizer.
0 -- EQ disable
1 – EQ enable (default)
Writes are ignored when I2C_EN/PIN = 0
RW
3 1’b0 Reserved R
2 1’b0 APPLY_RXTX_CHANGES, Self-clearing write-only bit.
Writing a 1 to this bit will apply new TX_TERM, HDMI_TWPST1, EQ_EN, EQ_ADA_EN, VSWING, Fixed EQ Value settings to the clock and data lanes. Writes to the respective registers do not take immediate effect.
This bit does not need to be written if I2C configuration occurs while HPD_SNK are low, I2CPD_EN = 1 or there is no HDMI clock applied and SIGN_EN is high.
W
1:0 2’b01 DEV_FUNC_MODE. This field selects the device working function mode.
00 – Redriver mode: 250 Mbps – 3.4 Gbps
01 – Automatic redriver to retimer crossover at 1.0 Gbps (default)
10 – Automatic retimer when HDMI2.0a based upon TMDS_CLOCK_RATIO_STATUS
11 – Retimer mode across full range 250 Mbps to 6 Gbps
When changing crossover point, need to toggle PD_EN or toggle external HPD_SNK.
RW
0Bh 7:5 3’b000 Reserved R
4:3 2'b00 TX_TERM_CTL. Controls termination for HDMI TX.
00 – No termination (default)
01 – 150 Ω to 300 Ω
10 – Reserved
11 – 75 Ω to 150 Ω
Note: Writes are ignored when I2C_EN/PIN = 0; reflects the value of TX_TERM_CTL pin.
RWU
2 1'b0 DDC_DR_SEL Defines the DDC output speed for DDC bridge
0 = 100 kbps (default)
1 = 400 kbps (Note: HPD_AUTO_PWRDWN_DISABLE must be set before enabling 400 Kbps mode)
RW
1 1'b0 TMDS_CLOCK_RATIO_STATUS. This field is updated from snoop of DDC write to slave address 0xA8 offset 0x20 bit 1 that occurred on the SDA_SRC/SCL_SRC interface. When bit 1 of address 0xA8 offset 0x20 in the SCDC register set is written to a 1’b1, then this field will be set to a 1’b1. When bit 1 of address 0xA8 offset 0x20 is written to a 1’b0, then this field will be set to a 1’b0. This field is reset to default value whenever HPD_SNK is de-asserted for greater than 2 ms.
0 – TMDS Clock is 1/10 of TMDS bit period (default)
1 – TMDS Clock is 1/40 of TMDS bit period
RWU
0 1'b0 DDC_TRAIN_SETDISABLE; This field indicate the DDC training block function status. If disabled the device will only work in HDMI1.x or DVI modes.
0 – DDC training enable (default)
1 – DDC training disable
Note: To force TMDS_CLOCK_RATIO_STATUS to 1 this register bit must be set to 1 which will force the 1/40 mode for HDMI2.0
RW
0Ch 7:5 3’b000 VSWING_DATA: Data output swing control
000 – Vsadj set (default)
001 – Increase by 7%
010 – Increase by 14%
011 – Increase by 21%
100 – Decrease by 30%
101 – Decrease by 21%
110 – Decrease by 14%
111 – Decrease by 7%
RW
4:2 3’b000 VSWING_CLK: Clock output swing control: Default is set by Vsadj resistor value and the value of reg_0Dh[0].
000 – Vsadj (default)
001 – Increase by 7%
010 – Increase by 14%
011 – Increase by 21%
100 – Decrease by 30%
101 – Decrease by 21%
110 – Decrease by 14%
111 – Decrease by 7%
RW
1:0 2’b00 HDMI_TWPST1[1:0]. HDMI de-emphasis FIR post-cursor-1 signed tap weight. (Retimer Mode Only)
00 – No de-emphasis (default)
01 – 2 dB de-emphasis
10 – Reserved
11 – Reserved
Note: Reflects value of PRE_SEL pin; Writes are ignored when I2C_EN/PIN = 0
RWU

8.5.3.3 Equalization Control Register

Table 7. Equalization Control Register Field Descriptions

ADDRESS BITS DEFAULT DESCRIPTION ACCESS
0Dh 7:6 2’b00 Reserved R
5:3 1’b000 Data lane EQ – Sets fixed EQ values RW
HDMI1.x HDMI2.0a
000 – 0 dB (default) 000 – 0 dB (default)
001 – 4.5 dB 001 – 3 dB
010 – 6.5 dB 010 – 5 dB
011 – 8.5 dB 011 – 7.5 dB
100 – 10.5 dB 100 – 9.5 dB
101 – 12 dB 101 – 11 dB
110 – 14 dB 110 – 13 dB
111 – 16.5 dB 111 – 14.5 dB
2:1 1’b00 Clock lane EQ - Sets fixed EQ values RW
HDMI1.x HDMI2.0a
00 – 0 dB (default) 00 – 0 dB (default)
01 – 1.5 dB 01 – 1.5 dB
10 – 3 dB 10 – 3 dB
11 – RSVD 11 – 4.5 dB
0 1’b0 DIS_HDMI2_SWG:
0 – Clock VOD is half of set values when TMDS_CLOCK_RATIO_STATUS states in HDMI2.0a mode (default)
1 – Disables TMDS_CLOCK_RATIO_STATUS control of the clock VOD so output swing is at full swing.
RW

