ZHCSBG2B May   2013  – February 2019 ADS8860

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      ADC 电源无需独立的 LDO
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: 3-Wire Operation
    7. 7.7 Timing Requirements: 4-Wire Operation
    8. 7.8 Timing Requirements: Daisy-Chain
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Equivalent Circuits
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Reference
      3. 9.3.3 Clock
      4. 9.3.4 ADC Transfer Function
    4. 9.4 Device Functional Modes
      1. 9.4.1 CS Mode
        1. 9.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 9.4.1.2 3-Wire CS Mode With a Busy Indicator
        3. 9.4.1.3 4-Wire CS Mode Without a Busy Indicator
        4. 9.4.1.4 4-Wire CS Mode With a Busy Indicator
      2. 9.4.2 Daisy-Chain Mode
        1. 9.4.2.1 Daisy-Chain Mode Without a Busy Indicator
        2. 9.4.2.2 Daisy-Chain Mode With a Busy Indicator
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 Charge-Kickback Filter
    2. 10.2 Typical Applications
      1. 10.2.1 DAQ Circuit for a 1-µs, Full-Scale Step Response
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 DAQ Circuit for Lowest Distortion and Noise Performance at 1 MSPS
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
      3. 10.2.3 Ultralow-Power DAQ Circuit at 10 kSPS
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Power Saving
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14机械、封装和可订购信息

特性

  • 采样率:1MHz
  • 无延迟输出
  • 单极单端输入电压范围:
    0V 至 +VREF
  • SPI™- 兼容串行接口,此接口具有
    菊链式选项
  • 出色的交流和直流性能:
    • SNR:93dB,THD:–108dB
    • INL:±1.0LSB(典型值),±2.0 LSB(最大值)
    • DNL:±1.0LSB(最大值)、16 位 NMC
  • 宽工作电压范围:
    • AVDD:2.7V 至 3.6V
    • DVDD:1.65V 至 3.6V
      (不受 AVDD 影响)
    • REF:2.5V 至 5V(不受 AVDD 影响)
    • 工作温度:-40°C 至 +85°C
  • 低功率耗散:
    • 1MSPS 时为 5.5mW
    • 100kSPS 时为 0.55mW
    • 10kSPS 时为 55µW
  • 关断电流 (AVDD):50nA
  • 满标度步进趋稳至 16 位:290ns
  • 封装:VSSOP-10 和 VSON-10