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  • CC2642R SimpleLink™ Wireless MCU Device Revision E/F

    • SWRZ079D january   2018  – june 2023 CC2642R

       

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  • CC2642R SimpleLink™ Wireless MCU Device Revision E/F
  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Advisories Matrix
  5. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support-Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  6. 3Advisories
    1.     Radio_03
    2.     Power_03
    3.     PKA_01
    4.     PKA_02
    5.     I2C_01
    6.     I2S_01
    7.     CPU_01
    8.     CPU_02
    9.     CPU_03
    10.     CPU_Sys_01
    11.     Sys_01
    12.     Advisory Sys_05
    13.     SYSCTRL_01
    14.     SRAM_01
    15.     GPTM_01
    16.     ADC_01
    17.     ADC_02
    18.     ADC_03
    19.     ADC_04
    20.     ADC_05
  7. 4Revision History
  8. IMPORTANT NOTICE
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Errata

CC2642R SimpleLink™ Wireless MCU Device Revision E/F

Abstract

This document describes the known exceptions to functional specifications (advisories) to the CC2642RSimpleLink™ device.

Trademarks

SimpleLink™ and Texas Instruments™ are trademarks of Texas Instruments.

Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries).

All trademarks are the property of their respective owners.

1 Advisories Matrix

Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.

Table 1-1 Advisories Matrix
MODULE DESCRIPTION SILICON REVISIONS AFFECTED
E/F
Radio Advisory Radio_03 — LE 2M PHY Sensitivity vs Selectivity Yes
Power Advisory Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled Yes
PKA Advisory PKA_01 — Public key accelerator (PKA) interrupt line is always high when module is enabled and PKA is idle Yes
PKA Advisory PKA_02 — Public key accelerator (PKA) RAM is not byte accessible Yes
I2C Advisory I2C_01 — I2C module master status bit is set late Yes
I2S Advisory I2S_01 — I2S bus faults are not reported Yes
CPU Advisory CPU_01 — Arm® Errata #838869: Store immediate overlapping exception return operation might vector to incorrect interrupt Yes
CPU Advisory CPU_02 — Arm® Errata #752770: Interrupted loads to SP can cause erroneous behavior Yes
CPU Advisory CPU_03 — Arm® Errata #776924 VDIV or VSQRT instructions might not complete correctly when very short ISRs are used Yes
CPU, System Advisory CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48-MHz clock Yes
System Advisory Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown Yes
System Advisory Sys_05 — Elevated power-on-reset (POR) threshold voltage at low operating temperatures. Yes
System Controller Advisory SYSCTRL_01 — Resets occurring in a specific 2-MHz period during initial power up are incorrectly reported Yes
SRAM Advisory SRAM_01 — Reserved addresses within SRAM_MMR region alias into SRAM array Yes
General-Purpose Timer Advisory GPTM_01 — An incorrect value might be written to the general-purpose (GP) timers MMRs (memory mapped registers) when simultaneously accessing the PKA (public key accelerator) engine and/or the AES (advanced encryption standard) engine from a different master Yes
ADC Advisory ADC_01 — Periodic ADC trigger at 200 kHz rate can be ignored when XOSC_HF is turned on or off Yes
ADC Advisory ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter Yes
ADC Advisory ADC_03 — Software can hang when reading the ADC FIFO if a single manual ADC trigger is generated immediately after the ADC is enabled Yes
ADC Advisory ADC_04 — Misbehaving ADC FIFO status flags in the AUX_ANAIF:ADCFIFOSTAT register (OVERFLOW, FULL, ALMOST_FULL, and EMPTY) Yes
ADC Advisory ADC_05 — Writing any value to AUX_ANAIF:ADCTRIG.START will create an ADC trigger Yes

2 Nomenclature, Package Symbolization, and Revision Identification

2.1 Device and Development Support-Tool Nomenclature

To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC2642R). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

2.2 Devices Supported

This document supports the following device:

  • CC2642R

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

GUID-20220209-SS0I-FPGN-T2CM-XDKPWZBS6GKF-low.svg Figure 2-1 Package Symbolization for Silicon Revision E/F
Table 2-1 Revision Identification
DEVICE REVISION CODE SILICON REVISION
E PG2.1 (see following NOTE)
F PG3.0 (see following NOTE)
Note:
  • PG2.1 and PG3.0 are functionally equivalent and share the same data sheet specifications.
  • PG3.0 was introduced to support the release into additional wafer fab sites.

3 Advisories

Radio_03

LE 2M PHY Sensitivity vs Selectivity

Revisions Affected:

Revision: F and earlier

Details:

Some devices operating using the Bluetooth Low Energy 2 Mbps (LE 2M) data rate may experience increased Packet Error Rate (PER) for receiver RSSI input levels centered around -70 dBm with a narrow window of +/- 5dB.

Workaround:

Updated radio settings are provided starting with the SimpleLink CC13xx_26xx SDK v5.40.00 and are applied by default. These settings improve sensitivity while resulting in up to 4 dB degradation in selectivity.

To minimize potential PER impact, it is recommended to leverage the updated radio settings made default in the SimpleLink CC13xx_26xx SDK v5.40.00 and later SDKs. If the LE 2M PHY is not used, it is not required to use these settings and SDK migration is not required. For applications configured to use the LE 2M PHY, migration to the latest SDK to leverage these settings is recommended.

Power_03

Increased voltage ripple at low supply voltages when DC/DC converter is enabled

Revisions Affected:

Revision F and earlier

Details:

At supply voltages <2.0V, a hardware control module disables the DC/DC converter to maximize system efficiency. This module does not have enough hysteresis, causing approx 10 mV of ripple on the VDDR regulated power supply. Based on internal testing of the device, it is not anticipated that this erratum affects RF performance. However, these test results cannot ensure that a customer’s application or end equipment will not be affected.

Workaround:

Use the TI-provided Power driver (PowerCC26X2.c) which automatically disables the DC/DC converter when supply voltage is <2.2V.

The workaround is available in all SDK versions.

PKA_01

Public key accelerator (PKA) interrupt line is always high when module is enabled and PKA is idle

Revisions Affected:

Revision F and earlier

Details:

When the PKA module is enabled and idle, the interrupt line is always high and the interrupt can thus not be used as is.

Workaround:

The workaround is to disable the PKA interrupt in the interrupt service routine while the PKA module is idle and re-enable the interrupt right after starting an operation.

The workaround is implemented in the TI-provided cryptography drivers (ECDHCC26X2.c, ECDSACC26X2.c, ECJPAKECC26X2.c_list.c) in the following SimpleLink software development kit (SDK) versions:

  • SimpleLink CC26x2 SDK 1.60.00.xx and later

 

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