8.5.3.4 RX PATTERN VERIFIER CONTROL/STATUS Register

Table 8. RX PATTERN VERIFIER CONTROL/STATUS Register Field Description(1)

ADDRESS BITS DEFAULT DESCRIPTION ACCESS
0Eh 7:4 4’b0000 PV_SYNC[3:0]. Pattern timing pulse. This field is updated for 8UI once every cycle of the PRBS generator. 1 bit per lane. R
3:0 4’b0000 PV_LD[3:0]. Load pattern-verifier controls into RX lanes. When asserted high, the PV_TO, PV_SEL, PV_LEN, PV_CP20, and PV_CP values are enabled into the corresponding RX lane. These values are then latched and held when PV_LD[n] is subsequently deasserted low. 1 bit per lane. RWU
0Fh 7:4 4’b0000 PV_FAIL[3:0]. Pattern verification mismatch detected. 1 bit per lane. RU
3:0 4’b0000 PV_TIP[3:0]. Pattern search/training in progress. 1 bit per lane. RU
10h 7 1’b0 PV_CP20. Customer pattern length 20/16 bits.
0 – 16 bits (default)
1 – 20 bits
RW
6 1’b0 Reserved R
5:3 3’b000 PV_LEN[2:0]. PRBS pattern length
000 – PRBS7 (default)
001 – PRBS11
010 – PRBS23
011 – PRBS31
100 – PRBS15
101 – PRBS15
110 – PRBS20
111 – PRBS20
RW
2:0 3’b000 PV_SEL[24:0]. Pattern select control
000 – Disabled (default)
001 – PRBS
010 - Clock
011 - Custom
1xx – Timing only mode with sync pulse spacing defined by PV_LEN
RW
11h 7:0 ‘h00 PV_CP[7:0]. Custom pattern data. RW
12h 7:0 ‘h00 PV_CP[15:8]. Custom pattern data. RW
13h 7:4 4’b0000 Reserved R
3:0 4’b0000 PV_CP[19:16]. Custom pattern data. Used when PV_CP20 = 1’b1. RW
14h 7:3 5’b00000 Reserved R
2:0 3’b000 PV_THR[2:0]. Pattern-verifier retain threshold. RW
15h 7 1’b0 DESKEW_CMPLT. Indicates that TMDS lane deskew has completed when high. R
6:5 2’b00 Reserved R
4 1’b0 BERT_CLR. Clear BERT counter (on rising edge). RSU
3 1’b0 TST_INTQ_CLR. Clear latched interrupt flag. RSU
2:0 3’b000 TST_SEL[2:0]. Test interrupt source select. RW
16h 7:4 4’b0000 PV_DP_EN[3:0]. Enable datapath verified based on DP_TST_SEL, 1 bit per lane. RW
3 1’b0 Reserved R
2:0 3’b000 DP_TST_SEL[2:0] Selects pattern reported by BERT_CNT[11:0], TST_INT[0] and TST_INTQ[0] and PV_DP_EN is non-zero.
000 – TMDS disparity or data errors (default)
001 – FIFO errors
010 – FIFO overflow errors
011 – FIFO underflow errors
100 – TMDS deskew status
101,110,111 – Reserved
RW
17h 7:4 4’b0000 TST_INTQ[3:0]. Latched interrupt flag. 1 bit per lane. RU
3:0 4’b0000 TST_INT[3:0]. Test interrupt flag. 1 bit per lane. RU
18h 7:0 ‘h00 BERT_CNT[7:0]. BERT error count. Lane 0 RU
19h 7:4 4’b0000 Reserved R
3:0 4’b0000 BERT_CNT[11:8]. BERT error count. Lane 0 RU
1Ah 7:0 ‘h00 BERT_CNT[19:12]. BERT error count. Lane 1 RU
1Bh 7:4 4’b0000 Reserved R
3:0 4’b0000 BERT_CNT[23:20]. BERT error count. Lane 1 RU
1Ch 7:0 ‘h00 BERT_CNT[31:24]. BERT error count. Lane 2 RU
1Dh 7:4 4’b0000 Reserved R
3:0 4’b0000 BERT_CNT[35:32]. BERT error count. Lane 2 RU
1Eh 7:0 ‘h00 BERT_CNT[19:12]. BERT error count. Lane 3 RU
7:4 4’b0000 Reserved R
1Fh 3:0 ‘h00 BERT_CNT[23:20]. BERT error count. Lane 3 RU
20h 7 1’b0 Power Down Status Bit.
0 – Normal Operation (default)
1 – Device in Power Down Mode
R
6 1’b0 Standy Status Bit.
0 – Normal Operation (default)
1 – Device in Standby Mode
R
5:0 6’b000000 Reserved R
(1) If PV_DP_EN is used to monitor TMDS data path errors the counters for lanes 0, 1, 2, and 3 are ignored.

 

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