CC1352P SimpleLink™ Wireless MCU Device Revision E

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1 Advisories Matrix

Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.

Table 1-1 Advisories Matrix

MODULE	DESCRIPTION	SILICON REVISIONS AFFECTED
MODULE	DESCRIPTION	E
Radio	Advisory Radio_01 — Proprietary radio modes: spurious emissions can affect regulatory compliance	Yes
Radio	Advisory Radio_02 — High-power PA operation at temperatures below -20°C may affect the 32-kHz crystal oscillator	Yes
Power	Advisory Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled	Yes
PKA	Advisory PKA_01 — Public key accelerator (PKA) interrupt line is always high when module is enabled and PKA is idle	Yes
PKA	Advisory PKA_02 — Public key accelerator (PKA) RAM is not byte accessible	Yes
I2C	Advisory I2C_01 — I²C module master status bit is set late	Yes
I2S	Advisory I2S_01 — I²S bus faults are not reported	Yes
CPU	Advisory CPU_01 — Arm® Errata #838869: Store immediate overlapping exception return operation might vector to incorrect interrupt	Yes
CPU	Advisory CPU_02 — Arm® Errata #752770: Interrupted loads to SP can cause erroneous behavior	Yes
CPU	Advisory CPU_03 — Arm® Errata #776924 VDIV or VSQRT instructions might not complete correctly when very short ISRs are used	Yes
CPU, System	Advisory CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48-MHz clock	Yes
System	Advisory Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown	Yes
System Controller	Advisory SYSCTRL_01 — Resets occurring in a specific 2-MHz period during initial power up are incorrectly reported	Yes
IO Controller	Advisory IOC_01 — Limited number of DIOs available for the bootloader backdoor	Yes
SRAM	Advisory SRAM_01 — Reserved addresses within SRAM_MMR region alias into SRAM array	Yes
General-Purpose Timer	Advisory GPTM_01 — An incorrect value might be written to the general-purpose (GP) timers MMRs (memory mapped registers) when simultaneously accessing the PKA (public key accelerator) engine and/or the AES (advanced encryption standard) engine from a different master	Yes
ADC	Advisory ADC_01 — Periodic ADC trigger at 200 kHz rate can be ignored when XOSC_HF is turned on or off	Yes
ADC	Advisory ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter	Yes
ADC	Advisory ADC_03 — Software can hang when reading the ADC FIFO if a single manual ADC trigger is generated immediately after the ADC is enabled	Yes
ADC	Advisory ADC_04 — Misbehaving ADC FIFO status flags in the AUX_ANAIF:ADCFIFOSTAT register (OVERFLOW, FULL, ALMOST_FULL, and EMPTY)	Yes
ADC	Advisory ADC_05 — Writing any value to AUX_ANAIF:ADCTRIG.START will create an ADC trigger	Yes

2 Nomenclature, Package Symbolization, and Revision Identification

2.1 Device and Development Support-Tool Nomenclature

To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC1352P). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.

null

Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX

Development-support product that has not yet completed Texas Instruments internal qualification testing.

TMDS

Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

2.2 Devices Supported

This document supports the following device:

CC1352P

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

Figure 2-1 Package Symbolization for Silicon Revision E

Table 2-1 Revision Identification

DEVICE REVISION CODE	SILICON REVISION
E	PG2.1

3 Advisories

Radio_01

Proprietary radio modes: spurious emissions can affect regulatory compliance

Revisions Affected:

Revision E and earlier

Details:

When device internal load capacitors are used with the external 48-MHz crystal, energy couples from the crystal oscillator circuit to the RF output. This coupling causes spurious emissions at N × 48 MHz from carrier frequency. This includes, but is not limited to, the frequency bands supported by the device covered by the following regulations:

When using the +14-dBm RF power amplifier

ARIB T-108 (Japan)

When using the +20-dBm RF power amplifier

470- to 510-MHz (China) Band
FCC CFR47 Part 15 (US)
ETSI EN 300 220 (Europe)
ETSI EN 300 328 (Europe)
ETSI EN 300 440 (Europe)

Workaround:

For compliance with affected standards, external load capacitors might be needed for the 48-MHz crystal to reduce spurious emissions. Internal capacitors (default 7-pF connected capacitance) must then be disconnected internally.

This workaround is implemented by defining the following symbols in the included customer configuration file (ccfg.c) available in all Software Development Kit (SDK) examples:
#define SET_CCFG_MODE_CONF_XOSC_CAPARRAY_DELTA -128
#define SET_CCFG_MODE_CONF_XOSC_CAP_MOD 0