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  • CC2652R7 SimpleLink™ Wireless MCU Device Revision B

    • SWRZ110A May   2021  – January 2022 CC2652R7

       

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  • CC2652R7 SimpleLink™ Wireless MCU Device Revision B
  1.   Trademarks
  2. 1Advisories Matrix
  3. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support-Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  4. 3Advisories
    1.     Power_03
    2.     PKA_01
    3.     PKA_02
    4.     I2C_01
    5.     I2S_01
    6.     CPU_01
    7.     CPU_02
    8.     CPU_03
    9.     CPU_Sys_01
    10.     Sys_01
    11. 3.1 Sys_05
    12.     SYSCTRL_01
    13.     ADC_01
    14.     ADC_02
    15.     ADC_03
  5. 4Revision History
  6. IMPORTANT NOTICE
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ERRATA

CC2652R7 SimpleLink™ Wireless MCU Device Revision B

Trademarks

SimpleLink and Texas Instruments are trademarks of Texas Instruments.

Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries).

All trademarks are the property of their respective owners.

1 Advisories Matrix

Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.

Table 1-1 Advisories Matrix
MODULE DESCRIPTION SILICON REVISIONS AFFECTED
B
Power Advisory Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled Yes
PKA Advisory PKA_01 — Public key accelerator (PKA) interrupt line is always high when module is enabled and PKA is idle Yes
PKA Advisory PKA_02 — Public key accelerator (PKA) RAM is not byte accessible Yes
I2C Advisory I2C_01 — I2C module master status bit is set late Yes
I2S Advisory I2S_01 — I2S bus faults are not reported Yes
CPU Advisory CPU_01 — Arm® Errata #838869: Store immediate overlapping exception return operation might vector to incorrect interrupt Yes
CPU Advisory CPU_02 — Arm® Errata #752770: Interrupted loads to SP can cause erroneous behavior Yes
CPU Advisory CPU_03 — Arm® Errata #776924 VDIV or VSQRT instructions might not complete correctly when very short ISRs are used Yes
CPU, System Advisory CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48-MHz clock Yes
System Advisory Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown Yes
System Advisory Sys_05 — Elevated power-on-reset (POR) threshold voltage at low temperatures Yes
System Controller Advisory SYSCTRL_01 — Resets occurring in a specific 2-MHz period during initial power up are incorrectly reported Yes
SRAM Advisory SRAM_01 — Reserved addresses within SRAM_MMR region alias into SRAM array Yes
General-Purpose Timer Advisory GPTM_01 — An incorrect value might be written to the general-purpose (GP) timers MMRs (memory mapped registers) when simultaneously accessing the PKA (public key accelerator) engine and/or the AES (advanced encryption standard) engine from a different master Yes
ADC Advisory ADC_01 — Periodic ADC trigger at 200 kHz rate can be ignored when XOSC_HF is turned on or off Yes
ADC Advisory ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter Yes
ADC Advisory ADC_03 — Software can hang when reading the ADC FIFO if a single manual ADC trigger is generated immediately after the ADC is enabled Yes

2 Nomenclature, Package Symbolization, and Revision Identification

2.1 Device and Development Support-Tool Nomenclature

To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC2652R7). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

2.2 Devices Supported

This document supports the following device:

  • CC2652R7

 

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